| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/27/1998 | US5712749 Reduced capacitance of electrical conductor on head suspension assembly |
| 01/27/1998 | US5712607 Air-dielectric stripline |
| 01/27/1998 | US5712192 Process for connecting an electrical device to a circuit substrate |
| 01/27/1998 | US5712079 Aqueous latex dispersion of polycyanoacrylate copolymer |
| 01/27/1998 | US5712047 Copper foil for printed wiring board |
| 01/27/1998 | US5711681 Jumper connector |
| 01/22/1998 | WO1998003046A1 Rectifier set for high voltage device |
| 01/22/1998 | WO1998003045A1 Method for minimizing radio frequency emissions from plug-in adpter cards in computer systems |
| 01/22/1998 | WO1998002954A1 Power pad/power delivery system |
| 01/22/1998 | WO1998002935A1 Printed circuit board layering configuration for very high bandwidth interconnect |
| 01/22/1998 | WO1998002921A1 Transferred flexible integrated circuit |
| 01/22/1998 | CA2259607A1 Method for minimizing radio frequency emissions from plug-in adapter cards in computer systems |
| 01/21/1998 | EP0820217A1 Composition and process for filling vias |
| 01/21/1998 | EP0819368A1 Printed-circuit board and electronic apparatus provided with the same |
| 01/21/1998 | EP0819055A1 A laminate for sealing capsules |
| 01/21/1998 | CN1171167A Composite intermediate connecting element of microelectronic device and its production method |
| 01/21/1998 | CN1170944A High-tensiont ransformer |
| 01/21/1998 | CN1170942A High-voltage transformer |
| 01/21/1998 | CN1170710A Novel ester compound and themrosetting resin composition using the same |
| 01/21/1998 | CN1170638A Impregnation process for substrate material and impregnated substrate material and articles made thereof |
| 01/21/1998 | CN1037134C Integrated circuit device |
| 01/20/1998 | US5710693 Electronic device having a flat, card-like casing enclosing components for a complete computer system including a sub-printed wiring board attached to an inner surface of the casing and electrically connected to a printed wiring board by a flexible member |
| 01/20/1998 | US5710459 Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability |
| 01/20/1998 | US5710305 Flame retardant product and process |
| 01/20/1998 | US5710063 Method for improving the alignment of holes with other elements on a printed circuit board |
| 01/20/1998 | US5709979 Printed wiring board with photoimageable dielectric base substrate and method of manufacture therefor |
| 01/20/1998 | US5709957 Metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer |
| 01/20/1998 | US5709928 Multilayered wiring substrate of aluminum nitride having a high dielectric layer and method of manufacture thereof |
| 01/20/1998 | US5709927 Thick film circuit board |
| 01/20/1998 | US5709906 Method for conditioning halogenated polymeric materials and structures fabricated therewith |
| 01/20/1998 | US5709905 Apparatus and method for automatic monitoring and control of stencil printing |
| 01/20/1998 | US5709805 Method for producing multi-layer circuit board and resulting article of manufacture |
| 01/20/1998 | US5709576 LCD connector alignment with printed wiring board |
| 01/20/1998 | US5709557 Electrical connector for dual printed circuit boards |
| 01/15/1998 | WO1998002025A1 Low-emi circuit board and low-emi cable connector |
| 01/15/1998 | WO1998002023A1 Method and device for the manufacturing of solder stop preferably on a printed board |
| 01/15/1998 | WO1998002022A1 Isolator for signal carrying lines |
| 01/15/1998 | WO1998001872A1 Planar transformer |
| 01/15/1998 | DE19633486C1 Manufacturing method for circuit board with thin conduction paths and good solderable connection-contact regions e.g for measurement resistor or heating element |
| 01/14/1998 | EP0818947A1 Spacer for boards |
| 01/14/1998 | EP0818946A2 A printed-wiring board and a production method thereof |
| 01/14/1998 | EP0818791A1 High voltage transformer |
| 01/14/1998 | EP0818752A2 Inlet for chipcards |
| 01/14/1998 | EP0818061A1 System and process for producing electrically conductive connecting structures and a process for producing circuits and printed circuits |
| 01/14/1998 | CN1170333A 印刷电路板 A printed circuit board |
| 01/14/1998 | CN1170234A Semiconductor apparatus |
| 01/14/1998 | CN1170055A Nonweaved substrate for printed circuit board and pre-formed materials using it |
| 01/14/1998 | CN1037039C Metallic film resistor having fusion function and method for its manufacture |
| 01/13/1998 | US5708855 One-time-use camera with built-in flash-every-exposure device incrementally destroyed after each exposure |
| 01/13/1998 | US5708570 Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures |
