H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
12/1994
12/27/1994	US5376403 Blend of solder powder, blocked crosslinking agent with fluxing properties and a reactive monomer or polymer
12/27/1994	US5376326 Methods for making multilayer printed circuit boards
12/27/1994	US5376308 Coating solution for forming transparent conductive coating and process for preparing same
12/27/1994	US5376209 Process for preparing an assembly of an article and a polymide which resists dimensional change, delamination and debonding when exposed to changes in temperature
12/27/1994	US5375471 Conformal circuit with harsh environment isolation materials
12/27/1994	US5375322 Method of manufacturing circuit board having lateral conductive pattern
12/27/1994	US5375321 Selectively etching one side of double-clad, dielectric substrate to form connectors subsequently positioned near the bottom of the grooves by folding and pressing
12/27/1994	CA1333732C Curable composition containing difunctional epoxy resin, a polyfunctional resin, a difunctional phenol and a polyfunctional phenol
12/22/1994	WO1994029900A1 Heat dissipative means for integrated circuit chip package
12/22/1994	WO1994029887A1 Molded electric part and its manufacture
12/22/1994	WO1994029145A1 Hybrid junction box
12/21/1994	EP0630176A1 Electrical assembly
12/21/1994	EP0630174A1 High-density packaging for multiple removable electronics subassemblies
12/21/1994	EP0629217A1 Rigid-rod polymers
12/21/1994	EP0629216A1 Fluorinated resins with low dielectric constant
12/21/1994	EP0605712A4 Packaging electrical components.
12/21/1994	CN1096623A Jig for detecting warp of pringed circuit board and method of producing printed circuit board
12/20/1994	US5375039 Circuit board heat dissipation layering arrangement
12/20/1994	US5375035 Capacitor mounting structure for printed circuit boards
12/20/1994	US5374940 System for operating a plurality of graphics displays from a single computer
12/20/1994	US5374848 Thermal stress resistant semiconductor device mounting arrangement
12/20/1994	US5374788 Printed wiring board and manufacturing method therefor
12/20/1994	US5374469 Flexible printed substrate
12/20/1994	US5374454 Method for conditioning halogenated polymeric materials and structures fabricated therewith
12/20/1994	US5374453 Particulate filled composite film and method of making same
12/15/1994	DE4420060A1 Stripline filter
12/14/1994	EP0629110A2 Method of forming conductive pattern on substrate
12/14/1994	EP0629108A1 Supply distribution bus bar for component support, the component support and distribution strips for joining the busbar with the support
12/14/1994	EP0629107A2 Multiple wiring and X section printed circuit board technique
12/14/1994	EP0628999A1 Sealed feedthrough for a thickfilm ceramic substrate and method of making the same
12/14/1994	EP0628062A1 Process for the preparation of an isotropic polyimide film
12/14/1994	EP0478606B1 Process for the preparation of epoxy-terminated polyoxazolidones and of electrical laminates therefrom
12/13/1994	US5373478 Non-volatile memory board
12/13/1994	US5373418 Electrical device for mounting electrical components with enhanced thermal radiating properties
12/13/1994	US5373187 Package body for integrated circuit
12/13/1994	US5373114 Circuit substrate
12/13/1994	US5373113 Solder reflow mounting board
12/13/1994	US5373112 Multilayered wiring board having printed inductor
12/13/1994	US5373108 Dual durometer ribbon and method of manufacture
12/13/1994	US5372891 Flexible copper/polyimide and barbituric acid modified bismaleimide blend/polyimide laminate
12/13/1994	US5372872 Multilayer printed circuit board
12/13/1994	US5372871 Circuit board for optical element
12/13/1994	US5372750 Electrically conductive screen printable compositions and method of making the same
12/13/1994	US5372749 Method for surface treating conductive copper powder with a treating agent and coupler
12/13/1994	US5372666 Method of manufacturing a multilayered circuit board
12/13/1994	US5372512 Electrical interconnect system for a flexible circuit
12/08/1994	WO1994028598A1 Planar cable array
12/08/1994	WO1994028597A1 Electrical interconnect assembly
12/08/1994	WO1994028459A1 Electrical connection of devices incorporating multiple liquid crystal cells
12/08/1994	WO1994028046A1 Thermally cross-linkable heat-sealing adhesive
12/08/1994	DE4418453A1 Device for producing printed circuit board assemblies
