Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1990
03/15/1990DE3828597A1 Method of changing process parameters in pulse soldering
03/14/1990EP0358504A2 Electrical components
03/14/1990EP0358480A2 Process for producing multilayer printed wiring board
03/14/1990EP0358375A1 Platinum or platinum alloy plating bath
03/14/1990EP0358332A2 Circuit board and method of soldering
03/14/1990EP0358232A2 Methods of preparing molded thermoplastic articles
03/14/1990EP0357977A2 Soldering device with at least one stirrup electrode heated by electric thermal resistance
03/14/1990EP0357961A2 Method and apparatus for boring holes into a printing platen
03/14/1990EP0357918A1 Process for depositing adherent silver films
03/14/1990EP0357769A1 Vernier structure for flip chip bonded devices
03/14/1990CN1007205B Method for producing multiplayer printed-wiring foard containing metal core
03/13/1990US4908871 Pattern inspection system
03/13/1990US4908740 Integral composite structure with predetermined electrically conductive networks and method for producing same
03/13/1990US4908736 Self packaging chip mount
03/13/1990US4908735 Electronic apparatus reducing generation of electro magnetic interference
03/13/1990US4908696 Connector and semiconductor device packages employing the same
03/13/1990US4908689 Organic solder barrier
03/13/1990US4908590 Chip-like LC filter
03/13/1990US4908586 Compact encapsulated filter assembly for printed circuit boards and method of manufacture thereof
03/13/1990US4908337 Foil for soldering the terminals of an electronic component
03/13/1990US4908336 Flexible circuit and connector assembly
03/13/1990US4908296 Photosensitive semi-aqueous developable ceramic coating composition
03/13/1990US4908259 Molded article with partial metal plating and a process for producing such article
03/13/1990US4908258 High dielectric constant flexible sheet material
03/13/1990US4908242 Using solution comprising copper ions and reducing agent with constantly controlled ratio of concentration of anodic and cathodic reagents
03/13/1990US4908094 Roughening silicon-containing first surface of one member with oxygen-containing plasma, pressing the roughened surface together with first surface of other member
03/13/1990US4908087 Method of forming a multilayer printed circuit board and apparatus therefor
03/13/1990US4907991 Connective jumper
03/13/1990US4907978 Self-retaining connector
03/13/1990US4907975 Electrical connector utilizing flexible electrical circuitry
03/13/1990US4907734 Method of bonding gold or gold alloy wire to lead tin solder
03/13/1990CA1266592A1 Metallized polymers
03/08/1990WO1990002406A1 Process for making noble metal coated metallic particles, and resulting conductive materials
03/08/1990DE3829117A1 Metal core printed circuit board
03/07/1990EP0357307A2 Printed-wiring board
03/07/1990EP0357124A2 Method of selectively providing a metal from the liquid phase on a substrate by means of a laser
03/07/1990EP0357088A2 Multilayer wiring substrate
03/07/1990EP0357063A2 Photosensitive ceramic coating composition
03/07/1990EP0356899A2 Method and apparatus for mounting electronic device on a printed circuit board
03/07/1990EP0356887A2 Method to selectively direct electromagnetic rays onto a given part of an object
03/07/1990EP0356717A2 Supporting table for printed-circuit board drill units
03/07/1990EP0356678A1 Process for producing a solder coating on a metallized ceramic article
03/07/1990CN2054214U Electric connection fitting with pressure applying parts
03/07/1990CN1040298A Resistive metal layers and method for making same
03/07/1990CN1040198A Photopolymerization sensitizers active at longer wavelengths
03/07/1990CN1040184A Stabilized hydrogen peroxide compositions
03/07/1990CN1040183A Hydrogen peroxide compositions contg. substd. oxybenzene compound
03/06/1990US4907128 Chip to multilevel circuit board bonding
03/06/1990US4906957 Electrical circuit interconnect system
03/06/1990US4906823 Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same
03/06/1990US4906803 Flexible supporting cable for an electronic device and method of making same
03/06/1990US4906802 Molded chip carrier
03/06/1990US4906515 Molded article of thermoplastic resin and process for producing the same
03/06/1990US4906511 Aluminum nitride circuit board
03/06/1990US4906405 Conductor composition and method of manufacturing a multilayered ceramic body using the composition
03/06/1990US4906209 Feed-through capacitor having a compliant pin terminal
03/06/1990US4906198 Circuit board assembly and contact pin for use therein
03/06/1990US4905592 Screen-printing machine
03/06/1990US4905371 Method for cleaning process control
03/06/1990US4905358 Thin film active trimmable capacitor/inductor
03/01/1990DE3926567A1 Film foil application to PCB - by fastening leading end and laminating vapour sprayed joint
03/01/1990DE3829596A1 Soldering method
03/01/1990DE3828904A1 Plug connector for printed circuit boards
03/01/1990DE3828625A1 Method for the alignment of plates conveyed on a transport arrangement into alignment equipment
03/01/1990DE3828621A1 Arrangement for producing a defined gap between tool and parts in pulse soldering
03/01/1990DE3827893A1 Process for currentless deposition of nickel
02/1990
02/28/1990EP0356221A2 High lamination speed automatic laminator
02/28/1990EP0355998A1 Glass ceramic substrate having electrically conductive film
02/28/1990EP0355965A2 A method of achieving selective inhibition and control of adhesion in thick-film conductors
02/28/1990EP0355927A2 A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
02/28/1990EP0355841A2 Automatic routing method using prioritized routability indices
02/28/1990EP0355804A2 Electroplating composition and process
02/28/1990EP0355756A1 Low dielectric constant compositions
02/28/1990EP0355644A2 Process for the production of electrically conductive layers on substrates, and printing pastes therefor
02/28/1990EP0355194A1 Process for producing bonded-through printed-circuit boards having very little or no solder edges around the through-bonding holes
02/28/1990EP0198835B1 Production of copper-clad dielectric boards
02/28/1990CN1039994A Polynorbornene laminates
02/28/1990CN1039987A Solder and an electronic circuit using the same
02/27/1990US4905124 IC card
02/27/1990US4904571 Remover solution for photoresist
02/27/1990US4904568 Method of forming printed image
02/27/1990US4904506 Copper deposition from electroless plating bath
02/27/1990US4904498 Method for controlling an oxide layer metallic substrates by laser
02/27/1990US4904429 Method of producing a molding of foamed resin having a section for fitting an electrical part
02/27/1990US4904340 Laser-assisted liquid-phase etching of copper conductors
02/27/1990US4904339 Vertical spray etch reactor and method
02/27/1990US4904325 Polypropylene base layer, top layer containing stearic acid amide and hydroxyethlalkylamine
02/27/1990US4904311 Metallic powder and a paste made from it, and a metallic powder manufacture device
02/27/1990US4904192 Battery contacts
02/27/1990US4904191 Contact structure employing an elastomeric connector
02/27/1990US4903889 Connection to a component for use in an electronics assembly
02/27/1990US4903885 Method and apparatus for fastening electronic components to substrates
02/27/1990US4903830 Automatic mounting chip component
02/27/1990US4903631 System for soldering printed circuits
02/27/1990US4903593 Apparatus for screen length and snap-off angle control
02/27/1990CA1266197A1 Light-sensitive recording material and its use in a process for the production of a printing form or printed circuit
02/22/1990WO1990001860A1 Printed circuit board
02/22/1990WO1990001797A1 Method of manufacturing hermetically sealed compression bonded circuit assemblies
02/22/1990WO1990001796A1 Process for coating and levelling structured surfaces
02/22/1990WO1990001413A1 High dielectric constant flexible sheet material