Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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05/29/1990 | CA1269763A1 Integrated circuit package having coaxial pins |
05/29/1990 | CA1269759A1 Multi-layer circuit board fabrication process |
05/29/1990 | CA1269729A1 Shunt connecting apparatus |
05/29/1990 | CA1269603A1 Materials for use in forming, electronic interconnect |
05/29/1990 | CA1269573A1 Method of consistently producing a copper deposit on substrate by electroless deposition which deposit is essentially free of fissures |
05/23/1990 | EP0369919A1 Circuit board with self-supporting connection between sides |
05/23/1990 | EP0369475A1 Base Plate Conveyor |
05/23/1990 | EP0369408A2 Method for the preparation of metal-foiled polyimide-based film |
05/23/1990 | EP0369398A2 Polyphosphazene derivatives containing carbonyl groups suitable for photoreticulation processes |
05/23/1990 | EP0369393A2 Precision work positioning by electrical measurement |
05/23/1990 | EP0369374A2 Display with improved frame surrounding display element |
05/23/1990 | EP0369112A1 Adapter for electronic test devices for printed-circuit boards and the like |
05/23/1990 | EP0368943A1 Process and composition for preparing printed circuit through-holes for metallization. |
05/23/1990 | EP0225333B1 Mini chip carrier slotted array |
05/23/1990 | DE3839396A1 Method and device for soldering electrical components lying on a printed circuit board to the printed circuit board |
05/23/1990 | DE3838598A1 Method for producing electronic circuits |
05/23/1990 | CN1042464A Electric circuit board made with conducting coating or adhesive |
05/23/1990 | CN1042452A Electrical connector assembly including pressure exertion member |
05/23/1990 | CA2003202A1 Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes, and methods of making and using same |
05/22/1990 | US4928206 Foldable printed circuit board |
05/22/1990 | US4928061 Multi-layer printed circuit board |
05/22/1990 | US4927983 Circuit board |
05/22/1990 | US4927897 Metal-containing organic polymer and use thereof |
05/22/1990 | US4927865 Anthraquinoylcarboxylic acid hydrazides, curable compositions and use thereof |
05/22/1990 | US4927742 Multilayer printed wiring boards |
05/22/1990 | US4927733 Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing |
05/22/1990 | US4927711 Hybrid circuits and thick film dielectrics used therein |
05/22/1990 | US4927703 Process for the anionic polymerization of acrylic monomers and optionally of vinyl comonomers |
05/22/1990 | US4927700 Copper etching process and product with controlled nitrous acid reaction |
05/22/1990 | US4927697 Surface mounting leadless components on conductor pattern supporting substrates |
05/22/1990 | US4927491 Method of bonding IC unit |
05/22/1990 | US4927479 Process and plant for pressing flexible sheets |
05/22/1990 | US4927477 Method for making a flush surface laminate for a multilayer circuit board |
05/22/1990 | US4927371 Socket for semiconductor device |
05/22/1990 | US4927369 Electrical connector for high density usage |
05/22/1990 | US4927224 For directly applying laser beams to a workpiece |
05/22/1990 | US4927069 Soldering method capable of providing a joint of reduced thermal resistance |
05/22/1990 | US4927068 Method for heating a patterned substrate |
05/22/1990 | US4926789 Transport apparatus for boards |
05/22/1990 | US4926546 PC board panel configuration technique |
05/21/1990 | CA2003127A1 Curable resin composition |
05/21/1990 | CA2002402A1 Tabcircuit electrical connector supporting multiple components thereon |
05/18/1990 | CA2003294A1 Base plate conveyor |
05/17/1990 | WO1990005204A2 Surface treatment of metals |
05/17/1990 | WO1990005203A1 Pre-swelling and etching of plastics for plating |
05/17/1990 | WO1990005041A1 Method for effecting solder interconnects |
05/17/1990 | DE3937549A1 Electronic circuit with applied metallisation pad - has applied dielectric layer of same material as substrate covering edges of metallisation pad |
05/17/1990 | DE3936843A1 Electric circuit board mfr. - having insulating protective lacquer applied prior to insertion of component lead pins |
