Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/1998
10/27/1998US5827605 Ceramic multilayer substrate and method of producing the same
10/27/1998US5827084 Electrical connector assembly with interleaved multilayer structure and fabrication method
10/27/1998US5827074 End mounting terminator for backplanes
10/22/1998WO1998047340A1 A shielding housing and a method of producing a shielding housing
10/22/1998WO1998047331A1 Wiring board, wiring board fabrication method, and semiconductor package
10/22/1998WO1998047326A1 Wiring board having vias
10/22/1998WO1998047320A2 Multifunctional printed circuit board with an opto-electronically active component
10/22/1998WO1998047179A1 Printed wiring board and method for manufacturing the same
10/22/1998WO1998046937A1 Lighting apparatus
10/22/1998WO1998046827A1 Dispersions of aramid fibres and aramid sheets
10/22/1998WO1998020403A3 Flexible wearable computer system
10/22/1998DE19738550A1 Multiple layer conductor structure e.g. for electronic circuit
10/22/1998DE19716651A1 Circuit board labelling device
10/22/1998DE19716044A1 Selective solder electrodeposition on circuit board pads
10/22/1998DE19715658A1 Multifunktions-Leiterplatte mit opto-elektronisch aktivem Bauelement Multifunction board with opto-electronically active component
10/21/1998EP0873047A2 Production of insulating varnishes and multilayer printed circuit boards using these varnishes
10/21/1998EP0873046A1 Printed wiring board device
10/21/1998EP0872912A2 Circular-polarization antenna
10/21/1998EP0872890A1 High frequency module
10/21/1998EP0872888A2 Ball grid array module
10/21/1998EP0872882A2 Method of fabricating a curved metal-ceramic-substrate
10/21/1998EP0872301A1 Ultrasonic welding of copper foil
10/21/1998EP0872165A1 Circuit board with screening arrangement against electromagnetic interference
10/21/1998EP0872099A1 A method and device to fasten a loudspeaker to a circuit board
10/21/1998EP0871568A1 Conductive film composite
10/21/1998EP0804866B1 Electronic circuit structure
10/21/1998EP0781501B1 Monolithic lcp polymer microelectronic wiring modules
10/21/1998CN1196869A Microelectronic lead structures with dielectric layers
10/21/1998CN1196868A Method and circuit board panel for preventing assembly-line delamination and sagging for circuit board manufacturing
10/21/1998CN1196794A Machine for opposite control of printed circuits
10/21/1998CN1196635A High-frequency modulator built-in TV. tuner
10/20/1998US5826126 Flexible printed circuit board housing structure for a camera
10/20/1998US5825635 Warp prevention and cable holding structure for printed circuit board
10/20/1998US5825632 Oxides of silicon, boron and alkali metal
10/20/1998US5825631 Method for connecting two substrates in a thick film hybrid circuit
10/20/1998US5825630 Electronic circuit board including a second circuit board attached there to to provide an area of increased circuit density
10/20/1998US5825625 Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
10/20/1998US5825146 Motor drive device
10/20/1998US5824959 Flexible electrical cable and associated apparatus
10/20/1998US5824950 To be secured to a printed circuit board
10/20/1998US5824454 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
10/20/1998US5823830 Tailess compliant contact
10/20/1998US5823800 Printed circuit board socket
10/20/1998US5823799 Single-sided, straddle mount printed circuit board connector
10/20/1998US5823736 Substrate processing device and method for substrate from the substrate processing device
10/20/1998US5822856 Manufacturing circuit board assemblies having filled vias
10/20/1998US5822855 Method of making electrical connector having a two part articulated housing
10/20/1998US5822850 Circuit devices and fabrication Method of the same
10/15/1998WO1998046057A1 Backplane stiffener
10/15/1998WO1998046023A1 Computer system and process for capture, editing and playback of motion video compressed using interframe and intraframe techniques
10/15/1998WO1998045921A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
