Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/1998
10/13/1998US5819579 Forming die for manufacturing printed circuits
10/13/1998US5819403 Method of manufacturing a semiconductor chip carrier
10/08/1998WO1998044769A1 Moulded sockets for electronic component attachment
10/08/1998WO1998044768A1 Method of arranging signal and destination pads to provide multiple signal/designation connection combinations
10/08/1998WO1998044607A1 Arrangement for protection against electrostatic discharge in electronic apparatuses
10/08/1998WO1998044599A1 Contact arrangement
10/08/1998WO1998044598A1 Flexible film circuit connector
10/08/1998WO1998044593A1 Electrical connection between a circuit support and a strip conductor support
10/08/1998WO1998044564A1 Chip with internal signal routing in external element
10/08/1998WO1998044557A1 High-voltage, high-current multilayer circuit board, method for the production thereof
10/08/1998WO1998044550A1 Laser-induced cutting of metal interconnect
10/08/1998WO1998044547A1 Method for manufacturing semiconductor device
10/08/1998WO1998044544A1 Low dielectric constant material with improved dielectric strength
10/08/1998WO1998043470A2 Mounting structure for an acceleration sensor
10/08/1998DE19743280C1 Electronic equipment identification marker for computers
10/08/1998DE19719238C1 Electronic circuit board for automobile electronic device
10/08/1998DE19713642A1 Contactless chipcard manufacturing method
10/08/1998CA2284072A1 Three dimensional molded sockets for mechanical and electrical component attachment
10/08/1998CA2283383A1 Method of arranging signal and destination pads to provide multiple signal/designation connection combinations
10/07/1998EP0869704A1 Method of mounting components on a printed circuit board
10/07/1998EP0868961A1 Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method
10/07/1998EP0868838A1 Passive component
10/07/1998EP0868732A1 Poly(phenylene sulfide) composites having a high dielectric constant
10/07/1998EP0628062B1 Process for the preparation of an isotropic polyimide film
10/07/1998CN1195422A Method for mounting semiconductor chip
10/07/1998CN1195263A Flexible thin film ball grid array containing solder mask
10/07/1998CN1195262A Process to create metallic stand-offs on electronic circuit
10/07/1998CN1195194A Metallization in semiconductor devices
10/07/1998CN1195001A Electroconductive copper paste composition
10/06/1998US5818779 Board having a plurality of integrated circuits
10/06/1998US5818697 Flexible thin film ball grid array containing solder mask
10/06/1998US5818692 Apparatus and method for cooling an electrical component
10/06/1998US5818499 Recording head with integrally mounted impedance elements
10/06/1998US5818315 Signal trace impedance control using a grid-like ground plane
10/06/1998US5818253 Signal transmitting device, circuit block and integrated circuit suited to fast signal transmission
10/06/1998US5818101 Arrangement for the protection of electrical and electronic components against electrostatic discharge
10/06/1998US5818071 Silicon carbide metal diffusion barrier layer
10/06/1998US5817986 Three dimensional package and architecture for high performance computer
10/06/1998US5817736 Epoxy resin mixtures for prepregs and composites based on phosphorus-modified epoxies, dicy and/or aminobenzoic compounds
10/06/1998US5817405 Metallization
10/06/1998US5817404 Thermoconductivity
10/06/1998US5816868 Capillary action promoting surface mount connectors
10/06/1998US5816828 Socket
10/01/1998WO1998043311A2 Flexible strip transmission line
10/01/1998WO1998043295A1 Circuit board and production method thereof
10/01/1998WO1998043227A1 Wiring board, and display device and electronic equipment using the same
10/01/1998WO1998042510A2 Viewing and imaging systems
10/01/1998DE19712749A1 PCB for high current or high voltage applications
10/01/1998DE19709940A1 Plug-in electronic module e.g. for personal computer
09/1998
09/30/1998EP0867942A2 Liquid crystal display apparatus
09/30/1998EP0867932A2 Method for making wire connections
09/30/1998EP0867852A1 Display panel having diodes mounted on printed circuits
09/30/1998EP0867783A2 A segmented electrode development roll