05/17/1990 | DE3838486A1 Circuit base for radio-frequency lines |
05/17/1990 | DE3838446A1 Print head with a print line made of electro-optical material |
05/17/1990 | DE3838246A1 Scoring machine |
05/17/1990 | DE3837950A1 Circuit arrangement and method for producing such a circuit arrangement |
05/16/1990 | EP0368809A1 Method for positioning and clamping of multilayered circuits and means and device for the application of the method |
05/16/1990 | EP0368775A1 Machine for cleaning objects |
05/16/1990 | EP0368741A1 Integrated-circuit support and its manufacturing method, integrated circuit adapted to the support and resulting housings |
05/16/1990 | EP0368740A1 High-density integrated-circuit housing |
05/16/1990 | EP0368357A2 Process of forming burned patterns and burning pattern sheet for use in the process |
05/16/1990 | EP0368293A2 Process and device for assembling printed-circuit boards |
05/16/1990 | EP0368262A2 Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device |
05/16/1990 | EP0368231A2 Process of producing copper plated resin article |
05/16/1990 | EP0368133A2 Support body for the electrically insulated arrangement of components |
05/16/1990 | EP0367933A2 Flexible supporting cable for an electronic device and method of making same |
05/16/1990 | EP0367885A1 Conditioning means for printed circuit boards |
05/16/1990 | EP0367785A1 A method for producing a circuit board and a circuit-board preform for use in carrying out the method |
05/16/1990 | CA2002906A1 Hardenable resin composition |
05/15/1990 | US4926290 Snap on fuse cover |
05/15/1990 | US4926241 Flip substrate for chip mount |
05/15/1990 | US4926151 Chip-type coil element |
05/15/1990 | US4926022 Laser reflow soldering process and bonded assembly formed thereby |
05/15/1990 | US4925774 Depositing tetracyanoquinodimethan compound |
05/15/1990 | US4925773 Solder resist ink composition |
05/15/1990 | US4925771 Process of making photosensitive aqueous developable ceramic coating composition including freeze drying the ceramic solid particles |
05/15/1990 | US4925723 Forming holes; filling with metal |
05/15/1990 | US4925705 Security devices |
05/15/1990 | US4925525 Process for producing a printed circuit board |
05/15/1990 | US4925522 Printed circuit assembly with contact dot |
05/15/1990 | US4925347 Method of chamfering planar plate |
05/15/1990 | US4925024 Hermetic high frequency surface mount microelectronic package |
05/15/1990 | US4924590 Lamination of metal core with plastic foil; forming hole pattern; thermoforming additional plastic |
05/15/1990 | CA1269157A1 Work ordering method for use in a method of routing |
05/14/1990 | CA2002927A1 Connection to a component for use in an electronics assembly |
05/10/1990 | DE3838056A1 Conditioning preparation for printed circuits |
05/10/1990 | DE3837671A1 Product for the permanent cleaning of non-ferrous metal surfaces |
05/10/1990 | DE3837618A1 Electrical or electronic arrangement |
05/09/1990 | EP0367504A2 Surface treatment of metals |
05/09/1990 | EP0367350A1 Surface mountable contact element and assembly |
05/09/1990 | EP0367311A1 Method for mounting an electronic component and memory card using same |
05/09/1990 | EP0367108A2 Electrical interconnector for infrared detector arrays and method for its fabrication |
05/09/1990 | EP0367076A1 Throughput of a two-sided printed board and method for producing it |
05/09/1990 | EP0367074A2 Preparing printed circuit boards for electroplating |
05/09/1990 | EP0366885A2 Electrical connector assembly |
05/09/1990 | CN1041914A Process and apparatus for continuous production of laminates |
05/09/1990 | CN1007943B Inductance element and method of mfg. the same |
05/08/1990 | US4924353 Connector system for coupling to an integrated circuit chip |
05/08/1990 | US4924352 Method and device for cooling an integrated circuit package |
05/08/1990 | US4924304 Video probe aligning of object to be acted upon |
05/08/1990 | US4924292 Direct bond circuit assembly with crimped lead frame |
05/08/1990 | US4924152 Thermoplastic ballast housing in a novel three-dimensional printed circuit board |
05/08/1990 | US4924015 Preparing metallic coatings and images |
05/08/1990 | US4923739 Magnetic alignment |