| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/25/1998 | DE19653361A1 Leiterfolie Conductor foil |
| 06/25/1998 | DE19653360A1 Leiterfolie zur leitenden Verbindung von elektrischen und/oder elektronischen Baukomponenten Conductor foil for the conductive connection of electric and / or electronic structural components |
| 06/25/1998 | CA2275614A1 Connector assembly, and associated method, for radio frequency circuit device |
| 06/25/1998 | CA2246405A1 Circuit board having electric component and its manufacturing method |
| 06/24/1998 | EP0849983A1 Process to create metallic stand-offs on a circuit board |
| 06/24/1998 | EP0849982A1 Improved transistor/resistor printed circuit board layout |
| 06/24/1998 | EP0849981A1 Doublesided or multilayered copper laminated printed circuit board and method of making the same |
| 06/24/1998 | EP0849800A1 Multichip module with differently packaged integrated circuits and method of manufacturing it |
| 06/24/1998 | EP0792463A4 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 06/24/1998 | EP0729652A4 Contact structure for interconnections, interposer, semiconductor assembly and method |
| 06/23/1998 | US5771158 Printed circuit board, printed circuit board used for flat panel display drive circuit, and flat panel display device |
| 06/23/1998 | US5771144 Cleaning device for a contact surface of a printed circuit board |
| 06/23/1998 | US5770993 Thermal fuse |
| 06/23/1998 | US5770988 Thin-film multilayered electrode and method of fabricating same |
| 06/23/1998 | US5770681 Trienes |
| 06/23/1998 | US5770476 Passive interposer including at least one passive electronic component |
| 06/23/1998 | US5770300 Multilayered metallic printed board and molded module |
| 06/23/1998 | US5769996 Forming patterned array by magnetic alignment of electroconductive non-magnetic particles dispersed within magnetic ferrofluid carrier |
| 06/23/1998 | US5769989 Integrated circuit device adhesively attached to solder layer on carrier board having solder filled via(s) passing through board beneath mounting site so that solder can be melted from reverse for device detachment |
| 06/23/1998 | US5769987 Post-firing method for integrating passive devices into ceramic electronic packages |
| 06/23/1998 | US5769985 Firing green sheet composed of ceramic layer covered with patterned thin film of first metal and thicker film of second metal whereby photoresist burns away and first metal diffuses into ceramic layer as dielectric oxide |
| 06/23/1998 | US5769645 Electrical connector for dual printed circuit boards |
| 06/23/1998 | US5768776 Method for forming a controlled impedance flex circuit |
| 06/18/1998 | WO1998026641A1 Electronic component and mounting method and device therefor |
| 06/18/1998 | WO1998026639A1 Multilayered printed wiring board |
| 06/18/1998 | WO1998026476A1 Electrical connection with inwardly deformable contacts |
| 06/18/1998 | WO1998026431A1 Cyclic olefin polymer composites having a high dielectric constant |
| 06/18/1998 | WO1998026305A1 Transmitter/receiver module for a phased array radar |
| 06/18/1998 | DE19752555A1 Sende/Empfangsmodul für ein phasengesteuertes Radar Transmitting / receiving module for a phased array radar |
| 06/17/1998 | EP0848585A1 Process for the manufacture of printed circuit boards with plated resistors |
| 06/17/1998 | EP0848583A1 Display device |
| 06/17/1998 | EP0848451A2 Device for electrically and mecanically connnecting two printed circuit boards situated at a distance from each other and apparatus comprising two printed circuit boards situated at a distance from each other connected with such a device |
| 06/17/1998 | EP0848447A2 Transmission circuit using strip line in three dimensions |
| 06/17/1998 | EP0847869A1 Barrier layer for laser ablative imaging |
| 06/17/1998 | EP0847596A1 Imaging system and method |
| 06/17/1998 | EP0504288B1 Fluorinated poly(naphthyl ethers) |
| 06/17/1998 | CN1185087A Sheet for heat transfer substrate and method for mfg. the sheet, and heat transfer substrate using same and mfg. method therefor |
| 06/17/1998 | CN1184725A Process for preparing metal powder |
| 06/17/1998 | CN1038807C Printing wiring board |
| 06/16/1998 | US5768109 Multi-layer circuit board and semiconductor flip chip connection |
| 06/16/1998 | US5768108 Multi-layer wiring structure |
| 06/16/1998 | US5768107 Electric circuit substrate having a multilayer alignment mark structure |
| 06/16/1998 | US5768106 Layered circuit-board designing method and layered circuit-board |
| 06/16/1998 | US5768105 Flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board |
| 06/16/1998 | US5767817 Antenna apparatus having chip antenna and capacitance generating device |
| 06/16/1998 | US5767753 Multi-layered bi-directional coupler utilizing a segmented coupling structure |
