| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/26/1990 | DE3901157A1 Electrical device |
| 07/26/1990 | CA2025239A1 Portable electronic token |
| 07/26/1990 | CA2001480A1 Multilayer printed circuit board |
| 07/25/1990 | EP0379404A2 A multilayer hybrid circuit |
| 07/25/1990 | EP0379339A2 Method and apparatus for applying liquid solder resist to a printed circuit board |
| 07/25/1990 | EP0379290A1 Flux composition |
| 07/25/1990 | EP0379268A2 Constant-boiling, azeotrope-like mixtures of dichlorotrifluoroethane, 1,1-dichloro-1-fluoroethane and methanol and/or ethanol |
| 07/25/1990 | EP0379013A2 Screen printing method and printing machine |
| 07/25/1990 | EP0378904A1 Process for etching organic polymeric materials |
| 07/25/1990 | EP0169885B1 Multi-zone thermal process system utilizing nonfocused infrared panel emitters |
| 07/24/1990 | US4943516 Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof |
| 07/24/1990 | US4943513 Photoimageable composition with reduced cold flow due to salt-bridging by metal ions and dry film formed therefrom |
| 07/24/1990 | US4943469 Titanium, strontium, manganese, yttrium oxides |
| 07/24/1990 | US4943346 Interconnection wiring |
| 07/24/1990 | US4943334 Method for making reinforced plastic laminates for use in the production of circuit boards |
| 07/24/1990 | US4942997 Solder flow well for reflowing solder of multipin components |
| 07/24/1990 | CA1271990A1 Connector with fine-pitched conductive passages |
| 07/23/1990 | CA2003675A1 Composite including and inorganic image and method of transferring such an image |
| 07/18/1990 | EP0378369A2 Soldering method and soldering apparatus |
| 07/18/1990 | EP0378233A2 An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same |
| 07/18/1990 | EP0378211A2 Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus |
| 07/18/1990 | EP0378140A2 Cleaning compositions |
| 07/18/1990 | EP0378113A2 Soldering device with at least one bow-shaped electrode |
| 07/18/1990 | EP0378016A1 Device for the connection of components and functional module using the same |
| 07/18/1990 | EP0377937A2 IC card |
| 07/18/1990 | EP0377874A1 Soldering device with at least one stirrup electrode and two opposite soldering bridges or four by pairs opposite soldering bridges |
| 07/18/1990 | EP0377873A2 Soldering device with at least one stirrup electrode heated by electric thermal resistance |
| 07/18/1990 | EP0377872A2 Method of applying a solder resist covering to a circuit board |
| 07/18/1990 | EP0377867A2 Laser surface modification for seeding substrates |
| 07/18/1990 | EP0377635A1 Method for the prevention of smear in the manufacture of printed circuit boards |
| 07/18/1990 | CN2059525U Pluggable universal breadboard with both useful surfaces |
| 07/18/1990 | CN1043963A Azeotropic compositions of 1,1,2-trichlorotrifluoroethane and trans-1,2-dichloroethylene with ethanol, n-propanol isopropanol and acetone or with ethanol or acetone and nitromethane |
| 07/17/1990 | USRE33268 Chip carrier socket having improved contact terminals |
| 07/17/1990 | US4942453 IC package |
| 07/17/1990 | US4942282 Split heater bar |
| 07/17/1990 | US4942110 High resolution conductor patterning |
| 07/17/1990 | US4942095 Laminate of polymers stable at high temperatures and metal foils applied directly to the said polymers |
| 07/17/1990 | US4942079 Ceramic and circuit substrate and electronic circuit substrate by use thereof |
| 07/17/1990 | US4942076 Gallium arsenide and alumina, sintering tungsten and aluminum, hermetic sealing, drilling holes |
| 07/17/1990 | US4941940 Etching a hydrolyzable polymer, hydrolysis, electroless plating with nickel or copper |
| 07/17/1990 | US4941929 Solder paste formulation containing stannous fluoride |
| 07/17/1990 | US4941428 Computer controlled viscous material deposition apparatus |
| 07/17/1990 | US4941257 Method for fixing an electronic component and its contacts to a support |
| 07/17/1990 | CA2007994A1 Constant-boiling, azeotrope-like mixtures of dichlorotrifluoroethane, 1,1-dichloro-1-fluoroethane and methanol and/or ethanol |
| 07/17/1990 | CA2007968A1 Photosensitive liquid solder resist application method and apparatus thereof |
| 07/17/1990 | CA1271660A1 Process for the production of images |
| 07/17/1990 | CA1271659A1 Photoconductive polyimide-electron donor charge transfer complexes |
| 07/12/1990 | WO1990007858A2 Improved method for making printed circuits |
| 07/12/1990 | WO1990007857A1 Metal core wiring board |
