Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2013
05/01/2013EP2587547A1 Methods for the closed-loop feedback control of the printing of a multilayer pattern of a solar cell
05/01/2013EP2587413A1 Antenna circuit structure body for ic card/tag and production method therefor
05/01/2013EP2586278A1 Insulating composition for printed electronics in a conductor intersection
05/01/2013EP2586277A1 Subsea control system
05/01/2013EP2585245A1 Compression box for reflow oven heating and related method
05/01/2013CN202918602U An auxiliary support used for soldering LED diodes on a PCB board
05/01/2013CN202918601U Tool used for welding circuit board
05/01/2013CN202918600U Element pin structure
05/01/2013CN202918599U Vertical element pin structure for being welded to PCB (Printed Circuit Board)
05/01/2013CN202918598U Maintenance jig of soldering block
05/01/2013CN202918597U PCB cleaning device
05/01/2013CN202918596U Character cleaning device for high density interconnected circuit board
05/01/2013CN202918595U Identification structure in technology of exposing high density interconnected circuit board
05/01/2013CN202918594U PCB plate reworking grill
05/01/2013CN202918593U Cover film fitting tool for flexible printed circuit board (FPC)
05/01/2013CN202918592U Laminating machine suitable for double-layer lamination
05/01/2013CN202918591U Stitching machine suitable for double-layer stitching of flexible circuit board
05/01/2013CN202918590U Vacuum absorption apparatus for PCB board
05/01/2013CN202918589U Liquid gold medicine storage apparatus for gold surface repairing of high-density interconnected circuit board
05/01/2013CN202918582U Rigid-flexible printed circuit board mixed pressing type laminated structure
05/01/2013CN202913070U Board inserting frame for PTH (Plated Through Hole) process of PCB (Printed Circuit Board)
05/01/2013CN202913058U Hanging basket used in copper deposition process
05/01/2013CN202911211U Base plate for lamination of copper-clad plate and PCB
05/01/2013CN202910040U Electronic product substrate cleaning device
05/01/2013CN1910971B Packaging and manufacturing of an integrated circuit
05/01/2013CN103081579A Laser processing method
05/01/2013CN103081578A Module substrate and method for manufacturing module substrate
05/01/2013CN103081576A Wiring substrate and electronic device
05/01/2013CN103081146A LED wiring board and light irradiation apparatus
05/01/2013CN103080568A Pick and bond method and apparatus for transferring adhesive element to substrate
05/01/2013CN103080247A Conductive metal ink composition, and method for preparing a conductive pattern
05/01/2013CN103079781A Drill hole entry sheet
05/01/2013CN103079751A Bi-sn-based high-temperature solder alloy
05/01/2013CN103079748A Laser processing method, and method for manufacturing multilayer flexible printed wiring board using same
05/01/2013CN103079739A Compression box for reflow oven heating and related method
05/01/2013CN103079365A Method for once molding inner-layer line of multilayer flexible circuit board
05/01/2013CN103079364A Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board
05/01/2013CN103079363A PCB (Printed Circuit Board) core board electroplating and porefilling process
05/01/2013CN103079362A Method for preventing oil from bleeding from solder resist ink plug hole
05/01/2013CN103079361A Method for plugging high-density through holes
05/01/2013CN103079360A Processing method for embedded circuit board
05/01/2013CN103079359A Rapid element adhering method
05/01/2013CN103079358A Mounter head
05/01/2013CN103079357A FPC (Flexible Printed Circuit) board die-cutting and component assembly process
05/01/2013CN103079356A Manufacturing process for copper-based printed circuit board with embedded circuits
05/01/2013CN103079355A PCB (printed circuit board) thick copper board ink printing method
05/01/2013CN103079354A Method for improving accuracy of resistance value of buried resistance printed circuit board
05/01/2013CN103079353A Method for improving overlength high frequency circuit board hole site working accuracy
05/01/2013CN103079352A Reinforcing method for printed plate
05/01/2013CN103079351A Linear sticking reinforcing process for PET (Polyethylene Terephthalate) film of flexible circuit board
05/01/2013CN103079350A Method for processing patterns in blind slot of printed circuit board
05/01/2013CN103079349A Precise positioning device for T-shaped reinforced steel sheet
05/01/2013CN103079348A Precise assigning, assembling and positioning device for reinforced steel sheet
