Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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09/27/1990 | DE3907681A1 Method and apparatus for dispensing quantities of solder |
09/26/1990 | EP0389306A2 Procedure and inspecting an equipped printed circuit board, especially for inspecting the bonds on the board and apparatus for performing this procedure |
09/26/1990 | EP0389218A1 Process for reflow soldering |
09/26/1990 | EP0389195A2 A process of forming a patterned polyimide film and articles including such a film |
09/26/1990 | EP0389170A2 Method for fabricating electronic devices |
09/26/1990 | EP0389133A1 Azeotropic composition of 2,2-dichloro-1,1,1-trifluoroethane and methanol |
09/26/1990 | EP0389020A1 Surface-mounted multilayer capacitor and printed circuit board having such a multilayer capacitor |
09/26/1990 | EP0388980A2 LC circuit incorporated ceramic substrate |
09/26/1990 | EP0388888A2 Metal-organic macromolecular synthetic resin composite and process for producing the same |
09/26/1990 | CN1045675A Interface circuit with transient event tolerance |
09/26/1990 | CN1009734B Weldable thick polymeric coatings |
09/25/1990 | US4959761 Surface mounted led package |
09/25/1990 | US4959752 Electronic module RFI/EMI shielding |
09/25/1990 | US4959751 Ceramic hybrid integrated circuit having surface mount device solder stress reduction |
09/25/1990 | US4959750 Printed circuit board for carrying a mixed-component assembly |
09/25/1990 | US4959590 Lead connection structure |
09/25/1990 | US4959510 Thin film of indium-tin oxide or tin oxide, power supply conductor formed on a glass sheet |
09/25/1990 | US4959507 Rough surfaced copper sheet bonded to ceramic |
09/25/1990 | US4959295 Process of making a photosensitive semi-aqueous developable ceramic coating composition |
09/25/1990 | US4959278 Indium undercoat |
09/25/1990 | US4959255 Ceramic substrates and method of manufacturing the same |
09/25/1990 | US4959246 Vacuum |
09/25/1990 | US4959121 Nitric or hydrochloric acid |
09/25/1990 | US4959119 Method for forming through holes in a polyimide substrate |
09/25/1990 | US4959116 Printed circuits |
09/25/1990 | US4959019 Electric connection box |
09/25/1990 | US4959018 Electric connection box |
09/25/1990 | US4959008 Pre-patterned circuit board device-attach adhesive transfer system |
09/25/1990 | US4958911 Liquid crystal display module having housing of C-shaped cross section |
09/25/1990 | US4958560 Printing screen and method of printing a non-absorbent substrate |
09/25/1990 | CA1274590A1 Passive electric component |
09/25/1990 | CA1274456A1 Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards |
09/25/1990 | CA1274455A1 Copper etching process and solution |
09/25/1990 | CA1274430A1 Controlled atmosphere firing process |
09/23/1990 | CA2012445A1 Azeotropic composition of 2,2-dichloro-1,1,1-trifluoroethane and methanol |
09/22/1990 | WO1990011610A1 Electrically conductive feedthrough and process for manufacturing it |
09/20/1990 | WO1990011006A1 High capacitance laminates |
09/20/1990 | WO1990010999A1 Control arrangement for a seat heater |
09/20/1990 | WO1990010951A1 Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof |
09/20/1990 | WO1990010518A1 A fluxless soldering process |
09/20/1990 | DE3908068A1 Method for producing interconnects on a substrate panel for liquid-crystal cells |
09/20/1990 | CA2012579A1 Metal-organic macromolecular synthetic resin composite and process for producing the same |
09/19/1990 | EP0388341A2 Method and apparatus for causing an open circuit in a conductive line |
09/19/1990 | EP0388312A2 Chip carrier with improved flexing characteristic |
09/19/1990 | EP0388311A2 Chip Carrier |
09/19/1990 | EP0388278A1 Elaboration method for electrical-connection means, in particular interconnection substrates for hybrid circuits |
09/19/1990 | EP0388217A1 Circuit protection apparatus |
09/19/1990 | EP0388058A1 Bus bar interlayer connector structure |
09/19/1990 | EP0388039A2 Applicator for applying dry film solder mask on a board |
09/19/1990 | EP0388021A2 Interface circuit with transient event tolerance |
