Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2013
05/15/2013CN103100782A Ball grid array (BGA) pick-up component adjusting device
05/15/2013CN103100781A Printed circuit board (PCB) transmission system of selective crest welder capable of steadily transmitting
05/15/2013CN103100780A Welding location device with accurate location of selective crest welder
05/15/2013CN103100778A Heating mechanism mounting device of ball grid array (BGA) repair workstation
05/15/2013CN103100776A 回流焊接系统 Reflow soldering system
05/15/2013CN103100775A Ball grid array (BGA) - printed circuit board (PCB) relative position adjustment system
05/15/2013CN103100773A Wave crest generator lifting mechanism
05/15/2013CN103100770A Welding process of electronic component assembly
05/15/2013CN102244974B Hollowed-out FPC and manufacturing method thereof
05/15/2013CN102083279B Board incoming control method and device for horizontal line and horizontal line
05/15/2013CN102046853B Copper-foil roughening treatment and copper foil for printed circuit boards obtained using said treatment
05/15/2013CN102045949B Method for making rigid/flexible combined printed circuit board
05/15/2013CN102032885B Printed circuit board, method and device for detecting layer-to-layer registration of circuit graphs at two surfaces thereof
05/15/2013CN102029089B System and method for circulating and filtering chemical copper deposition solution
05/15/2013CN101998752B Circuit board structure and manufacturing method thereof
05/15/2013CN101971362B Positioning device to position one or more electronic circuit boards, in particular for photovoltaic cells, in a metal-deposition unit
05/15/2013CN101801589B In-containing lead-free solder for on-vehicle electronic circuit
05/15/2013CN101580956B Method and device for gold finger galvanizing cylinder to automatically input current
05/15/2013CN101357518B Adhesion layer on fluorinated polymers
05/14/2013US8441796 Electrical power substrate
05/14/2013US8440158 Pre-plating solutions for making printed circuit boards and methods for preparing the same
05/14/2013US8438727 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
05/14/2013US8438726 Method of manufacturing printed circuit board
05/14/2013US8438725 Method of moving a board imaging device and a mounting apparatus
05/14/2013US8438724 Method for producing substrate for mounting device and method for producing a semiconductor module
05/14/2013CA2599183C Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit
05/10/2013WO2013066751A1 Electromagnetic interference shielding techniques
05/10/2013WO2013065861A1 Apparatus for manufacturing electronic part, method of manufacturing electronic part, and method of manufacturing led illumination
05/10/2013WO2013065683A1 Base material for forming electroconductive pattern, circuit board, and method for producing each
05/10/2013WO2013065453A1 Thermoplastic liquid crystal polymer film, and laminate and circuit board using same
05/10/2013WO2013065420A1 Electronic component, assembly substrate, and method for manufacturing electronic component
05/10/2013WO2013065333A1 Furnace, control device therefor, control method therefor, and storage medium
05/10/2013WO2013065287A1 Method for manufacturing semiconductor package
05/10/2013WO2013065099A1 Method for manufacturing substrate having built-in component, and substrate having built-in component manufactured using same
05/10/2013WO2013064531A1 Circuit board made of ain with copper structures
05/10/2013WO2013064516A1 Device for emc filtering on a printed circuit
05/10/2013WO2013064048A1 Pcb back drill detection method and pcb plating
05/10/2013WO2013036862A3 Via structure for transmitting differential signals
05/10/2013CA2794098A1 Camera system for aligning components of a pcb
05/09/2013US20130115453 Hybrid nanostructure, a method for forming the hybrid nanostructure, and an electrode including a plurality of the hybrid nanostructures
05/09/2013US20130115426 Method of manufacturing flexible electronic device
05/09/2013US20130115369 Apparatus for forming circuit pattern on pcb and method for forming circuit pattern using the same
05/09/2013US20130114251 Illiminant device and manufacturing method of lamp holder
05/09/2013US20130114228 Electromagnetic interference shielding techniques
05/09/2013US20130114218 Electronic circuit, method of manufacturing electronic circuit, and mounting member
05/09/2013US20130113810 Sidewall spacers along conductive lines
05/09/2013US20130113757 Transparent conductive film and method for producing same
05/09/2013US20130113520 Method and apparatus for improved multiplexing using tri-state inverter
05/09/2013US20130113473 Magnetic sensor with shunting layers and manufacturing method thereof
05/09/2013US20130112566 Method for etching of copper and copper alloys
05/09/2013US20130112472 Method and apparatus for reducing interference