05/01/2013CN103079347A Precise assigning and assembling cover plate separated positioning device for reinforced steel sheet
05/01/2013CN103079346A Processing method for printed circuit board with blind slot
05/01/2013CN103079345A Support frame for printed circuit board (PCB)
05/01/2013CN103079343A Circuit component
05/01/2013CN103079339A Metal ceramic composite substrate and manufacturing method for same
05/01/2013CN103077936A Wiring substrate and manufacturing method of the same
05/01/2013CN103076923A Double-sided touch sensitive panel and flex circuit bonding
05/01/2013CN103076719A Photosensitive resin composition, photosensitive component, forming method of corrosion-resistant pattern and manufacturing method of printed wiring board
05/01/2013CN103076718A Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern and process for producing printed circuit board, lead frame, semiconductor package and concavoconvex board
05/01/2013CN102361544B Circuit board surface mount technology (SMT)
05/01/2013CN102325432B Manufacturing method of cathode/anode aluminum foil circuit boards
05/01/2013CN102308679B Method of manufacturing multi-layered printed circuit board
05/01/2013CN102291940B Method for making printed circuit board (PCB) with step groove
05/01/2013CN102271456B Heat-conduction ceramic-based printed circuit board (PCB) and manufacture method thereof
05/01/2013CN102244983B Bubble remover
05/01/2013CN102215629B Printed circuit board, manufacturing method thereof as well as computer
05/01/2013CN102192905B Circuit board detection apparatus and detection method thereof
05/01/2013CN102123564B Conformal coating shielding method of circuit board
05/01/2013CN102106198B Semiconductor device and method for manufacturing same
05/01/2013CN102036468B Printed board and method of manufacturing printed board
05/01/2013CN101983131B Stencils with removable backings for forming micron-sized features on surfaces and methods of making and using the same
05/01/2013CN101507058B Build-up printed wiring board substrate having a core layer that is part of a circuit
05/01/2013CN101389190B Multilayer printed wiring board production method
04/2013
04/30/2013US8431828 Composite substrate
04/30/2013US8431007 Electro-thinning apparatus for removing excess metal from surface metal layer of substrate and removing method using the same
04/30/2013US8430027 Frame unit for tensioning a printing screen and a jig for fitting a printing screen to or removing a printing screen from a frame unit
04/30/2013US8429815 Manufacturing method of substrate, manufacturing method of wiring board, wiring board, electronic device, electron source, and image display apparatus
04/30/2013US8429814 Method of assembling a multi-component electronic package
04/30/2013US8429813 Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads
04/30/2013US8429811 Tool replacement method for tandem press system and tandem press system
04/25/2013WO2013059715A2 Iron based alloys for bioabsorbable stent
04/25/2013WO2013058380A1 Adhesive composition, connection structure and method for producing same
04/25/2013WO2013058379A1 Microwave heating device and microwave heating method
04/25/2013WO2013058351A1 Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate
04/25/2013WO2013058299A1 Solder bump formation method and device
04/25/2013WO2013058287A1 Method for manufacturing coupled printed circuit board and coupled printed circuit board
04/25/2013WO2013058169A1 Method for forming through holes in insulating substrate and method for manufacturing insulating substrate for interposer
04/25/2013WO2013058117A1 Electronic-substrate electrical design device using three-dimensional space, electrical design method, program, and computer-readable recording medium
04/25/2013WO2013058039A1 Resin substrate having built-in component
04/25/2013WO2013057252A2 Device for soldering
04/25/2013WO2013056818A1 Contacting of an antenna
04/25/2013WO2013033034A3 Method for making high-density electrical interconnections using rivet bonds
04/25/2013WO2013032726A3 Glass as a substrate material and a final package for mems and ic devices
04/25/2013WO2013032725A3 Glass as a substrate material and a final package for mems and ic devices
04/25/2013US20130100626 Wiring substrate and manufacturing method of the same
04/25/2013US20130100625 Wiring board, semiconductor device and method for manufacturing wiring board
04/25/2013US20130100562 Electrostatic discharge clamp with controlled hysteresis including selectable turn on and turn off threshold voltages