| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/08/2013 | CN103096636A Manufacture method and manufacture device of heat conduction structural component and heat conduction structural component |
| 05/08/2013 | CN103096635A Method of embedding magnetic element in substrate |
| 05/08/2013 | CN103096634A Jig for elements being dispersedly imbedded in and method of dispersedly imbedding elements in circuit board |
| 05/08/2013 | CN103096633A Solder resisting method for circuit board |
| 05/08/2013 | CN103096632A Eliminating scaling powder device and method used for hard disk drive printed circuit board (PCB) processing |
| 05/08/2013 | CN103096631A Processing method of printed circuit board (PCB) and PCB |
| 05/08/2013 | CN103096630A Method for manufacturing substrate with metal post and substrate manufactured by the same method |
| 05/08/2013 | CN103096629A Circuit board distressing method and circuit board destressing equipment |
| 05/08/2013 | CN103096628A High-frequency printed circuit board production method capable of improving third-order intermodulation stability |
| 05/08/2013 | CN103096627A Processing method of flexible printed circuit board heat dissipation part |
| 05/08/2013 | CN103096626A Wiring board measuring device and wiring board measuring method |
| 05/08/2013 | CN103096625A Sequential putting device and method |
| 05/08/2013 | CN103096624A Steel disc reinforcement installation sticking machine of flexible circuit board in manufacture procedure |
| 05/08/2013 | CN103096623A Temperature sensing plate of laminating machine |
| 05/08/2013 | CN103096622A Drilling method of manufacturing printed circuit board (PCB) and PCB |
| 05/08/2013 | CN103096621A Electric control device for a motor vehicle |
| 05/08/2013 | CN103096619A Circuit substrate, electronic device, electronic apparatus and method of manufacturing circuit substrate |
| 05/08/2013 | CN103096613A Printed circuit board and manufacture method thereof |
| 05/08/2013 | CN103091985A Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
| 05/08/2013 | CN103087582A Preparation method of low-temperature sintering nano copper conductive ink |
| 05/08/2013 | CN103085473A System for digital deposition of pad / interconnects coatings |
| 05/08/2013 | CN103084692A Nitrogen protection device |
| 05/08/2013 | CN102714923B Soldering device |
| 05/08/2013 | CN102519027B Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof |
| 05/08/2013 | CN102469689B Manufacturing process for PCB (Printed Circuit Board) step board |
| 05/08/2013 | CN102427669B Manufacture method of dual-sided printed circuit board |
| 05/08/2013 | CN102427665B Manufacturing technology of three-dimensional double-face aluminium substrate |
| 05/08/2013 | CN102421255B Processing method of electroplated lead applied to LED printed circuit board |
| 05/08/2013 | CN102388421B Low temperature fireable paste composition for forming an electrode or wiring |
| 05/08/2013 | CN102316677B Electroplating method for double-side and multilayer flexible printed circuit board |
| 05/08/2013 | CN102281700B Electrical structure of multilayer printed circuit board and manufacturing method thereof |
| 05/08/2013 | CN102256438B Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof |
| 05/08/2013 | CN102202469B Circuit board wet-processing system |
| 05/08/2013 | CN102164456B Automatic control method for printed circuit board etching technique |
| 05/08/2013 | CN102164454B Device and method for precisely combining circuit boards in manner of vacuum leveling circuit boards |
| 05/08/2013 | CN102123563B Method for manufacturing ceramic PCB (Printed Circuit Board) |
| 05/08/2013 | CN102113425B Flex-rigid wiring board and electronic device |
| 05/08/2013 | CN102083273B Method for laminating covering film of flexible printed circuit board |
| 05/08/2013 | CN102076178B Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same |
| 05/08/2013 | CN102036463B Multilayer circuit board |
| 05/08/2013 | CN102026471B Circuit board and manufacturing method thereof |
| 05/08/2013 | CN102017107B Joint structure and electronic component |
| 05/08/2013 | CN102007825B Wiring board and method for manufacturing the same |
| 05/08/2013 | CN101939130B Solder bonding structure and soldering flux |
| 05/08/2013 | CN101932188B Flexible printed circuit board and composition method thereof |
| 05/08/2013 | CN101930959B Copper conductive paste, method of manufacturing substrate with copper conductor filled in through-hole, circuit substrate, electronic component, semiconductor package |
| 05/08/2013 | CN101888742B Printed wiring board and process for producing the same |
| 05/08/2013 | CN101884254B Electronic apparatus produced using lead-free bonding material for soldering |
| 05/08/2013 | CN101663617B Photosensitive resin composition, dry film, and processed work made with the same |
| 05/08/2013 | CN101513139B Method and apparatuses for printing and printed product |