09/19/1990 | EP0388009A1 Method for forming via holes in polymer materials |
09/19/1990 | EP0387845A1 Reaction injection molded electrical distribution apparatus |
09/19/1990 | EP0387822A1 Photosensitive recording material and process for producing printed circuits |
09/19/1990 | EP0387741A1 Process and device for machining a workpiece using a laser beam |
09/19/1990 | EP0387554A2 Liquid epoxy polymer composition and use thereof |
09/19/1990 | EP0387526A1 Apparatus for the electrolytic treatment of work-pieces through a succession of baths |
09/19/1990 | CN1009686B Passive electric component |
09/18/1990 | US4958322 Semiconductor pseudo memory module |
09/18/1990 | US4958260 Molded circuit board |
09/18/1990 | US4958258 Modular hybrid microelectronic structures with high density of integration |
09/18/1990 | US4958050 Flexible printed circuit board |
09/18/1990 | US4957653 Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy |
09/18/1990 | US4957583 Apparatus for etching patterned substrates |
09/18/1990 | US4957044 Double sided screener for printed circuit boards |
09/18/1990 | US4956913 Pin alignment method |
09/17/1990 | CA2012359A1 Apparatus for galvanizing material ready for treatment |
09/17/1990 | CA2012338A1 Chip carrier |
09/17/1990 | CA2012337A1 Chip carrier |
09/16/1990 | CA2012178A1 Method for abtaining interconnection substrate electrical connection devices for hybrid circuits |
09/15/1990 | CA2029824A1 Control arrangement for a seat heater |
09/14/1990 | CA2006229A1 Method and apparatus for causing an open circuit in a conductive line |
09/13/1990 | DE4011223A1 Automatic stencil printing machine esp. for PCBs - has wiper blade, stencil and conveyor for removing printed circuit board |
09/13/1990 | DE3942076A1 Silver conductive path applicator - is pen with projecting pin from ball at end of tapering tube reservoir |
09/12/1990 | EP0387066A1 Process for connecting circuits and adhesive film used therefor |
09/12/1990 | EP0387057A1 Surface-treating agents for copper and copper alloy |
09/12/1990 | EP0387001A2 Method and apparatus for cleaning electronic and other devices |
09/12/1990 | EP0386918A2 An electrical device |
09/12/1990 | EP0386709A2 Noble metal-free chip conductor bridge and method for its production |
09/12/1990 | EP0386473A2 Drop-covering mass for electric and electronic devices |
09/12/1990 | EP0386459A1 Method for producing thin-film circuits |
09/12/1990 | EP0386458A1 Method for producing thin-film circuits with tin structures |
09/12/1990 | EP0386453A2 Connector and circuit package apparatus for pin array circuit module and circuit board |
09/12/1990 | EP0386378A2 Thin panel drilling method and apparatus |
09/12/1990 | EP0386279A1 A molded circuit board |
09/12/1990 | EP0385995A1 Embossing foil, in particular heat embossing foil, for producing conductive tracks on a substrate. |
09/12/1990 | EP0385979A1 High-density electronic modules, process and product. |
09/11/1990 | US4956239 Polymerization of phenylazides with uv light to form films of electroconductive polymers |
09/11/1990 | US4956221 Polysiloxanes |
09/11/1990 | US4956197 Plasma conditioning of a substrate for electroless plating |
09/11/1990 | US4956035 Composition and process for promoting adhesion on metal surfaces |
09/11/1990 | US4956022 Nitric acid, phosphoric acid, water mixtures and sodium nitrate, rinsing |
09/11/1990 | US4955820 T-leg SMT contact |
09/11/1990 | US4955819 Plug connector having bent contact posts for insertion into printed circuit board holes |
09/11/1990 | US4955814 Electrical connector device |
09/11/1990 | US4955132 Method for mounting a semiconductor chip |
09/11/1990 | US4955131 Method of building a variety of complex high performance IC devices |
09/11/1990 | CA1273853A1 Method for production of ceramic circuit board |
09/07/1990 | WO1990010369A1 Outer layer material of multilayer printed wiring board and production thereof |
09/07/1990 | WO1990010321A1 Method of forming contact bumps in contact pads |
09/07/1990 | WO1990010047A1 Fabrication of printed wiring boards by projection imaging |