Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/1990
07/03/1990US4938994 Method and apparatus for patch coating printed circuit boards
07/03/1990US4938924 Copper doping of eutectic solder
07/03/1990US4938702 Connector clamp for attaching flat electrical conductor leads to printed wiring boards
07/03/1990US4938701 Connecting bracket for modular circuit boards
07/03/1990US4938257 Printed circuit cleaning apparatus
07/03/1990US4937935 Process for making an assembly of electrically conductive patterns on an insulating surface of complex form
07/03/1990US4937934 Installation of surface mount components on printed wiring boards
07/03/1990US4937930 Method for forming a defect-free surface on a porous ceramic substrate
07/03/1990CA1271268A1 Method of making a flexible microcircuit
07/03/1990CA1271267A1 Vlsi coaxial wiring structure
07/03/1990CA1271264A1 Adhesion promoting process for fabricating multilayer circuit boards
06/1990
06/28/1990WO1990007171A1 Ink-on-glass digitizer tablet and method of construction
06/28/1990WO1990005204A3 Surface treatment of metals
06/28/1990DE3843972A1 Central electrical system for motor vehicles
06/28/1990CA2006809A1 Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface
06/27/1990EP0375519A1 Connecting strips for the in-line assembling of SMD components
06/27/1990EP0375505A1 Electrical component with direct carry over
06/27/1990EP0375428A1 System for enhancing current carrying capacity of printed wiring board
06/27/1990EP0375225A2 Palladium alloy plating process
06/27/1990EP0375215A2 Polymeric film
06/27/1990EP0375180A2 Additive plating bath and process
06/27/1990EP0375066A1 A method of etching thin indium tin oxide films
06/27/1990EP0374876A2 Bubble free liquid solder mask-coated printed circuit boards by fluid pressurizing
06/27/1990EP0374875A2 Visible sensitizers for photopolymerizable compositions
06/27/1990EP0374874A2 Polynorbornene prepreg laminated to conductive surface
06/27/1990EP0374809A2 Bubble free film/liquid solder mask-coated printed circuit boards by fluid pressurizing
06/27/1990EP0374487A2 Method for conditioning an organic polymeric material
06/27/1990EP0374483A2 Process for the production of printed circuits with contact areas
06/27/1990EP0374476A2 Connector for connecting flexible film circuit carrier to board or card and use thereof
06/27/1990EP0374475A1 Soldering and bonding of semiconductor device contacts
06/27/1990EP0374460A2 Electric connector utilizing flexible electrical circuitry
06/27/1990EP0374459A1 Automatic loading mechanism
06/27/1990EP0374452A2 Hybrid circuits and thick film dielectrics used therein
06/27/1990EP0374319A1 Multilayer printed circuit board for ceramic chip carriers
06/27/1990EP0374286A1 Method of manufacturing two-layer printed circuit sheet
06/27/1990EP0374272A1 Multilayer circuit board with fluoropolymer interlayers
06/27/1990CN1043407A Carrier substrate and method for preparing same
06/27/1990CN1043397A Uv curable compositions for making tentable solder mask coatings
06/27/1990CN1043351A Process and apparatus for electrolytically removing protective layers from sheet metal substrate
06/27/1990CN1043331A Fabrication of flexible electronic circuitry using modified latex polymer laminating adhesive composition
06/27/1990CN1008577B Bonding of microelectronic circuits
06/27/1990CA2000074A1 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane, dichlorotrifluoroethane and methanol
06/26/1990US4937659 Interconnection system for integrated circuit chips
06/26/1990US4937658 Interconnection system for integrated circuit chips
06/26/1990US4937278 Polymethylpentene release sheet
06/26/1990US4937172 Photopolymerizable composition having superior adhesion, articles and processes
06/26/1990US4937121 Process for preparing polymeric materials for application to printed circuits
06/26/1990US4937097 Apparatus for and method of screen printing on boards
06/26/1990US4937006 Method and apparatus for fluxless solder bonding
06/26/1990US4936785 Interchangeable adapter module for electronic devices
06/26/1990US4936012 Terminal positioning assembly and methods
06/26/1990CA1270914A1 Multiconductor electrical cable terminations and methods and apparatus for making same
