Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
05/1998
05/19/1998US5754093 Thick-film printed substrate including an electrically connecting member and method for fabricating the same
05/19/1998US5754088 Planar transformer and method of manufacture
05/19/1998US5753976 Multi-layer circuit having a via matrix interlayer connection
05/19/1998US5753974 Electronic device assembly
05/19/1998US5753968 Low loss ridged microstrip line for monolithic microwave integrated circuit (MMIC) applications
05/19/1998US5753372 Wiring structures and method of manufacturing the same
05/19/1998US5753358 Adhisive-filler polymer film composite
05/19/1998US5753299 Method and apparatus for forming termination stripes
05/19/1998US5752857 Smart card computer adaptor
05/19/1998US5752851 Circuit clip connector
05/19/1998US5752550 Warpwise unidirectional glass fabric with leno binding threads
05/19/1998US5752446 Alignment systems
05/14/1998WO1998020717A1 A board magazine for printed circuit boards
05/14/1998WO1998020716A1 Electrical means for extracting layer to layer registration
05/14/1998WO1998020714A1 Foldable electronic assembly module
05/14/1998WO1998020557A1 Method for reducing via inductance in an electronic assembly and device
05/14/1998WO1998020555A1 Method for minimizing warp in the production of electronic assemblies
05/14/1998WO1998020550A1 Method for controlling warp of electronic assemblies by use of package stiffener
05/14/1998WO1998020549A1 Use of variable perforation density in copper layer to control cte
05/14/1998WO1998020548A1 Package for mounting an integrated circuit chip
05/14/1998WO1998020545A1 Method for manufacturing high tolerance cavities in chip packages
05/14/1998WO1998020542A1 Electronic parts device
05/14/1998WO1998020540A1 Method and apparatus for improving wireability in chip modules
05/14/1998WO1998020534A1 Method for using fiducial schemes to increase nominal registration
05/14/1998WO1998020528A1 METHOD FOR IMPROVING RELIABILITY OF THIN CIRCUIT SUBSTRATES BY INCREASING THE Tg OF THE SUBSTRATE
05/14/1998WO1998020523A2 Method for selectively plating an organic substrate
05/14/1998WO1998020488A2 Data processing of a bitstream signal
05/14/1998WO1998020403A2 Flexible wearable computer system
05/14/1998WO1998020402A2 Hand-held computer with communication through diffuse infrared with positioning sensors
05/14/1998DE19701854C1 Electronic module housing for use in automobile
05/14/1998DE19646774A1 High frequency circuit equalisation method for television tuner
05/14/1998DE19646513A1 Printed circuit device e.g. for foil keyboard
05/14/1998DE19646088A1 Multi-layer electric circuit board with capacitive interference suppression e.g. for high speed microprocessor
05/14/1998DE19646004A1 Electronic switching apparatus
05/13/1998EP0841412A1 High-tensile electrolytic copper foil and process for producing the same
05/13/1998EP0840676A1 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
05/13/1998EP0767815A4 Compatibilized lcp blends
05/13/1998EP0619935B1 Multi-layer circuit construction methods and structures with customization features and components for use therein
05/13/1998CN1181767A Process for producing a polyamide based on a dicarboxylic acid and a diamine
05/13/1998CN1181629A Semiconductor chip-mounting board and mounting method for semiconductor chip
05/13/1998CN1181619A Flip chip attach on flexible circuit carrier using chip with metallic cap on solder
05/13/1998CN1181618A External terminal fabrication method for ball grid array package
05/13/1998CN1181397A Heat resistant resin composition and adhesive sheet using the same
05/12/1998US5752182 Hybrid IC
05/12/1998US5752119 Arrangement of structure in a camera for reduced thickness
05/12/1998US5751557 Printed circuit board having a triple pattern footprint for receiving one of three component packages
05/12/1998US5751555 Electronic component having reduced capacitance
05/12/1998US5751256 Resonant tag labels and method of making same
05/12/1998US5751063 Multi-chip module
05/12/1998US5750935 Mounting device for attaching a component through an aperture in a circuit board
05/12/1998US5750929 Terminal assembly for a CATV
05/12/1998US5750926 Hermetically sealed electrical feedthrough for use with implantable electronic devices