| 06/16/1998 | US5767621 Display device having plate with electron guiding passages |
| 06/16/1998 | US5767580 Systems having shaped, self-aligning micro-bump structures |
| 06/16/1998 | US5767576 Snap lines localize cracks and cleavages formed by bending stress to the snap line |
| 06/16/1998 | US5767503 Method for the manufacture of contact-free cards |
| 06/16/1998 | US5767450 Coated conductor and production method of same and electronic components and electronic devices that use it |
| 06/16/1998 | US5766750 Imbibing mixture of filler and adhesive resin into voids of an expanded polytetrafluoroethylene film; improved thermal, mechanical, electrical properties |
| 06/16/1998 | US5766741 Insulating paste and thick-film multi-layered printed circuit using the paste |
| 06/16/1998 | US5766740 Circuit |
| 06/16/1998 | US5766670 Via fill compositions for direct attach of devices and methods for applying same |
| 06/16/1998 | US5766516 Silver-based conductive paste and multilayer ceramic circuit substrate using the same |
| 06/16/1998 | US5766499 Deposition of metallic layer circuit pattern including element which precisely marks position of tool alignment hole and is sacrificed after formation of hole through substrate; simplification |
| 06/16/1998 | US5766493 Method of fabricating a liquid crystal display substrate |
| 06/16/1998 | US5766392 Method of manufacturing a multilayer ceramic electronic component |
| 06/16/1998 | US5766386 Method of producing metal clad laminate |
| 06/16/1998 | US5766027 Cable assembly with equalizer board |
| 06/16/1998 | US5766022 Electrical assembly |
| 06/11/1998 | WO1998025443A1 Electronic circuit with a screening case to attenuate high-frequency interference |
| 06/11/1998 | WO1998025306A1 High-power microwave-frequency hybrid integrated circuit |
| 06/11/1998 | WO1998025253A1 Components for electrical and electronic circuits |
| 06/11/1998 | WO1998025090A1 Spherical shaped semiconductor integrated circuit |
| 06/11/1998 | WO1998024558A1 Grafted thermoplastic elastomer barrier layer |
| 06/10/1998 | EP0847084A2 Electronic modules manufacturing |
| 06/10/1998 | EP0779905B1 Epoxy resin mixtures for prepregs and composites |
| 06/10/1998 | DE19721967A1 Memory component with base platelet and several types of applied unit platelets |
| 06/10/1998 | DE19703058C1 Non-conductive substrate for chip card carrier element |
| 06/10/1998 | DE19650813A1 Foil circuit-board system for easy recycling |
| 06/10/1998 | CN1184333A Memory device module |
| 06/10/1998 | CN1184260A Tape carrier package and display device using the same |
| 06/09/1998 | US5764793 Method of and apparatus for inspecting pattern defects |
| 06/09/1998 | US5764497 Circuit board connection method and connection structure |
| 06/09/1998 | US5764491 Power distribution system for a multi-layer circuit board having a component layer, a ground layer, and an insulation layer |
| 06/09/1998 | US5764489 Apparatus for controlling the impedance of high speed signals on a printed circuit board |
| 06/09/1998 | US5764488 Printed circuit board having a dual pattern footprint for receiving one of two component packages |
| 06/09/1998 | US5764485 For connecting an electronic component |
| 06/09/1998 | US5764390 Holographic method for generating three dimensional conformal photo-lithographic masks |
| 06/09/1998 | US5764146 Multifunction occupancy sensor |
| 06/09/1998 | US5764119 Wiring board for high-frequency signals and semiconductor module for high-frequency signals using the wiring board |
| 06/09/1998 | US5764117 Method of manufacturing a dielectric resonant apparatus |
| 06/09/1998 | US5764010 Control system for an automotive vehicle multi-functional apparatus |
| 06/09/1998 | US5763951 Non-mechanical magnetic pump for liquid cooling |
| 06/09/1998 | US5763949 Surface-mount semiconductor package |
| 06/09/1998 | US5763939 Semiconductor device having a perforated base film sheet |
| 06/09/1998 | US5763854 Machine for laser reflow soldering |
| 06/09/1998 | US5763609 Dibenzpthiophenecarboxamide derivative binding to brain dopamine receptors |
| 06/09/1998 | US5763339 Insulating glass composition |
| 06/09/1998 | US5763140 Photodefinable dielectric composition useful in the manufacture of printed circuits |
| 06/09/1998 | US5763093 Aluminum nitride body having graded metallurgy |
| 06/09/1998 | US5763060 Printed wiring board |
| 06/09/1998 | US5763059 Circuit board |
| 06/09/1998 | US5763058 Electrical circuit component formed of a conductive liquid printed directly onto a substrate |
| 06/09/1998 | US5761792 Method for making a battery pack |
| 06/09/1998 | CA2036253C Thermoplastic resin composition |
| 06/09/1998 | CA2014571C Radial type of parallel system bus structure |
| 06/04/1998 | WO1998024279A1 An apparatus for mounting electronics and a method of manufacturing such an apparatus |