Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1990
10/18/1990WO1990012432A1 Electrical connector
10/18/1990WO1990012422A1 G-tab manufacturing process and the product produced thereby
10/18/1990WO1990012129A1 Treatment of metal foil
10/18/1990WO1990012071A1 Composition and method for stripping tin or tin-lead alloy from copper surfaces
10/18/1990DE4010899A1 Multilayer circuit board assembly
10/18/1990DE3929943A1 Etch-free non-polluting circuit board mfr. - comprises using metal layer-free substrate e.g. copper
10/18/1990DE3923959C1 Silicon rubber contact mat - has keyboard with contact buttons and holder for LCD panel
10/18/1990DE3911108A1 Electrical connecting terminal for printed circuit boards
10/17/1990EP0392892A1 Compact memory module for data memory card of an image processor
10/17/1990EP0392824A1 Metal substrate for thick film circuits for automotive electrical systems
10/17/1990EP0392668A1 Azeotrope-like mixtures of 1,1-dichloro-2,2,2-trifluoroethane and 1,1,-dichloro-1-fluoroethane
10/17/1990EP0392235A1 Process for plating a metallic deposit between functional pattern lines on a substrate
10/17/1990EP0392226A1 Vacuum, continuous batch process for producing laminates and apparatus for such process
10/17/1990EP0392151A2 Stamping foil for applying conductive tracks to rigid or plastic supports
10/17/1990EP0391979A1 Uses of uniaxially electrically conductive articles
10/17/1990EP0391912A1 Process and device for pre-drying or through-hardening of photocoated printed circuit boards
10/17/1990EP0391903A1 Welding device
10/17/1990EP0131031B1 Method of treating thermoplastic surfaces
10/16/1990US4964057 Block placement method
10/16/1990US4964019 Multilayer bonding and cooling of integrated circuit devices
10/16/1990US4963886 Thermal printing head
10/16/1990US4963752 Method for detecting missing circuit board components
10/16/1990US4963714 Diode laser soldering system
10/16/1990US4963701 Circuit board
10/16/1990US4963697 Advanced polymers on metal printed wiring board
10/16/1990US4963512 Method for forming conductor layers and method for fabricating multilayer substrates
10/16/1990US4963425 Printed wiring board substrate for surface mounted components
10/16/1990US4963389 Method for producing hybrid integrated circuit substrate
10/16/1990US4963221 Hot press including cam rod penetrating top platen
10/16/1990US4963099 Electrical junction box
10/16/1990US4962878 For a standard size circuit component
10/16/1990US4962585 Connective jumper and method of manufacturing the same
10/16/1990CA1275330C Automatic focusing system of an observing means for inspecting an object
10/16/1990CA1275235C Method of fabricating multilayer structures with nonplanar surfaces
10/12/1990WO1990011867A1 Method and composition for protecting and enhancing the solderability of metallic surfaces
10/11/1990DE3911612A1 Method for loading components onto PCB - using individual separating and positioning templates for locating components by size and value onto PCB with adhesive fixing
10/11/1990DE3910786A1 Adhesive composition based on an unsaturated polyester resin, in particular for SMD components
10/10/1990EP0391314A2 Method for patterning on a substrate
10/10/1990EP0391201A1 Method for treating polyetherimide substrates and articles obtained therefrom
10/10/1990EP0391105A2 Circuit board for optimum decoupling of circuits with digital IC's
10/10/1990EP0391068A2 Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment
10/10/1990EP0391035A2 Dense fluid photochemical process for substrate treatment
10/10/1990EP0391024A1 Circuit for display device
10/10/1990EP0390996A2 IC card module
10/10/1990EP0390967A2 Aqueous acid bath for electrodepositing bright and crack-free copper and its use
10/10/1990EP0390891A1 Method of forming holes in ceramic ic packages.
10/10/1990EP0390827A1 Process for manufacturing through-contacting printed circuit boards.