09/30/1998EP0867529A1 A method and apparatus for sequentially metalizing polymeric films and products made thereby
09/30/1998EP0867342A2 Electrical distribution centre for a motor vehicle and method of producing the same
09/30/1998EP0867293A2 Process for joining a flexible circuit to a polymeric container and for forming a barrier layer over sections of the flexible circuit and other elements using an encapsulant material
09/30/1998EP0676082B1 Water-based polymer thick film conductive ink
09/30/1998EP0649565B1 Fitting unit for multilayer hybrid circuit with power components
09/30/1998CN1194725A 成像系统及方法 The imaging system and method
09/30/1998CN1194485A 电击保护器 Electric shock protection
09/30/1998CN1040052C High performance electrical connector
09/30/1998CA2226149A1 Method of manufacturing a printed circuit board assembly
09/29/1998US5815374 Method and apparatus for redirecting certain input/output connections of integrated circuit chip configurations
09/29/1998US5815373 Coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit
09/29/1998US5815224 Liquid crystal display device having video signal driving circuit mounted on one side
09/29/1998US5815001 Integrated circuit board with built-in terminal connection testing circuitry
09/29/1998US5814847 General purpose assembly programmable multi-chip package substrate
09/29/1998US5814535 Supporting member for cooling means, electronic package and method of making the same
09/29/1998US5814405 Microporous membranes with high strength
09/29/1998US5814393 Flexible printed circuit
09/29/1998US5814366 Capacitor interposed between green insulator layers; lamination; firing; removing release green sheets
09/29/1998US5814267 Ceramic material on substrate; liquid crystal display device
09/29/1998US5814248 Conductive paste composition and method for producing a ceramic substrate
09/29/1998US5814203 Process to decrease the strength of an electric field produced by a high voltage conductive path of a printed circuit board and printed circuit assembly using same
09/29/1998US5814165 Melting and flowing a metal on glass substrate, cleaning metal particles, treatment with laser, focusing for particle migration
09/29/1998US5813881 Programmable cable and cable adapter using fuses and antifuses
09/24/1998WO1998042167A2 Method and device for measuring a device for producing electrical components
09/24/1998DE4447631C2 Carrier elements for holding components in electrical appts.
09/24/1998DE19810617A1 High frequency transformer hybrid for HF mixer in printed circuit, etc.
09/24/1998DE19713661C1 Kontaktanordnung Contact arrangement
09/24/1998DE19711533A1 Printed circuit board with integrated cooling arrangement
09/24/1998DE19710504A1 Optisch-elektrisches Modul Optical-electrical module
09/24/1998DE19710344A1 Manufacturing method for electric printed circuit board
09/23/1998EP0866649A1 Highly heat-conductive composite magnetic material
09/23/1998EP0865905A2 Laminate of liquid crystal polyester resin composition
09/23/1998EP0865653A2 Electrically conducting reaction resin mixture
09/23/1998EP0776596A4 Rigid flex printed circuit board
09/23/1998EP0761075A4 Printed circuit board socket
09/23/1998EP0736242A4 Method of surface mounting radio frequency components and the components
09/22/1998US5812934 Method and apparatus for a cross-connect system with automatic facility information transference to a remote location
09/22/1998US5812797 Computer having a high density connector system
09/22/1998US5812387 Multi-deck power converter module
09/22/1998US5812380 Mesh planes for multilayer module
09/22/1998US5812379 Small diameter ball grid array pad size for improved motherboard routing
09/22/1998US5812378 Microelectronic connector for engaging bump leads
09/22/1998US5812375 Electronic assembly for selective heat sinking and two-sided component attachment
09/22/1998US5812349 Magnetic head apparatus including separation features
09/22/1998US5812039 Apparatus for providing a ground for circuits on carriers
09/22/1998US5811883 Design for flip chip joint pad/LGA pad
09/22/1998US5811736 Electronic circuit cards with solder-filled blind vias
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