06/26/1990CA1270737A1 Film trimming of laminated photosensitive layer
06/24/1990CA2006585A1 Improved method for making printed circuits
06/23/1990CA2006211A1 Bubble free film/liquid solder mask-coated printed circuit boards by fluid pressurizing
06/23/1990CA2006210A1 Visible sensitizers for photopolymerizable compositions
06/23/1990CA2006206A1 Conformatioin of vacuum-laminated solder mask coated printed circuit boards by fluid pressurizing
06/23/1990CA2006205A1 Bubble free liquid solder mask-coated printed circuit boards by fluid pressurizing
06/23/1990CA2005690A1 Polynorbornene prepreg laminated to conductive surface
06/23/1990CA2000680A1 Hybrid circuits and thick film dielectrics used therein
06/21/1990DE3942078A1 Conductor tracks for knitting needles - applied by hot melt or by frictional heat
06/21/1990DE3941318A1 Direct writing on e.g. thick-film integrated circuit - involves compensation of distance data obtd. from laser beam reflections at predetermined points on circuit substrate
06/21/1990DE3842572A1 Method for producing a soldering comb for the electrical and mechanical connection of printed circuit boards
06/21/1990DE3842159A1 Method for fabricating printed circuits
06/20/1990EP0374108A2 An improved oven for drying or curing a photosensitive material applied as a coating on a substrate
06/20/1990EP0374073A2 Mask shock absorbing system and method of using the same
06/20/1990EP0374035A1 Surface mount socket
06/20/1990EP0373793A2 Lift-off process for patterning shields in thin magnetic recording heads
06/20/1990EP0373776A2 Toner fluid dispersions, metallic images, and thermal mass transfer thereof
06/20/1990EP0373528A2 Method for making thermal fuses and use of the method
06/20/1990EP0373438A2 Photoresist film with a soluble intermediate layer
06/20/1990EP0373436A2 Light-sensitive registration material
06/20/1990EP0373428A2 Pin with tubular elliptical compliant portion and method for affixing to mating receptacle
06/20/1990EP0373376A2 Process for obtaining an optimum solder quality on printed-circuit boards using computer-controlled automatic soldering machines
06/20/1990EP0373374A1 Wet etching of cured polyimide
06/20/1990EP0373363A2 Filling of vias in a metallic plane
06/20/1990EP0373356A1 Circuit board
06/20/1990EP0373345A1 Laser assisted heater bar for multiple lead attachment
06/20/1990EP0373344A2 Method of forming conductors within an insulating substrate
06/20/1990EP0373342A2 Circuit board assembly and contact pin for use therein
06/20/1990EP0373241A1 Film carrier and method of manufacturing same
06/20/1990EP0373208A1 Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
06/20/1990CA2003861A1 Palladium alloy plating process
06/19/1990US4935856 Surface mounted LED package
06/19/1990US4935844 Alkali-free green tape has silica and zinc borate flux particles dispersed in organic substrate
06/19/1990US4935584 Method of fabricating a printed circuit board and the PCB produced
06/19/1990US4935477 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
06/19/1990US4935320 Adhesively bonded photostructurable polyimide film
06/19/1990US4935312 Film carrier having tin and indium plated layers
06/19/1990US4935310 Copper foil for a printed circuit and a method for the production thereof
06/19/1990US4935285 Ceramic substrates for microelectronic circuits and process for producing same
06/19/1990US4935284 Molded circuit board with buried circuit layer
06/19/1990US4935267 Process for electrolessly plating copper and plating solution therefor
06/19/1990US4935174 Transferring magnetic deposit onto polystyrene
06/19/1990US4935109 Anodes supplying ions of the metal to be plated, cathodes supply electrons to object to be plated; containers control ion migration for uniform plating
06/19/1990US4935108 Testing electrodeposition quality by quantitative analysis of current distribution
06/19/1990US4935090 Compressing and heating the adhesive-applied metallic printed circuit and circuit board positioned between two moveable surfaces one being an elastomer
06/19/1990US4935086 Process of bonding an electrical device package to a mounting surface
06/19/1990US4934947 Modular jack for flat flexible cable
06/19/1990US4934946 Flexible circuit connection assembly
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