Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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03/15/1990 | DE3828597A1 Method of changing process parameters in pulse soldering |
03/14/1990 | EP0358504A2 Electrical components |
03/14/1990 | EP0358480A2 Process for producing multilayer printed wiring board |
03/14/1990 | EP0358375A1 Platinum or platinum alloy plating bath |
03/14/1990 | EP0358332A2 Circuit board and method of soldering |
03/14/1990 | EP0358232A2 Methods of preparing molded thermoplastic articles |
03/14/1990 | EP0357977A2 Soldering device with at least one stirrup electrode heated by electric thermal resistance |
03/14/1990 | EP0357961A2 Method and apparatus for boring holes into a printing platen |
03/14/1990 | EP0357918A1 Process for depositing adherent silver films |
03/14/1990 | EP0357769A1 Vernier structure for flip chip bonded devices |
03/14/1990 | CN1007205B Method for producing multiplayer printed-wiring foard containing metal core |
03/13/1990 | US4908871 Pattern inspection system |
03/13/1990 | US4908740 Integral composite structure with predetermined electrically conductive networks and method for producing same |
03/13/1990 | US4908736 Self packaging chip mount |
03/13/1990 | US4908735 Electronic apparatus reducing generation of electro magnetic interference |
03/13/1990 | US4908696 Connector and semiconductor device packages employing the same |
03/13/1990 | US4908689 Organic solder barrier |
03/13/1990 | US4908590 Chip-like LC filter |
03/13/1990 | US4908586 Compact encapsulated filter assembly for printed circuit boards and method of manufacture thereof |
03/13/1990 | US4908337 Foil for soldering the terminals of an electronic component |
03/13/1990 | US4908336 Flexible circuit and connector assembly |
03/13/1990 | US4908296 Photosensitive semi-aqueous developable ceramic coating composition |
03/13/1990 | US4908259 Molded article with partial metal plating and a process for producing such article |
03/13/1990 | US4908258 High dielectric constant flexible sheet material |
03/13/1990 | US4908242 Using solution comprising copper ions and reducing agent with constantly controlled ratio of concentration of anodic and cathodic reagents |
03/13/1990 | US4908094 Roughening silicon-containing first surface of one member with oxygen-containing plasma, pressing the roughened surface together with first surface of other member |
03/13/1990 | US4908087 Method of forming a multilayer printed circuit board and apparatus therefor |
03/13/1990 | US4907991 Connective jumper |
03/13/1990 | US4907978 Self-retaining connector |
03/13/1990 | US4907975 Electrical connector utilizing flexible electrical circuitry |
03/13/1990 | US4907734 Method of bonding gold or gold alloy wire to lead tin solder |
03/13/1990 | CA1266592A1 Metallized polymers |
03/08/1990 | WO1990002406A1 Process for making noble metal coated metallic particles, and resulting conductive materials |
03/08/1990 | DE3829117A1 Metal core printed circuit board |
03/07/1990 | EP0357307A2 Printed-wiring board |
03/07/1990 | EP0357124A2 Method of selectively providing a metal from the liquid phase on a substrate by means of a laser |
03/07/1990 | EP0357088A2 Multilayer wiring substrate |
03/07/1990 | EP0357063A2 Photosensitive ceramic coating composition |
03/07/1990 | EP0356899A2 Method and apparatus for mounting electronic device on a printed circuit board |
03/07/1990 | EP0356887A2 Method to selectively direct electromagnetic rays onto a given part of an object |
03/07/1990 | EP0356717A2 Supporting table for printed-circuit board drill units |
03/07/1990 | EP0356678A1 Process for producing a solder coating on a metallized ceramic article |
03/07/1990 | CN2054214U Electric connection fitting with pressure applying parts |
03/07/1990 | CN1040298A Resistive metal layers and method for making same |
03/07/1990 | CN1040198A Photopolymerization sensitizers active at longer wavelengths |
03/07/1990 | CN1040184A Stabilized hydrogen peroxide compositions |
03/07/1990 | CN1040183A Hydrogen peroxide compositions contg. substd. oxybenzene compound |
03/06/1990 | US4907128 Chip to multilevel circuit board bonding |
03/06/1990 | US4906957 Electrical circuit interconnect system |
