| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/05/1998 | US5746267 Monolithic metal matrix composite |
| 05/05/1998 | US5745989 Method of preparation of an optically transparent article with an embedded mesh |
| 05/05/1998 | US5745987 Method for bonding circuit boards to pallets |
| 05/04/1998 | CA2219703A1 Wire telecommunication equipment with protection against electromagnetic interference |
| 04/30/1998 | WO1998018303A1 A system and method for packaging integrated circuits |
| 04/30/1998 | WO1998018302A1 Means and method for mounting electronics |
| 04/30/1998 | WO1998018301A1 Optical/electrical hybrid wiring board and its manufacturing method |
| 04/30/1998 | WO1998018015A1 Apparatus for testing of printed circuit boards |
| 04/30/1998 | DE19644555A1 Brake booster for automobile hydraulic braking system |
| 04/29/1998 | EP0838978A2 Low-loss electrical interconnects |
| 04/29/1998 | EP0838977A1 Laminates for printed circuits using unidirectional glass fabric |
| 04/29/1998 | EP0838854A2 Wired board with improved bonding pads |
| 04/29/1998 | EP0838793A2 Infra-red motion detector |
| 04/29/1998 | EP0838792A2 Multifunction occupancy sensor |
| 04/29/1998 | EP0838791A2 Multifunction sensor and network sensor system |
| 04/29/1998 | EP0838133A1 Device for mounting electrical components on printed-circuit boards |
| 04/29/1998 | CN1180433A Method of producing smart card |
| 04/28/1998 | US5745426 Memory card and circuit board used therefor |
| 04/28/1998 | US5745339 Packing element including a foam plastic body and a device relating to this packing element |
| 04/28/1998 | US5745334 Capacitor formed within printed circuit board |
| 04/28/1998 | US5745333 Laminar stackable circuit board structure with capacitor |
| 04/28/1998 | US5745326 Magnetic disk drive |
| 04/28/1998 | US5745258 Image control apparatus with a plurality of functional units provided on separate printed boards, and mounting structure of the printed boards |
| 04/28/1998 | US5745149 Thermal printing head |
| 04/28/1998 | US5744862 Reduced thickness semiconductor device with IC packages mounted in openings on substrate |
| 04/28/1998 | US5744516 Biodegradable resin molded article |
| 04/28/1998 | US5744285 Multilayer; electroconductive and dielectric layers |
| 04/28/1998 | US5744283 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material |
| 04/28/1998 | US5744232 Low loss, thick film metallizations for multilayer microwave packaging |
| 04/28/1998 | US5744171 System for fabricating conductive epoxy grid array semiconductor packages |
| 04/28/1998 | US5743750 Circuit board assembly |
| 04/28/1998 | US5743007 Method of mounting electronics component |
| 04/28/1998 | US5743004 Method of forming electronic multilayer printed circuit boards or cards |
| 04/28/1998 | CA2035694C Composite dielectric and printed-circuit use substrate utilizing the same |
| 04/28/1998 | CA2031549C Electroless plating of nickel onto surfaces such as copper or fused tungsten |
| 04/23/1998 | WO1998016900A1 Chip card with a contact zone and method of producing such a chip card |
| 04/23/1998 | WO1998016482A1 Glass fiber of low permittivity |
| 04/23/1998 | WO1998016383A1 Method to control cavity dimensions of fired multilayer circuit boards on a support |
| 04/23/1998 | DE19643217A1 Method of manufacturing resistive elements on circuit board |
| 04/22/1998 | EP0837623A1 Method for the manufacture of printed circuit boards with plated resistors |
| 04/22/1998 | EP0837516A2 High-frequency composite part |
| 04/22/1998 | EP0837090A1 Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances |
| 04/22/1998 | EP0836892A2 Transfer sheet, and pattern-forming method |
| 04/22/1998 | EP0836631A1 A microfiber-reinforced porous polymer film |
| 04/22/1998 | EP0753101A4 Engine components including ceramic-metal composites |
| 04/22/1998 | EP0727045A4 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics |
| 04/21/1998 | US5742486 Reusable electronic circuit building set with interchangeable modular components |
| 04/21/1998 | US5742484 Flexible connector for circuit boards |
| 04/21/1998 | US5742483 Method for producing circuit board assemblies using surface mount components with finely spaced leads |
| 04/21/1998 | US5742480 Optical module circuit board having flexible structure |
| 04/21/1998 | US5742479 Card-type electronic device with plastic frame sandwiched between printed circuit board and metal panel |
| 04/21/1998 | US5742477 Multi-chip module |