12/08/1994	CA2163756A1 A thermally crosslinkable heat-sealing adhesive
12/07/1994	EP0627875A1 Process for manufacturing metal-ceramic substrate
12/07/1994	EP0627874A1 Process for making through-hole connections in printed circuit boards
12/07/1994	EP0627760A1 Subdivisible substrate and method of making the same
12/07/1994	EP0627651A2 Film cartridge with a detachable, orientation independant, memory module
12/07/1994	EP0525060B1 Miniature multiple conductor electrical connector
12/06/1994	US5371653 Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus
12/06/1994	US5371569 Mounting apparatus of flexible printed circuit board
12/06/1994	US5371407 Electronic circuit with diamond substrate and conductive vias
12/06/1994	US5371390 Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits
12/06/1994	US5371327 Heat-sealable connector sheet
12/06/1994	US5371326 Non-toxic fabric conductors and method for making same
12/06/1994	US5371324 Lightweight, noncorrosive and excellent electroconductivity; used for telephones, electrostatic copying machine, printers, electronic calculators, video tapes, and electronic ranges
12/06/1994	US5371029 Process for making a leadless chip resistor capacitor carrier using thick and thin film printing
12/06/1994	US5370907 Forming a metallized layer on an AlN substrate by applying and heating a paste of a metal composed of W and Mo
12/06/1994	US5370766 Forming conductive layer on substrate, forming patterned dielectric layer thereon, formed patterned thin film conductor above the dielectric layer to provide inductor
12/06/1994	US5370540 Circuit board connector and a board using the same
12/06/1994	US5369880 Method for forming solder deposit on a substrate
11/1994
11/30/1994	EP0626714A1 Method of manufacturing a printed board fuse and a fuse produced by the method
11/30/1994	EP0626124A1 High density conductive networks and method and apparatus for making same
11/30/1994	EP0413808B1 Control arrangement for a seat heater
11/30/1994	CN1095856A Capacitor and assembly disposing the same
11/30/1994	CN1095848A Magnetic head unit
11/30/1994	CN1095728A 环氧树脂和环氧树脂组合物 Epoxy resin and the epoxy resin composition
11/29/1994	US5369551 Surface mount stress relief interface system and method
11/29/1994	US5369491 Method for measuring the reciprocal displacement of the layers of a multilayer arrangement and apparatus for performing this method
11/29/1994	US5369220 Wiring board having laminated wiring patterns
11/29/1994	US5369067 Reaction of alumina sol, silica sol, magnesium nitrite, calcium nitrate and boric acid, printed circuits
11/29/1994	US5369058 Warp-resistent ultra-thin integrated circuit package fabrication method
11/29/1994	US5369056 Thinning by removal of casings, supporting and thinning
11/29/1994	US5368922 Prepreg of thermoplastic polymer particles in liquid thermosettable resin
11/29/1994	US5368921 Glass fabrics impregnated with resin
11/29/1994	US5368220 Sealed conductive active alloy feedthroughs
11/29/1994	US5367764 Method of making a multi-layer circuit assembly
11/29/1994	CA2018050C Structure of a duplexer for radio equipment
11/29/1994	CA1333241C Aluminum nitride sintered body formed with metallized layer and method of manufacturing the same
11/24/1994	WO1994027319A1 Power semiconductor device with stress buffer layer
11/24/1994	WO1994027302A1 Metallic film resistor having fusing function and method for its manufacture
11/24/1994	WO1994026950A1 Metallic films and articles using same
11/24/1994	WO1994026815A1 Composite material comprising a treated reinforcing filler and a polymer matrix formed by polycondensation with aldehyde, and relative production method
11/24/1994	WO1994026422A1 Metalized coating process
11/24/1994	CA2162473A1 Metallic films and articles using same
11/23/1994	EP0555407A4 Stacked configuration for integrated circuit devices
11/22/1994	USRE34794 Gull-wing zig-zag inline lead package having end-of-package anchoring pins
11/22/1994	US5367435 Electronic package structure and method of making same
11/22/1994	US5367195 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
11/22/1994	US5367124 Compliant lead for surface mounting a chip package to a substrate
11/22/1994	US5367006 Superior thermal transfer adhesive
11/22/1994	US5366814 Copper foil for printed circuits and process for producing the same

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