Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
04/1998
04/08/1998EP0835047A2 RF-driven semiconductor device
04/08/1998EP0835046A1 Component mounting board, process for producing the board, and process for producing the module
04/08/1998EP0835045A2 Grounded flexible printed circuitry with improved impedance characteristics
04/08/1998EP0834921A2 Multi-layer circuit construction method and structures with customization features and components for use therein
04/08/1998EP0834887A2 Chip component
04/08/1998EP0834370A1 Coated metal powder and process for preparing the same by decomposition
04/08/1998EP0834369A1 Process for preparing metal powder
04/08/1998EP0834368A1 Nickel powder and process for preparing the same
04/08/1998EP0834242A1 Connection substrate
04/08/1998EP0834195A1 Flexible leads for tape ball grid array circuit
04/08/1998EP0834169A1 Tesselated electroluminescent display having a multilayer ceramic substrate
04/08/1998CN1178625A Printed circuit board and manufacture thereof
04/08/1998CN1178602A High performance integrated circuit package
04/08/1998CN1037972C Epoxy resin (A)
04/07/1998US5737272 Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus
04/07/1998US5737190 Digital input/output circuit board
04/07/1998US5737053 Wire substrate having branch lines perpendicular to the main lines in which the branch lines connect to driving circuits on a display device
04/07/1998US5736929 System for concealed serialization utilizing a soft magnetic antitheft element
04/07/1998US5736796 Printed circuit board having split voltage planes
04/07/1998US5736790 Semiconductor chip, package and semiconductor device
04/07/1998US5736784 Variable-width lead interconnection structure and method
04/07/1998US5736780 Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes
04/07/1998US5736681 Printed wiring board having an interconnection penetrating an insulating layer
04/07/1998US5736680 Polymorphic rectilinear thieving pad
04/07/1998US5736679 Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board
04/07/1998US5736261 Conductive paste
04/07/1998US5736234 Multilayer printed circuit board having latticed films on an interconnection layer
04/07/1998US5736191 Applying electroconductive coating to a substrate surface which has pattern of microridges, then partial removal gives electrically isolated areas without loss of strength
04/07/1998US5736070 Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
04/07/1998US5735332 Method for making a ceramic metal composite
04/07/1998US5735040 Method of making IC card
04/02/1998WO1998014040A2 A method and a device for shielding an electrical component
04/02/1998WO1998014039A1 Passive component
04/02/1998WO1998014038A1 Device for mounting hybrid connections on printed circuit boards
04/02/1998WO1998013875A1 Hybrid microwave-frequency integrated circuit
04/02/1998WO1998013870A1 Chip module and manufacturing process
04/02/1998WO1998013206A1 Thermal head
04/02/1998WO1997047103A3 Reconfigurable node for a communications network
04/02/1998DE19641397A1 Manufacturing process for heat conducting printed circuit boards
04/02/1998DE19640255A1 Electronic module manufacturing method for contactless motor vehicle pedal switch contg. Hall sensor
04/02/1998DE19639704A1 System of contacts especially for chip-card-reading equipment
04/02/1998DE19639646A1 Carrier element for semiconductor chip
04/02/1998DE19639025A1 Chipmodul und Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module,
04/02/1998DE19638195A1 Lead-free dielectric paste
04/01/1998EP0833550A2 Circuit board with strain relief for connecting cable, process for manufacturing and connecting the same as well as its use
04/01/1998EP0833383A2 Power module circuit board and a process for the manufacture thereof
04/01/1998EP0832918A1 Resin etching solution and etching process
04/01/1998EP0832859A1 Dielectric material with low temperature coefficient and high unloaded quality, process for producing the same, and single/multilayer circuit board containing the same
04/01/1998EP0832546A1 Ground plane routing
04/01/1998EP0832448A1 Method of manufacturing passive elements using conductive polypyrrole formulations
04/01/1998EP0495035B1 Method of applying metallized contacts to a solar cell
04/01/1998CN1177902A Circuit board assembly and heat conducting device thereof
04/01/1998CN1177751A Resin etching solution and etching method thereof
03/1998
03/31/1998US5734560 Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap
03/31/1998US5734555 Shared socket multi-chip module and/or piggyback pin grid array package
03/31/1998US5734394 Kinematically fixing flex circuit to PWA printbar
03/31/1998US5734327 For a resonance detection system
03/31/1998US5734262 Matrix of switched antenna elements having a conductor pattern supported on individual insulators for measuring electromagnetic radiation
03/31/1998US5734008 Polyimide film
03/31/1998US5733823 Prepreg for printed circuit board and substrate for printed circuit using said prepreg
03/31/1998US5733640 Thin film wiring
03/31/1998US5733639 Circuit board assembly with foam substrate and method of making same
03/31/1998US5733598 Printed circuits
03/31/1998US5733467 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
03/31/1998US5733133 Pin socket connector for print circuit board
03/30/1998CA2216679A1 Transition adapter for conductor cable
03/26/1998WO1998012903A1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion
03/26/1998WO1998012902A1 Flexible conductive tape connection
03/26/1998WO1998012897A1 Modularized hearing aid circuit structure
03/26/1998DE19702532A1 Embedded integrated circuit chip smart card, e.g. for bank, identification card
03/26/1998DE19637626A1 Flexible Leiterbahnverbindung Flexible circuit connection
03/26/1998CA2265992A1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion
03/26/1998CA2265947A1 Modularized hearing aid circuit structure
03/25/1998EP0831682A1 Circuit board
03/25/1998EP0831528A2 Multilayer wiring board for mounting semiconductor device and method of producing the same
03/25/1998EP0831072A1 Low-permittivity glass fibers
03/25/1998EP0830671A1 Integrated head-electronics interconnection suspension for a data recording disk drive
03/25/1998EP0793903B1 Coating for the structured production of conductors on the surface of electrically insulating substrates
03/25/1998CN1177273A Printed circuit board
03/25/1998CN1177272A Cirucit substrate, circuit-formed suspension substrate, and prodn. method thereof
03/25/1998CN1176969A Circuit substrate, circuit-formed suspension substrate, and prodn. method thereof
03/24/1998US5731960 Printed circuit board
03/24/1998US5731636 Semiconductor bonding package
03/24/1998US5731547 Circuitized substrate with material containment means and method of making same
03/24/1998US5731542 Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
03/24/1998US5731541 Screening element and process for producing it
03/24/1998US5731400 Fabricating free standing film of soluble rigid rod polyether substituted with solubilizing side group by melting polymer and extruding through slit
03/24/1998US5731086 Nonconductor, isotropic film
03/24/1998US5731067 Multi-layered substrate
03/24/1998US5731066 Electronic circuit device
03/24/1998US5730890 Method for conditioning halogenated polymeric materials and structures fabricated therewith
03/24/1998US5730853 Depositing copper layer over cleaned surface; heating; applying acid to remove oxides
03/24/1998US5730620 Method and apparatus for locating electrical circuit members
03/24/1998US5730543 Electrically conducting connection
03/24/1998US5729897 Method of manufacturing multilayer foil printed circuit boards
03/24/1998US5729896 Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder
03/24/1998US5729893 Process for producing a multilayer ceramic circuit substrate
03/19/1998WO1998011765A2 Improvements relating to inductive assemblies in electronic circuits
03/19/1998WO1998011757A1 Digital crosspoint switch
03/19/1998WO1998011605A1 Circuit board for mounting electronic parts
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