Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2013
04/17/2013CN103042288A Tin pan with irregular bottom, tin furnace and using method of tin pan
04/17/2013CN102413636B Pin positioning method for press fit of metal substrate
04/17/2013CN102365002B Transplanting grafting technology of FPC defective product
04/17/2013CN102307438B Method for roughening laminated surface of metal substrate
04/17/2013CN102264838B 固化性组合物 The curable composition
04/17/2013CN102186312B Through-hole reflow soldering method and formwork for printing circuit board
04/17/2013CN102076171B Printed circuit board packaging method and crystal oscillator
04/17/2013CN102036544B Surface mount electronic component
04/17/2013CN102036503B Mask for solder printing and manufacturing method for printed circuit board using the same
04/17/2013CN102026494B Solder mask screen printing method
04/17/2013CN102026483B Printed inductor, method for manufacturing the same and voltage controlled oscillator
04/17/2013CN101971097B Photosensitive resin composition, photosensitive element, resist pattern forming method and method for manufacturing printed circuit board
04/17/2013CN101969738B Coupon board and manufacturing method of printed circuit board
04/17/2013CN101965106B Manufacturing method for printed wiring board
04/17/2013CN101951734B Method for processing micro through hole of flexible circuit board
04/17/2013CN101925266B Printed wiring board and method for manufacturing the same
04/17/2013CN101815402B Circuit board and a manufacturing approach thereof
04/17/2013CN101784578B Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same
04/17/2013CN101778538B Device system for producing nano spraying circuit boards
04/17/2013CN101640308B Method for manufacturing antenna by spray non-contact cutting and machine tool with same
04/17/2013CN101594736B A copper-clad laminate, a surface treating copper foil and a printed circuit board
04/17/2013CN101567326B Printed circuit board and method for forming same
04/17/2013CN101541903B Adhesive and connection structure using the same
04/17/2013CN101292393B Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor chip
04/16/2013US8423317 Temperature detection method of semiconductor device and power conversion apparatus
04/16/2013US8420951 Package structure
04/16/2013US8420745 Thermally curable solder resist composition
04/16/2013US8420210 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
04/16/2013US8419884 Method for manufacturing multilayer wiring substrate
04/16/2013US8418361 Method of manufacturing printed circuit board having landless via hole
04/16/2013US8418360 Method for manufacturing a printed wiring board
04/16/2013US8418359 Method for manufacturing circuit pattern-provided substrate
04/16/2013US8418358 Wiring board with built-in component and method for manufacturing wiring board with built-in component
04/16/2013US8418357 Printed circuit board layout method
04/16/2013US8418356 Method of manufacturing an embedded printed circuit board
04/16/2013US8418355 Method for manufacturing circuit board
04/16/2013US8418331 Method of fabricating a duplexer using an embedded PCB
04/16/2013CA2496557C Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module
04/11/2013WO2013052672A2 Power management applications of interconnect substrates
04/11/2013WO2013052428A1 A mn doped sn-base solder alloy and solder joints thereof with superior drop shock reliability
04/11/2013WO2013051664A1 Gauze for screen printing and screen printing method
04/11/2013WO2013049938A1 Electronic components accommodated by a cavity of the current pcm or by a cavity of the adjacent pcm to minimize height of cavities
04/11/2013US20130090525 Neural interface system with an edge array
04/11/2013US20130089658 Laser processing method and production method of multilayer flexible printed wiring board using laser processing method
04/11/2013US20130088839 Board module manufacturing method, board module, and board module assembly
04/11/2013US20130087376 Interposer, circuit board module, and method for manufacturing interposer
04/11/2013US20130087374 Conductive film with high transmittance having a number of anti reflection coatings, touch panel using the same and manufacturing method thereof
04/11/2013US20130087369 Fabric type circuit board and method of manufacturing the same
04/11/2013US20130087368 Heating element mounting substrate, method of manufacturing the same and semiconductor package
04/11/2013US20130087367 Heating element mounting substrate, method of manufacturing the same and semiconductor package
04/11/2013US20130087365 Method for making electrical structure with air dielectric and related electrical structures
04/11/2013US20130087271 Method for manufacturing printed circuit board