| 04/21/1998 | US5742100 Electronic component |
| 04/21/1998 | US5742097 Multilevel semiconductor integrated circuit device |
| 04/21/1998 | US5742025 Laser reflow soldering process with lead-tin solder pads |
| 04/21/1998 | US5742009 Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microeletronics packages via condution through the package leads |
| 04/21/1998 | US5742005 Electrical connection box |
| 04/21/1998 | US5741729 Ball grid array package for an integrated circuit |
| 04/21/1998 | US5741599 Polyimide compositions for electrodeposition and coatings formed of the same |
| 04/21/1998 | US5741598 Polyimide/metal composite sheet |
| 04/21/1998 | US5741148 Electrical connector assembly with interleaved multilayer structure and fabrication method |
| 04/21/1998 | US5740603 Mixing lead, zinc, boron glass powders, casting to form sheet, heat sealing sheet, firing |
| 04/16/1998 | WO1998016092A1 Printed wiring board device |
| 04/16/1998 | WO1998015595A1 Norbornene polymer composition |
| 04/16/1998 | DE19707709C1 Relay modules circuit board e.g. for automobile |
| 04/16/1998 | DE19700848C1 Electrical switching device e.g. for motor vehicle anti-theft device |
| 04/16/1998 | DE19642488A1 Thin-layer circuit board for e.g. chip card |
| 04/15/1998 | EP0836371A1 Shelf for housing printed circuit boards |
| 04/15/1998 | EP0836369A2 Printed circuit board |
| 04/15/1998 | EP0836229A2 Method and structure for integration of passive components on flexible film layers |
| 04/15/1998 | EP0836227A2 Heat conductive substrate mounted in PC board hole for transferring heat from IC to heat sink |
| 04/15/1998 | EP0835892A1 Epoxy resin composition for printed wiring board and laminated board produced with the use of the same |
| 04/15/1998 | EP0835536A1 Filtered electrical connector |
| 04/15/1998 | EP0835534A1 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement |
| 04/15/1998 | EP0835522A1 Process for producing a ceramic multilayer substrate |
| 04/15/1998 | EP0765534A4 High impact digital crash data recorder |
| 04/15/1998 | CN1179259A Upgradeable voltage regulator modules |
| 04/15/1998 | CN1179129A Laminate for sealing capsules |
| 04/15/1998 | CN1178993A Sheet element |
| 04/14/1998 | US5740527 Transceiver |
| 04/14/1998 | US5740066 Electrical circuit board and circuit board assembly |
| 04/14/1998 | US5739887 Liquid crystal display device with reduced frame portion surrounding display area |
| 04/14/1998 | US5739837 Thermal printhead, and clip-type terminal lead and cover member used therefor |
| 04/14/1998 | US5739743 Asymmetric resistor terminal |
| 04/14/1998 | US5739586 Heat sink assembly including a printed wiring board and a metal case |
| 04/14/1998 | US5739193 Polymeric compositions having a temperature-stable dielectric constant |
| 04/14/1998 | US5739055 Method for preparing a substrate for a semiconductor package |
| 04/14/1998 | US5739045 Semiconductor device with increased on chip decoupling capacitance |
| 04/14/1998 | US5738977 Forming copper layer on substrate surface, forming layer of nickel-boron, cataphoretically coating with photosensitive lacquer, exposing, developing, removing uncovered layers, stripping lacquer, sealing with nickel-phosphorus layer |
| 04/14/1998 | US5738531 Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer |
| 04/14/1998 | US5738530 Contact pad having metallically anchored elastomeric electrical contacts |
| 04/14/1998 | US5737837 Manufacturing method for magnetic head junction board |
| 04/14/1998 | US5737833 Selective forming electroconductive metal bumps by photolithography |
| 04/14/1998 | CA1339810C Process for the preparation of noble metal coated non-noble metal substrates, coated materials produced in accordance therewith and compositions utilizing the coated materials |
| 04/09/1998 | WO1998015160A1 Apparatus and method for automated manufacture of multi-layer electrical and electronic devices |
| 04/09/1998 | WO1998015005A1 Microelectronic component with a sandwich design |
| 04/09/1998 | WO1998014357A1 Valve control device with tridimensional printed board in mid technology |
| 04/09/1998 | DE19743737A1 Thick layer circuit board, e.g. for IC ignition, motor control |
| 04/09/1998 | DE19640959A1 Multilayer circuit or sensor substrate of glass-ceramic |
| 04/09/1998 | DE19640261A1 Ventilsteuergerät mit dreidimensionaler Leiterplatte in MID-Technik Valve controller with three-dimensional circuit board in MID technology |