10/15/1998WO1998045881A1 Substrate with conductor formed of low-resistance aluminum alloy
10/15/1998WO1998045804A1 Chip card with a riveted joint
10/15/1998WO1998045362A1 Thermoplastic molding materials
10/15/1998WO1998030967A3 Flexible touchpad circuit with mounted circuit board
10/15/1998WO1998021272A3 Manufacture of composites of inorganic powder and polymer materials
10/15/1998DE19715080C1 Temperature sensor for remote operation employing thermocouple
10/15/1998DE19714548A1 Thermoplastische Formmassen A thermoplastic molding material
10/15/1998DE19708802A1 Electrical circuit with voltage and current limiting devices
10/15/1998CA2275197A1 Thermoplastic molding materials
10/15/1998CA2256378A1 Substrate with conductor formed of low-resistance aluminum alloy
10/14/1998EP0871352A1 Integrated circuit device cooling structure
10/14/1998EP0871351A1 Female terminal
10/14/1998EP0871258A1 Input/output connector for portable communication device and process for mounting the said connector
10/14/1998EP0871220A2 Pin usage of a semiconductor package
10/14/1998EP0871219A2 Metal-based semiconductor circuit substrates
10/14/1998EP0870805A2 Epoxy composition for printed circuit boards
10/14/1998EP0870795A1 Composite film comprising low-dielectric resin and para-oriented aromatic polyamide
10/14/1998EP0870418A1 Electronic assembly with semi-crystalline copolymer adhesive
10/14/1998EP0870362A1 Method for producing an electrical component and resulting component
10/14/1998EP0870349A1 Electrical connector assembly with interleaved multilayer structure and fabrication method
10/14/1998EP0870325A1 Microelectronic mounting with multiple lead deformation
10/14/1998EP0779902B1 Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound
10/14/1998EP0768952B1 Polymeric film containing silicone resin and clay
10/14/1998EP0712534B1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits
10/14/1998CN1195963A Apparatus for heat removal using flexible backplane
10/14/1998CN1195962A Assembly and method of assembly
10/14/1998CN1195960A Return circuit basilar plate
10/14/1998CN1195873A 保护插头 Protection plugs
10/14/1998CN1040268C 传输线 Transmission line
10/13/1998US5822652 Compact design for combination of an electrical circuit with a segmented electrode development roll
10/13/1998US5822640 Camera including dual sided auxiliary circuit board
10/13/1998US5822551 Passive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU board
10/13/1998US5822191 Integrated circuit mounting tape
10/13/1998US5822042 Three dimensional imaging system
10/13/1998US5821994 Image pickup and data processing apparatus having a plurality of special-purpose detachable substrates
10/13/1998US5821859 Concealed magnetic ID code and antitheft tag
10/13/1998US5821846 High current ferrite electromagnetic interference suppressor and associated method
10/13/1998US5821845 Electromagnetic noise absorber
10/13/1998US5821619 Replaceable power module
10/13/1998US5821614 Card type semiconductor device
10/13/1998US5821606 Semiconductor device
10/13/1998US5821604 Integrated circuit device having shield structure against electromagnetic wave
10/13/1998US5821483 Modular array of switches, switch actuators, printed circuit boards, housing and electrical connector
10/13/1998US5821317 Comprising a catalyst and a hardener; printed wiring boards
10/13/1998US5821305 Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound
10/13/1998US5821181 Having low dielectric constant, small electrical loss, adjustable coefficient of resonance frequency
10/13/1998US5820972 Resistance against electrical discharge; insulating layer with flaky inorganic filler in organic insulating material
10/13/1998US5820843 Raw material for producing powder of indium-tin oxide aciculae and method of producing the raw material, powder of indium-tin oxide aciculae and method of producing the powder, electroconductive paste and light-transmitting electroconductive film
10/13/1998US5819858 Circuit board having a metal matrix composite inlay
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