05/12/1998US5750606 Blend with nonionic surfactant and preservative
05/12/1998US5750417 Method of manufacturing a device having a support bar with conductor tracks for electrically contacting a semiconductor element
05/12/1998US5750375 Methods of producing secreted receptor analogs and biologically active dimerized polypeptide fusions
05/12/1998US5750194 Process for producing a metal paste
05/12/1998US5749143 Process for forming a module
05/12/1998CA2020606C Resin molded articles for forming plated layer and use thereof
05/07/1998WO1998019508A1 A method and a device for shielding of electronic components on a circuit board
05/07/1998WO1998019506A1 Laminates for printed circuits using unidirectional glass fabric
05/07/1998WO1998019505A1 Solder bonded electronic module
05/07/1998WO1998019393A1 Method for producing an electrical component and resulting component
05/07/1998WO1998019371A1 Vehicle power distribution box
05/07/1998WO1998019225A1 Gap-coupling bus system
05/07/1998WO1998018845A1 Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
05/07/1998WO1998018838A1 Modified thermoplastic norbornene polymer and process for the production thereof
05/07/1998WO1998018837A1 Modified thermoplastic norbornene polymer and process for the production thereof
05/07/1998WO1998018615A1 Conductive elastomers and methods for fabricating the same
05/07/1998WO1998014040A3 A method and a device for shielding an electrical component
05/07/1998DE19735904A1 Lead frame for discrete component or integrated circuit mounting
05/07/1998DE19715926A1 Ball grid array component external connection production
05/07/1998DE19643911A1 Opto-electronic integrated circuit arrangement
05/06/1998EP0840543A2 AC coupled termination of a printed circuit board power plane in its characteristic impedance
05/06/1998EP0840541A1 Video card
05/06/1998EP0840539A1 Wired telecommunication equipment with electromagnetic interference protection
05/06/1998EP0840443A1 High-frequency amplifier
05/06/1998EP0840372A2 Thermal dissipation system in 800 micrometer printed circuit
05/06/1998EP0840198A2 Method and apparatus for increasing computer memory capacity
05/06/1998EP0840129A2 Backing plate for IC test fixture
05/06/1998EP0839868A1 Heat resistant resin composition and adhesive sheet using the same
05/06/1998EP0839598A2 Processes for producing metal-ceramics composite substrates and brazing materials for use in such processes
05/06/1998EP0839439A1 Method for forming fiducial mark in resin stencil and stencil formed thereby
05/06/1998CN1181117A Glass fabric product with continuous yarn twisted and driected, and use thereof
05/06/1998CN1180932A Coaxial Interconnect devices and methods of making the same
05/06/1998CN1180856A Heat conductive substrate mounted in PC board hole for transferring heat from IC heat sink
05/05/1998US5749049 Method and apparatus for measuring the inherent capacitance of a circuit supporting substrate
05/05/1998US5748451 Power distribution/stiffener for active back plane technologies
05/05/1998US5748450 BGA package using a dummy ball and a repairing method thereof
05/05/1998US5748448 Solid-state image sensor assembly with image sensor element chip mounted in package
05/05/1998US5748426 Method for interfacing to a powered bus
05/05/1998US5748209 Thermal ink jet tab circuit having a plurality of trace groups wherein adjacent traces in each group are staggered
05/05/1998US5748006 High-frequency-transmission printed wiring board, probe card, and probe apparatus
05/05/1998US5747982 Multi-chip modules with isolated coupling between modules
05/05/1998US5747877 Semiconductor chip package with enhanced thermal conductivity
05/05/1998US5747876 Semiconductor device and semiconductor module
05/05/1998US5747875 Semiconductor power module with high speed operation and miniaturization
05/05/1998US5747743 Coil-shaped flexible printed circuit board
05/05/1998US5747396 Glass and ceramic substrate using the same
05/05/1998US5747222 Multi-layered circuit substrate and manufacturing method thereof
05/05/1998US5746868 Multilevel interconnections are connected through vias
1 ... 810 811 812 813 814 815 816 817 818 819 820 821 822 823 824 825 826 827 828 829 830 ... 986