04/11/2013DE102012109514A1 Elektronik-Gehäuse-Verbinder und Verfahren zu dessen Herstellung Electronic housing connector and method for its production
04/11/2013DE102011114965A1 Holding device for fastening e.g. capacitor of motor vehicle control device, has press element that presses electrical conductors into holes on contact portion of substrate, and retaining portions that secure electrical conductors
04/11/2013DE102011084303A1 Method for producing carrier for electronic power module, involves forming electrical connection between heavy-current conductor and sintered conductor
04/11/2013DE102010019407A9 Verfahren zum Einbringen elektrischer Isolierungen in Leiterplatten A method for introducing electrical insulation in printed circuit boards
04/11/2013DE102010001573B4 Vorrichtung zum Biegen und Halten eines Leiterplatten-Bereichs einer wenigstens zwei starre Leiterplatten-Bereiche aufweisenden Semiflex-Leiterplatte Apparatus for bending and holding a PCB area of ​​a least two rigid PCB areas having Semi flexible PCB
04/10/2013EP2579697A2 Interposer, circuit board module, and method for manufacturing interposer
04/10/2013EP2579696A1 Circuit board and electronic device using the same
04/10/2013EP2579695A1 Printed circuit board, antenna, wireless communication device and manufacturing methods thereof
04/10/2013EP2579694A1 Ceramic printed circuit board structure
04/10/2013EP2579693A1 Multi-chip wiring board and process for producing same, and wiring board and process for producing same
04/10/2013EP2578413A1 Screen-printing stencil having amorphous carbon films and manufacturing method therefor
04/10/2013EP2578068A1 Method for connecting electrical or electronic components to a support of an electrically conductive circuit
04/10/2013CN202873270U A material reception control device of a chip mounter
04/10/2013CN202873195U Silicon aluminum foil for isolation of multi-layer PCB
04/10/2013CN202873194U Air conduction backing plate
04/10/2013CN202873193U Technological edge of PCB board and PCB jointed board
04/10/2013CN202873192U A material receiving device of a chip mounter
04/10/2013CN202873191U A material feeder of a chip mounter
04/10/2013CN202873190U Improved structure of serial interface button type suction cover
04/10/2013CN202873189U Pieced board of heterotype circuit board
04/10/2013CN202873188U Plasma machine used in high-frequency circuit board production
04/10/2013CN202873187U Circuit-board distortion-preventing device
04/10/2013CN202873186U Bonding fixture
04/10/2013CN202870461U Film counterpoint machine
04/10/2013CN202870460U Film with aligning nails
04/10/2013CN202865364U Copper precipitation electroplating assistant jig for manufacturing super thin slab
04/10/2013CN202865363U Water-saving pattern plating line for processing circuit board
04/10/2013CN202861582U Special heat insulation jig suitable for lead-free surface mounted technology (SMT) welding process of FR-1 papery printed circuit board (PCB)
04/10/2013CN103039132A Ceramic multilayer substrate and method for producing same
04/10/2013CN103039131A Method for producing printed wiring board, and printed wiring board
04/10/2013CN103039130A Surface mounting method for electronic components and printed circuit boards manufactured using said method
04/10/2013CN103039129A An apparatus comprising a rigid-flex circuit board and associated methods
04/10/2013CN103038844A Substrate-embedded capacitor, capacitor-integrated substrate provided with same, and method for producing substrate-embedded capacitor
04/10/2013CN103038020A Pb-free solder alloy
04/10/2013CN103037640A Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate
04/10/2013CN103037639A Package method for printed circuit board (PCB) substrate
04/10/2013CN103037638A Press fit method for to-be-pressed multi-layer plate with chip window
04/10/2013CN103037637A Multilayer circuit board and manufacture method of multilayer circuit board
04/10/2013CN103037636A Multilayer circuit board and manufacture method of multilayer circuit board
04/10/2013CN103037635A 3d curved surface laser punching and porefilling circuit method
04/10/2013CN103037634A Plated through hole (PTH) manufacturing technique tool of sheet
04/10/2013CN103037633A Welding skewing-proof method for surface mounting device
04/10/2013CN103037632A Weld leg component
04/10/2013CN103037631A Flexible printed circuit (FPC) movable carrier structure
04/10/2013CN103037630A Double-screen achieving method of surface mount technology (SMT)-automated optical inspection (AOI) equipment
04/10/2013CN103037629A Solder resist printing method of metal circuit board
04/10/2013CN103037628A Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying device
04/10/2013CN103037627A Method of removing copper in middle of wall of hole of printed circuit board (PCB) board by using T-shaped tool