| 07/12/1990 | WO1990007804A1 Process and device for connecting flexible strip conductors to connecting contacts |
| 07/12/1990 | WO1990007792A1 Method of making high density solder bumps and a substrate socket for high density solder bumps |
| 07/12/1990 | WO1990007730A1 Photoresist compositions containing cobalt (iii) compound and redox transfer ligand |
| 07/12/1990 | WO1990007568A1 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane, dichlorotrifluoroethane, and methanol or ethanol |
| 07/11/1990 | EP0377332A2 Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface |
| 07/11/1990 | EP0377063A1 Arrangement, e.g. for LCD control in a motor vehicle board computer, for electrically connecting the terminal tabs of two boards with a printed-circuit film |
| 07/11/1990 | CN1043827A Method of etching thin indium tin oxide films |
| 07/11/1990 | CN1043800A Improved conformation of vacuum-laminated solder mask coated printed circuit boards by fluid pressurizing |
| 07/11/1990 | CN1043799A Bubble free film/liquid solder mask-coated printed circuit boards by fluid pressurizing |
| 07/11/1990 | CN1043798A Bubble free liquid solder mask-coated printed circuit boards by fluid pressurizing |
| 07/11/1990 | CN1043797A Visible sensitizers for photopolymerizable compositions |
| 07/11/1990 | CN1043663A Polymeric film |
| 07/11/1990 | CN1043662A Multi-layer polynorbornene and epoxy laminates |
| 07/11/1990 | CN1008786B Method for manufacturing printed circuit board |
| 07/10/1990 | US4941069 Rectifier spacer/mounting assembly |
| 07/10/1990 | US4940881 Method and apparatus for effecting selective ablation of a coating from a substrate, and controlling the wall angle of coating edge portions |
| 07/10/1990 | US4940651 Epoxy polymers patterned by curing with laser beam |
| 07/10/1990 | US4940627 Thin film artwork compounds |
| 07/10/1990 | US4940623 Printed circuit board and method using thermal spray techniques |
| 07/10/1990 | US4940609 Polymeric conditioner for pretreating nonmetallic surfaces for chemical metallization |
| 07/10/1990 | US4940608 Local electroless plating process for plastics |
| 07/10/1990 | US4940554 Conditioning agent for the treatment of base materials |
| 07/10/1990 | US4940510 Method of etching in the presence of positive photoresist |
| 07/10/1990 | US4940181 Pad grid array for receiving a solder bumped chip carrier |
| 07/10/1990 | CA1271397A1 Solder composition |
| 07/10/1990 | CA1271374A1 Process for improving the adherency of metallic coatings deposited without current on plastic surfaces |
| 07/10/1990 | CA1271311A1 Automatic jumper wire feeder |
| 07/09/1990 | CA2007294A1 Flux composition |
| 07/05/1990 | DE3844420A1 Verfahren und vorrichtung zum anschliessen flexibler leiterbahnen an anschlusskontakte Method and device for connect flexible conductor paths to connect contacts |
| 07/04/1990 | EP0376924A2 Gold compression bonding |
| 07/04/1990 | EP0376681A2 Release film composed of a laminate |
| 07/04/1990 | EP0376620A2 Method for processing plastic packaged electronic devices |
| 07/04/1990 | EP0376541A2 Removing meltable material |
| 07/04/1990 | EP0376494A1 Electroless plating of nickel on anodized aluminium |
| 07/04/1990 | EP0376439A1 Azeotropic compositions of 1,1,2-trichlorotrifluoroethane and trans-1, 2-dichloroethylene with ethanol, N-propanol isopronol and acetone or with ethanol or acetone and nitromethane |
| 07/04/1990 | EP0376207A2 Application device |
| 07/04/1990 | EP0376100A2 Method and lead frame for mounting a semiconductor |
| 07/04/1990 | EP0376055A2 Method of soldering a wireless component and circuit board with a soldered wireless component |
| 07/04/1990 | EP0375954A1 Method of manufacturing printed circuit board |
| 07/04/1990 | EP0375929A2 Method for patterning cationic curable photoresist |
| 07/04/1990 | EP0326577A4 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products. |
| 07/04/1990 | EP0260316B1 Solder delivery systems |
| 07/04/1990 | EP0245434B1 Device for aligning a photomask onto a printed wiring board |
| 07/04/1990 | CN1008681B Circuit element mounting system |
| 07/03/1990 | US4939792 Moldable/foldable radio housing |
| 07/03/1990 | US4939469 Non-destructive method for evaluation of printed wiring boards |
| 07/03/1990 | US4939341 Heated tool with multiple heating surfaces |
| 07/03/1990 | US4939029 Compressible temporary support for transfer layer |
| 07/03/1990 | US4939021 Multilayer ceramic copper circuit board |
| 07/03/1990 | US4938997 Printed circuits |
| 07/03/1990 | US4938996 Via filling by selective laser chemical vapor deposition |