10/10/1990CA2013879A1 Azeotrope-like mixtures of 1,1-dichloro-2,2,2-trifluoroethane and 1,1-dichloro-1-fluoroethane
10/09/1990US4962464 Serpentine columnar plotting system
10/09/1990US4962446 Electrode terminal for capacitor
10/09/1990US4962442 Free-standing stanchion for supporting and protecting electronic device packages on circuit boards
10/09/1990US4962363 Surface mountable leadless fuse
10/09/1990US4962294 Method and apparatus for causing an open circuit in a conductive line
10/09/1990US4962287 Flexible printed wire board
10/09/1990US4962004 Method of inhibiting electrochemical reduction of polyimide during electroplating and articles formed thereby
10/09/1990US4961955 Solder paste applicator for circuit boards
10/09/1990US4961886 Method of controlling flow by a radiation formed dam
10/09/1990US4961869 Ternary azeotropic compositions of 2,3-dichloro-1,1,1,3,3-pentafluoropropane with trans-1,2-dichloroethylene and methanol
10/09/1990US4961828 Pretreating with chromic acid solution before forming copper or copper oxide dendrites or nodules on surface
10/09/1990US4961808 High lamination speed automatic laminator
10/09/1990US4961806 Multilayer laminate containing chemical resistant protective coating
10/09/1990US4961259 Method of forming an interconnection by an excimer laser
10/04/1990WO1990011673A1 Method and device for making integrated circuits
10/04/1990WO1990011630A1 Plug contact arrangement
10/04/1990WO1990011629A1 Memory metal electrical connector
10/04/1990WO1990011388A1 Conversion of manganate to permanganate
10/04/1990WO1990011182A1 A multilayer film and laminate for use in producing printed circuit boards
10/04/1990DE4009088A1 Multi-fibre output coupler for applying laser beams to workpiece - has X-shaped body to receive fibres and screw spring mechanism in slot to adjust spacing and angle of fibres w.r.t. each other
10/04/1990DE3910750A1 Connecting device for an electronic component
10/04/1990DE3910518A1 Printed circuit board for optimum decoupling of circuits having digital ICs
10/04/1990DE3910260A1 Polydiacetylene containing defined electron-donor and/or acceptor groups
10/04/1990DE3910251A1 Device for directly structuring circuit carriers
10/03/1990EP0390600A2 Filter apparatus
10/03/1990EP0390598A2 Metallized aluminum nitride substrate
10/03/1990EP0390465A2 Method of forming a film pattern on a substrate
10/03/1990EP0390130A1 Method and apparatus for bonding continuous thin film to discrete base plates and film cutting apparatus therefor
10/03/1990EP0389951A2 Heat resistant adhesive composition and bonding method using the same
10/03/1990EP0389865A2 Multi-layer printed circuit board
10/03/1990EP0389826A1 Arrangement of semiconductor devices and method of and apparatus for mounting semiconductor devices
10/03/1990EP0389678A1 Method of making a surface mountable electronic device
10/03/1990EP0389619A1 Curved plastic body with circuit pattern and method of making.
10/03/1990EP0389559A1 Moldable/foldable radio housing.
10/03/1990EP0200759B1 Stencil manufacturing and printing process and apparatus
10/03/1990CN1045895A Method for making integrated circuits and apparatus for executing same
10/03/1990CN1045818A Azeotropic composition of 2,2-dichloro-1,1,1-trifluoroethane and methanol
10/03/1990CA2009748A1 Dense fluid photochemical process for substrate treatment
10/02/1990US4960972 Light-beam-operated heating machine
10/02/1990US4960676 Method for forming pattern by using graft copolymerization
10/02/1990US4960614 Printed circuit board
10/02/1990US4960613 Decomposition of catalyst source to provide layer of electro-less plating catalyst on buffer layer; depositing plating metal in uniform pattern
10/02/1990US4960491 Speed up reaction rate by interacting with a reactive material to generate hydrogen
10/02/1990US4960490 Method of making multiple-connector adhesive tape
10/02/1990US4959900 Mounting of electronic microcomponents on a support
10/02/1990CA1274888A1 Fixed connector for making electrical connections to surface-mount type printed board
10/02/1990CA1274887A1 Daughter board/backplane assembly
10/01/1990WO1990012127A1 Process and composition for forming black oxide layers
10/01/1990CA2050678A1 Process and composition for forming black oxide layers
09/1990
09/29/1990CA2003628A1 Method of making a surface mountable electronic device
09/27/1990DE4007018A1 Three=pronged electrical connection spring for printed circuits - has shorter central prong which can bear upon face of circuit board if not cut off
09/27/1990DE3909244A1 Method for producing customer-specific printed circuits
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