Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2013
05/22/2013CN103114288A Etching solution, supplying solution and method of forming copper wiring
05/22/2013CN103111714A Wave crest welding machine scaling powder mist spraying device with uniform spraying and coating
05/22/2013CN103111713A Crest width adjustable crest nozzle device used for crest injection machine
05/22/2013CN103111711A Energy-saving grouping preheating control system of crest welder
05/22/2013CN103111709A Selective crest welder printed circuit board (PCB) locating device
05/22/2013CN103111708A Reciprocating type printed circuit board (PCB) selective crest welder
05/22/2013CN103111707A Novel control system of selective crest welder
05/22/2013CN103111706A Wave crest generator capable of recovering welding slag
05/22/2013CN103111705A Control system of crest welder
05/22/2013CN103111704A Electromagnetic wave crest generator
05/22/2013CN103111703A Reciprocating selectivity crest welder control system
05/22/2013CN103111702A Selective wave soldering device
05/22/2013CN102421254B Method for adhering island adhesive tape to flexible printed circuit
05/22/2013CN102333416B Unidirectional reinforcement material laminating system and method
05/22/2013CN102300399B Multifunctional laminated electronic diaphragm and production method thereof
05/22/2013CN102291943B Method for manufacturing printed circuit board
05/22/2013CN102291941B Method for processing lines of thick copper plate
05/22/2013CN102281724B Method for machining double-sided windowed plug hole
05/22/2013CN102143657B Method for processing wireless gold-plating printed plate
05/22/2013CN101998767B Method and system of managing board assembling line
05/22/2013CN101911845B Mounted board and method for manufacturing the same
05/22/2013CN101676059B Method and device for perforating printed circuit board
05/22/2013CN101496455B Flexible printed board, electronic equipment with the same mounted thereon, and method for folding up the same
05/22/2013CN101276143B Method and system for patterning a mask layer
05/21/2013US8447566 Mounting condition determining method
05/21/2013US8446732 Circuit module
05/21/2013US8445095 Hot-press sheet
05/21/2013US8445094 Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers
05/16/2013WO2013070371A1 Method for making an electrical inductor and related inductor devices
05/16/2013WO2013069947A1 Tape carrier package and method of manufacturing the same
05/16/2013WO2013069506A1 Printing machine
05/16/2013WO2013069237A1 Wiring board, conductive paste used in wiring board, and method for manufacturing wiring board
05/16/2013WO2013069183A1 Screen printing device and screen printing method
05/16/2013WO2013069175A1 Cut-out sintered ceramic sheet and method of manufacturing the same
05/16/2013WO2013069093A1 Method for manufacturing component-embedded substrate and component-embedded substrate manufactured thereby
05/16/2013WO2013068054A1 Method and system for producing circuit boards
05/16/2013WO2013043434A3 A method, system for manufacturing a circuit board, and the circuit board thereof
05/16/2013US20130123891 High density terminal contacts for stimulation lead and stimulation system employing the same, and method of stimulation lead fabrication
05/16/2013US20130122833 Radio frequency package on package circuit
05/16/2013US20130122430 Method of manufacturing printed circuit board for optical waveguide
05/16/2013US20130122216 Structure of embedded-trace substrate and method of manufacturing the same
05/16/2013US20130121652 Optical communication module and method of manufacturing the same
05/16/2013US20130120977 mSolder-Less Electrical Assembly and Process for its Manufacture
05/16/2013US20130120957 Rf shielding for electronic components
05/16/2013US20130120949 Method of manufacturing passive component module
05/16/2013US20130120947 Electrical device with connection interface, circuit board thereof, and method for manufacturing the same
05/16/2013US20130120827 Optical element array, method of forming optical element array, display device and electronic apparatus
05/16/2013US20130120288 Touch-sensing panel including electrode-integrated window, and manufacturing method thereof
05/16/2013US20130120016 Probe card and method for manufacturing the same
05/16/2013US20130118795 Method and apparatus for reducing interference