05/09/2013US20130112471 Printed circuit board and method of manufacturing the same
05/09/2013US20130112466 Electronic component and method for manufacturing the same
05/09/2013US20130112465 Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission
05/09/2013US20130112463 Printed Circuit Board and Manufacturing Method Thereof
05/09/2013US20130112462 Metal Alloy Cap Integration
05/09/2013US20130112461 Ceramic substrate and method of manufacturing the same
05/09/2013US20130111746 Method of manufacturing multilayer wiring substrate
05/09/2013US20130111745 Process for providing electrical connections with reduced via capacitance on circuit boards
05/09/2013US20130111744 Broad-area lighting systems
05/08/2013EP2590488A1 Method for manufacturing reusable paste, reusable paste, and method for manufacturing wiring substrate using reusable paste
05/08/2013EP2590487A1 Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards
05/08/2013EP2589488A1 Rectangular laminated body
05/08/2013EP2589459A1 Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
05/08/2013EP2589076A2 Bumpless build-up layer package design with an interposer
05/08/2013DE102012219904A1 Leiterplatte aus AlN mit Kupferstrukturen Board of AlN with copper structures
05/08/2013DE102011085924A1 Elektrisches Steuergerät für ein Kraftfahrzeug Electric control device for a motor vehicle
05/08/2013DE102011085832A1 Vorrichtung zur Kontaktierung eines richtungsabhängigen elektrischen und/oder elektronischen Bauteils und korrespondierende Bauteilanordnung An apparatus for contacting a direction-dependent electrical and / or electronic component and corresponding component arrangement
05/08/2013DE102011085714A1 Verfahren und Vorrichtung zur Erzeugung einer lasergestützten elektrisch leitfähigen Kontaktierung einer Objektoberfläche Method and device for producing a laser-based electrically conductive contacting of an object surface
05/08/2013DE102011055117A1 Metallizing a surface of polymeric-substrates useful for producing conductive structures during laser direct structuring-method, comprises e.g. metallizing the substrate wetted with an alkaline solution by chemical deposition of a metal
05/08/2013CN202931673U PCB tin spraying guide rail auxiliary apparatus
05/08/2013CN202931672U Surface mount machine bulk cargo box arrangement detection device
05/08/2013CN202931671U Support thimble applied to surface mount device
05/08/2013CN202931670U Novel automatic attaching machine for flexible printed circuit (FPC) boards
05/08/2013CN202931669U Circuit board copper cylinder assembly device
05/08/2013CN202925139U Quick PCB (printed circuit board) fishing device
05/08/2013CN202923096U Base plate device for two-sided silk-screen ultrathin PCB (Printed Circuit Board)
05/08/2013CN103098568A Method for producing a circuit board consisting of a plurality of circuit board areas and circuit board
05/08/2013CN103098567A 结构体和配线基板 Structures and the wiring substrate
05/08/2013CN103098566A Insulating composition for printed electronics in a conductor intersection
05/08/2013CN103098565A Substrate with built-in components
05/08/2013CN103098564A Multilayer printed circuit board and manufacturing method therefore
05/08/2013CN103098563A Connecting contact
05/08/2013CN103098562A Encapsulation and production of an encapsulated printed circuit board assembly
05/08/2013CN103098561A Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate
05/08/2013CN103098560A Differential signal transmission circuit and method for manufacturing same
05/08/2013CN103097956A Method and apparatus for performing pattern alignment
05/08/2013CN103097901A Continuity inspection apparatus and continuity inspection method
05/08/2013CN103097584A Device and method for spraying a surface of a substrate
05/08/2013CN103096647A Method for manufacturing bent type printed circuit board (PCB)
05/08/2013CN103096646A Method for manufacturing multiple layers of substrates of buried element
05/08/2013CN103096645A Lamination positioning method of multilayer circuit board
05/08/2013CN103096644A Exposure positioning structure used for resin plug hole electroplating bonding pad of ball grid array (BGA) and using method of exposure positioning structure
05/08/2013CN103096643A Method for detecting back drill holes of printed circuit board (PCB) and PCB being manufactured
05/08/2013CN103096642A Manufacture method of flexible circuit board
05/08/2013CN103096641A Manufacture method of contiguous circuit board
05/08/2013CN103096640A Method for processing metal-based printed circuit board (PCB) and tin printing jig for processing of metal-based PCB
05/08/2013CN103096639A Printing stencil and manufacturing method of printing stencil and method for printing solder paste
05/08/2013CN103096638A Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof
05/08/2013CN103096637A Printed circuit board (PCB) surface mounting system and technology