| 01/13/1998 | US5708569 Annular circuit components coupled with printed circuit board through-hole |
| 01/13/1998 | US5708568 Electronic module with low impedance ground connection using flexible circuits |
| 01/13/1998 | US5708566 Solder bonded electronic module |
| 01/13/1998 | US5708400 AC coupled termination of a printed circuit board power plane in its characteristic impedance |
| 01/13/1998 | US5708298 Semiconductor memory module having double-sided stacked memory chip layout |
| 01/13/1998 | US5708296 Electronic package |
| 01/13/1998 | US5708252 Excimer laser scanning system |
| 01/13/1998 | US5708116 Low dielectric constant allylics |
| 01/13/1998 | US5707893 Method of making a circuitized substrate using two different metallization processes |
| 01/13/1998 | US5707715 Metal ceramic composites with improved interfacial properties and methods to make such composites |
| 01/13/1998 | US5707575 Method for filling vias in ceramic substrates with composite metallic paste |
| 01/13/1998 | US5707555 Silver or palladium metal powder pastes and glass frits in organic vehicles with zinc and lead frits with borosilicate glass |
| 01/08/1998 | WO1998001013A2 Method and circuit board panel for preventing assembly-line delamination and sagging for circuit board manufacturing |
| 01/08/1998 | WO1998000883A1 Small filament lamp, and holder for a small filament lamp |
| 01/08/1998 | WO1998000869A1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 01/08/1998 | WO1998000865A1 Module for an electrical device |
| 01/08/1998 | WO1998000864A1 Component housing for surface mounting a semiconductor component |
| 01/08/1998 | WO1998000293A1 Superficial coating layer for electrical conductors |
| 01/08/1998 | WO1997034247A3 Smart card, connection arrangement and method of producing a smart card |
| 01/08/1998 | DE19627364A1 Correction values determination method for hole positions on multilayer printed circuit boards |
| 01/08/1998 | DE19626379A1 Kleinglühlampe und Fassung für eine Kleinglühlampe Miniature incandescent lamp and holder for a miniature incandescent lamp |
| 01/07/1998 | EP0817548A1 Printed wiring board and method for manufacturing the same |
| 01/07/1998 | EP0817327A1 Single-sided straddle mount printed circuit board connector |
| 01/07/1998 | EP0817325A1 Contact device for electrical connection of a circuit board to a liquid crystal display support |
| 01/07/1998 | EP0817267A1 Semiconductor package having pins connected to inner layers of multilayer structure |
| 01/07/1998 | EP0817266A2 Mounting structure for an integrated circuit |
| 01/07/1998 | EP0817214A1 High voltage transformer |
| 01/07/1998 | EP0817150A1 Process for allowing agreement encoding of a transmission apparatus with another one, and corresponding transmission apparatus, such as a transmitter or receiver |
| 01/07/1998 | EP0815709A1 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages |
| 01/07/1998 | EP0815622A1 Cross-connect method and apparatus |
| 01/07/1998 | EP0815591A2 Microcircuit via interconnect |
| 01/07/1998 | EP0443009B1 Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same |
| 01/06/1998 | US5706180 Electronic device protected from shocks by encapsulation |
| 01/06/1998 | US5706178 Ball grid array integrated circuit package that has vias located within the solder pads of a package |
| 01/06/1998 | US5706177 Multi-terminal surface-mounted electronic device |
| 01/06/1998 | US5706174 Compliant microelectrionic mounting device |
| 01/06/1998 | US5706160 Surge protector module |
| 01/06/1998 | US5706040 Reliable contact pad arrangement on plastic print cartridge |
| 01/06/1998 | US5705960 Balanced-to-unbalanced converting circuit |
| 01/06/1998 | US5705932 System for expanding space provided by test computer to test multiple integrated circuits simultaneously |
| 01/06/1998 | US5705857 Capped copper electrical interconnects |
| 01/06/1998 | US5705664 Mononoble metal dithiolates, preparations containing them and their use |
| 01/06/1998 | US5705298 Holographic method for generating three dimensional conformal photo lithographic masks |
| 01/06/1998 | US5705097 Fluorescent display device with conductive paste having Ag, Sb, and Zn |
| 01/06/1998 | US5704795 Electrical connectors |
| 01/06/1998 | US5704794 For propagation of electrical signals |
| 01/06/1998 | US5704286 Screen printing apparatus |
| 01/06/1998 | US5704120 Nonuniform electrical connection to conductive surface |
| 01/06/1998 | CA2068657C Moisture resistant electrically conductive cements and methods for making and using same |
| 01/02/1998 | DE19725424A1 Circuit card with flush-mounted components and for insertion in computer expansion slot |