03/06/1990 | US4906823 Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same |
03/06/1990 | US4906803 Flexible supporting cable for an electronic device and method of making same |
03/06/1990 | US4906802 Molded chip carrier |
03/06/1990 | US4906515 Molded article of thermoplastic resin and process for producing the same |
03/06/1990 | US4906511 Aluminum nitride circuit board |
03/06/1990 | US4906405 Conductor composition and method of manufacturing a multilayered ceramic body using the composition |
03/06/1990 | US4906209 Feed-through capacitor having a compliant pin terminal |
03/06/1990 | US4906198 Circuit board assembly and contact pin for use therein |
03/06/1990 | US4905592 Screen-printing machine |
03/06/1990 | US4905371 Method for cleaning process control |
03/06/1990 | US4905358 Thin film active trimmable capacitor/inductor |
03/01/1990 | DE3926567A1 Film foil application to PCB - by fastening leading end and laminating vapour sprayed joint |
03/01/1990 | DE3829596A1 Soldering method |
03/01/1990 | DE3828904A1 Plug connector for printed circuit boards |
03/01/1990 | DE3828625A1 Method for the alignment of plates conveyed on a transport arrangement into alignment equipment |
03/01/1990 | DE3828621A1 Arrangement for producing a defined gap between tool and parts in pulse soldering |
03/01/1990 | DE3827893A1 Process for currentless deposition of nickel |
02/28/1990 | EP0356221A2 High lamination speed automatic laminator |
02/28/1990 | EP0355998A1 Glass ceramic substrate having electrically conductive film |
02/28/1990 | EP0355965A2 A method of achieving selective inhibition and control of adhesion in thick-film conductors |
02/28/1990 | EP0355927A2 A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor |
02/28/1990 | EP0355841A2 Automatic routing method using prioritized routability indices |
02/28/1990 | EP0355804A2 Electroplating composition and process |
02/28/1990 | EP0355756A1 Low dielectric constant compositions |
02/28/1990 | EP0355644A2 Process for the production of electrically conductive layers on substrates, and printing pastes therefor |
02/28/1990 | EP0355194A1 Process for producing bonded-through printed-circuit boards having very little or no solder edges around the through-bonding holes |
02/28/1990 | EP0198835B1 Production of copper-clad dielectric boards |
02/28/1990 | CN1039994A Polynorbornene laminates |
02/28/1990 | CN1039987A Solder and an electronic circuit using the same |
02/27/1990 | US4905124 IC card |
02/27/1990 | US4904571 Remover solution for photoresist |
02/27/1990 | US4904568 Method of forming printed image |
02/27/1990 | US4904506 Copper deposition from electroless plating bath |
02/27/1990 | US4904498 Method for controlling an oxide layer metallic substrates by laser |
02/27/1990 | US4904429 Method of producing a molding of foamed resin having a section for fitting an electrical part |
02/27/1990 | US4904340 Laser-assisted liquid-phase etching of copper conductors |
02/27/1990 | US4904339 Vertical spray etch reactor and method |
02/27/1990 | US4904325 Polypropylene base layer, top layer containing stearic acid amide and hydroxyethlalkylamine |
02/27/1990 | US4904311 Metallic powder and a paste made from it, and a metallic powder manufacture device |
02/27/1990 | US4904192 Battery contacts |
02/27/1990 | US4904191 Contact structure employing an elastomeric connector |
02/27/1990 | US4903889 Connection to a component for use in an electronics assembly |
02/27/1990 | US4903885 Method and apparatus for fastening electronic components to substrates |
02/27/1990 | US4903830 Automatic mounting chip component |
02/27/1990 | US4903631 System for soldering printed circuits |
02/27/1990 | US4903593 Apparatus for screen length and snap-off angle control |
02/27/1990 | CA1266197A1 Light-sensitive recording material and its use in a process for the production of a printing form or printed circuit |
02/22/1990 | WO1990001860A1 Printed circuit board |
02/22/1990 | WO1990001797A1 Method of manufacturing hermetically sealed compression bonded circuit assemblies |
02/22/1990 | WO1990001796A1 Process for coating and levelling structured surfaces |
02/22/1990 | WO1990001413A1 High dielectric constant flexible sheet material |