05/16/2013US20130118793 Method for filling through hole of substrate with metal and substrate
05/16/2013US20130118792 Printed circuit board and method for manufacturing the same
05/16/2013US20130118791 Laminated wiring board and manufacturing method for same
05/16/2013US20130118790 Localized Skew Compensation Technique for Reducing Electromagnetic Radiation
05/16/2013US20130118784 High strength through-substrate vias
05/16/2013US20130118780 Wireless terminal with reduced specific absorption rate peak and implementation method thereof
05/16/2013US20130118779 Clearance filling printed circuit board and method of manufacturing the same
05/16/2013US20130118672 Substrate bonding method
05/16/2013US20130118009 Method for manufacturing printed circuit board
05/16/2013US20130118008 Thermal interface material application for integrated circuit cooling
05/16/2013DE112011102163T5 Pb-freie Lotlegierung Pb-free solder alloy
05/16/2013DE112007000238B4 Schablonendrucker zum Aufbringen von Lötpaste auf die Oberfläche eines elektronischen Substrates A stencil printer for depositing solder paste onto the surface of an electronic substrate
05/16/2013DE10295972B4 Nicht in einer Form hergestellte Packung für eine Halbleiteranordnung und Verfahren zur Herstellung Not manufactured in a mold package for a semiconductor device and method for producing
05/16/2013DE102012110536A1 Elektrisch leitfähiges material und elektronische einrichtung, welche dieselbe verwendet Electrically conductive material and electronic device which uses the same
05/15/2013EP2592915A1 Laminated wiring board and manufacturing method for same
05/15/2013EP2592914A1 Clamping element
05/15/2013EP2592912A1 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
05/15/2013EP2592697A1 Electrical connector
05/15/2013EP2591916A2 Support system and method for a screen printing unit
05/15/2013EP2591912A1 Multilayer assembly and composite material comprising same
05/15/2013EP2591645A1 Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
05/15/2013EP2591644A1 Connecting contact
05/15/2013CN202941044U Silk-screen tool for LED heat radiating substrate
05/15/2013CN1902051B A frame unit for tensioning a printing screen and a jig for fitting a printing screen to or removing a printing screen from a frame unit
05/15/2013CN103109589A Method for producing circuit board
05/15/2013CN103109588A Method for forming solder resist pattern
05/15/2013CN103109587A Coating method for an optoelectronic chip-on-board module
05/15/2013CN103108730A Entry sheet for drilling
05/15/2013CN103108722A 激光加工方法 The laser processing method
05/15/2013CN103108503A Method of manufacturing multilayer wiring substrate
05/15/2013CN103108502A Method for laminating cover film in soft board
05/15/2013CN103108501A Microwell plate chemical copper activating back scrubbing process and system thereof
05/15/2013CN103108500A Method for manufacturing sectional gold finger
05/15/2013CN103108499A Packaging method and packaging device of flexible electronic circuit
05/15/2013CN103108498A Method of placing parts on printed circuit board (PCB) circuit board surfaces
05/15/2013CN103108497A Printed circuit board (PCB) fixing device
05/15/2013CN103108496A Installation mechanism of selective wave welding device nozzle
05/15/2013CN103108495A Automatic feeding mechanism of mounter
05/15/2013CN103108494A Imaging component stretching device in BGA repair workstation
05/15/2013CN103108493A Damp-proof processing method of electronic circuit board
05/15/2013CN103108492A Manufacturing method and manufacturing device of flexible printed circuit
05/15/2013CN103108491A Circuit board and manufacture method thereof
05/15/2013CN103108490A Circuit manufacturing method of super-thick copper circuit board
05/15/2013CN103108489A Microwave irradiation device of bonding sheet for printed circuit board and method thereof
05/15/2013CN103108487A Circuit board for coupling universal serial bus (USB) 3.0 socket connector and cable lines and coupling method thereof
05/15/2013CN103108485A Multi-layer printed circuit board and manufacturing method thereof
05/15/2013CN103108114A Camera system for aligning components of a PCB
05/15/2013CN103105732A Polyimide precursor composition and wiring circuit board employing the composition
05/15/2013CN103103599A Dehydration device of vertical plating line loading clamps
05/15/2013CN103100793A Three-dimensional circuit laser machining device