| 05/08/2013 | CN101242712B Felting thin film for circuit substrate, covering layer and circuit substrate using the same |
| 05/07/2013 | US8436252 Printed wiring board and method for manufacturing the same |
| 05/07/2013 | US8436249 Wiring substrate, electronic device, and method of manufacturing wiring substrate |
| 05/07/2013 | US8435641 Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby |
| 05/07/2013 | US8435603 Formation of solid layers on substrates |
| 05/07/2013 | US8435440 Method for forming a conductive pattern and a wired board |
| 05/07/2013 | US8434222 Method to manufacture a circuit apparatus having a rounded differential pair trace |
| 05/07/2013 | US8434221 Method for generating nano patterns upon material surfaces |
| 05/07/2013 | US8434220 Heat sink formed with conformal shield |
| 05/07/2013 | CA2557472C Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| 05/02/2013 | WO2013063320A1 Transparent conductive- and ito-replacement materials and structures |
| 05/02/2013 | WO2013062880A1 Continuous extrusion process for manufacturing a z-directed component for a printed circuit board |
| 05/02/2013 | WO2013062095A1 Reflow film, solder bump formation method, solder joint formation method, and semiconductor device |
| 05/02/2013 | WO2013061946A1 Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate |
| 05/02/2013 | WO2013061927A1 Appearance inspection device |
| 05/02/2013 | WO2013061727A1 Circuit board and electronic apparatus provided with same |
| 05/02/2013 | WO2013061500A1 Flexible wiring board and method for manufacturing same |
| 05/02/2013 | WO2013060828A1 Led printed circuit board with surface mounted spring |
| 05/02/2013 | WO2013060553A1 Electrically conductive contact element |
| 05/02/2013 | WO2013059985A1 Process for metallisation of holes in printed circuit board |
| 05/02/2013 | WO2013059980A1 Process for chemical plating of nickel and gold on circuit board |
| 05/02/2013 | WO2013034128A3 Conductor track unit for a motor vehicle |
| 05/02/2013 | US20130108088 Integrated circuit with configurable output cell |
| 05/02/2013 | US20130107486 Apparatus and Associated Methods |
| 05/02/2013 | US20130107485 Interconnect structures and methods of making the same |
| 05/02/2013 | US20130107482 Printed circuit board |
| 05/02/2013 | US20130107479 Silicon Interposer Systems |
| 05/02/2013 | US20130107468 Apparatus and method for stacking integrated circuits |
| 05/02/2013 | US20130107467 Circuit substrate, electronic device, electronic apparatus, and method of manufacturing circuit substrate |
| 05/02/2013 | US20130107440 Storage device and method for producing the same |
| 05/02/2013 | US20130106875 Method of improving thin-film encapsulation for an electromechanical systems assembly |
| 05/02/2013 | US20130106752 Double-layered capacitive touch panel and method for manufacturing a double-layered capacitive touch panel |
| 05/02/2013 | US20130106746 Systems for displaying images |
| 05/02/2013 | US20130106528 Asymmetrical multilayer substrate, rf module, and method for manufacturing asymmetrical multilayer substrate |
| 05/02/2013 | US20130105585 Packaged RFID Passive Tag for Small Sized Devices |
| 05/02/2013 | US20130105329 Method to form solder deposits and non-melting bump structures on substrates |
| 05/02/2013 | US20130105214 Method for manufacturing circuit board provided with metal posts and circuit board manufactured by the method |
| 05/02/2013 | US20130105213 Packaging substrate having embedded through-via interposer and method of fabricating the same |
| 05/02/2013 | US20130105212 Multilayer insulating substrate and method for manufacturing the same |
| 05/02/2013 | US20130105211 Low cost and high performance bonding of wafer to interposer & method of forming vias and circuits |
| 05/02/2013 | US20130105204 Circuit board and method for manufacturing the same |
| 05/02/2013 | US20130105203 Flexible electronic device, method for manufacturing same, and a flexible substrate |
| 05/02/2013 | US20130105201 Electronic component-embedded printed circuit board and method of manufacturing the same |
| 05/02/2013 | US20130105198 Conductive rubber component and method for mounting same |
| 05/02/2013 | US20130104654 Micromechanical component and method for manufacturing a micromechanical component |
| 05/02/2013 | US20130104653 Mems hemispherical resonator gyroscope |
| 05/02/2013 | US20130104394 Continuous Extrusion Process for Manufacturing a Z-directed Component for a Printed Circuit Board |
| 05/01/2013 | EP2587900A1 Joint structure manufacturing method, heating and melting treatment method, and system for same |
| 05/01/2013 | EP2587899A1 Sinterable bonding material using copper nanoparticles, process for producing same, and method of bonding electronic component |
| 05/01/2013 | EP2587898A1 Led printed circuit board with surface mounted spring |