Patents for H05K 1 - Printed circuits (98,583)
10/1997
10/28/1997US5680701 Fabrication process for circuit boards
10/23/1997WO1997039609A1 Method for forming fiducial mark in resin stencil and stencil formed thereby
10/23/1997WO1997039608A1 Backplane for high speed data processing system
10/23/1997WO1997039483A1 Method for manufacturing multi-chip modules utilizing direct lead attach
10/23/1997WO1997039383A1 Method of manufacturing passive elements using conductive polypyrrole formulations
10/23/1997WO1997038851A1 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
10/23/1997DE19618254A1 Multi-layer circuit manufacturing method
10/23/1997DE19615787A1 Verfahren zur Herstellung eines keramischen Multilayer-Substrats A method for producing a ceramic multilayer substrate
10/23/1997DE19615643A1 Arrangement for protecting voltage-limited electronic modules against over-heating and over-voltage
10/23/1997DE19615015A1 Electrical connection device for electronic equipment, such as audio and video devices and even data processing and telecomms. apparatus
10/22/1997EP0802711A2 Wiring board and its manufacturing method
10/22/1997EP0802710A2 Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure
10/22/1997EP0802706A1 Uni-pad for suface mount component package
10/22/1997EP0802703A1 Discharge lamp lighting device
10/22/1997EP0802566A2 Semiconductor devices, method of connecting semiconductor devices, and semicondutor device connectors
10/22/1997EP0802456A1 Resist compositions for circuit boards
10/22/1997EP0801884A1 Module mounting rack for an electronic control unit with signal-processing components and rapid-operation digital components
10/22/1997EP0801815A1 Electrical circuit suspension system
10/22/1997EP0672309B1 High-density electrical interconnect system
10/22/1997EP0615679B1 Electronic module assembly
10/22/1997CN1162526A Laminated board and process for production thereof
10/21/1997US5680297 Connector interface including EMI filtering
10/21/1997US5680295 Ventilated backplane for mounting disk drives in computer systems
10/21/1997US5680294 Pluggable power supply for card cage
10/21/1997US5680191 Driver tabs liquid crystal display having multi-contact
10/21/1997US5680183 Structure of liquid crystal display device for easy assembly and disassembly
10/21/1997US5679979 Surface mount package with heat transfer feature
10/21/1997US5679976 Molded electric parts and method of manufacturing the same
10/21/1997US5679929 Anti-bridging pads for printed circuit boards and interconnecting substrates
10/21/1997US5679444 Method for producing multi-layer circuit board and resulting article of manufacture
10/21/1997US5679268 Thin multi-layer circuit board and process for fabricating the same
10/21/1997US5679266 Method for assembly of printed circuit boards with ultrafine pitch components using organic solderability preservatives
10/21/1997US5679027 For a data communication system
10/21/1997US5679008 Electrical connector
10/21/1997US5678287 Uses of uniaxially electrically conductive articles
10/16/1997WO1997038564A1 Composite dielectric material
10/16/1997WO1997038562A1 Component mounting board, process for producing the board, and process for producing the module
10/16/1997WO1997038418A1 Multilayer thick film surge resistor network
10/16/1997WO1997037948A1 Ceramic composition and method of making same
10/16/1997DE19620340C1 Circuit board for precise placement and soldering of electronic components e.g. for fitting overvoltage protection modules
10/16/1997DE19615994A1 Electronic device for processing and/or transmission of signals via printed circuit board
10/16/1997DE19614111A1 Stripline conductive track arrangement for monolithic integrated circuit
10/16/1997CA2224188A1 Parts-packaging substrate and method for manufacturing same as well as method for manufacturing a module
10/15/1997EP0801521A2 Process for the manufacturing of electrically conductive passages in metallised plastic casings
10/15/1997EP0801433A1 Air-dielectric stripline
10/15/1997EP0800754A1 Compliant interface for a semiconductor chip
10/15/1997EP0800711A1 Process and arrangement for connecting a plurality of mutually remote electric contact points
10/15/1997CN1162243A Multi-layer printed circuit board and method for mfg. same
10/15/1997CN1162067A Ignition device capable of preventing error action of its micro-processor
10/15/1997CN1161986A Thermosetting resin composition, solidifying material, preformed material metal armoured laminated plate and circuit board
10/15/1997CN1161905A Medlin-metal-foil composite film
10/15/1997CN1161902A All-aromatic polyamide fiber sheet
10/14/1997US5678168 Two conductive thick film pastes, each containing gold, platinum and palladium powders, glasses and oxides, chromium oxide, bismuth oxide, organic vehicle in differing amounts; one paste to be deposited on substrate, other on first layer
10/14/1997US5678011 Easily-upgradable computer and CPU board therefor
10/14/1997US5677595 Resistor assembly and electron multiplier using the same
10/14/1997US5677568 Thin IC card
10/14/1997US5677515 Shielded multilayer printed wiring board, high frequency, high isolation
10/14/1997US5677514 Metal-core PC board for insertion into the housing of an electronic device
10/14/1997US5677397 Novolak resin and epoxidized novolak resin; low dielectric constant
10/14/1997US5677045 Low thermal stress, low thermal expansion
10/14/1997US5677041 Integrated circuits formed in radiation sensitive material and method of forming same
10/14/1997US5677014 On ceramic; coating; trimming with laser
10/14/1997US5676907 Method for making near net shape ceramic-metal composites
10/14/1997US5676866 Apparatus for laser machining with a plurality of beams
10/14/1997US5676865 Method of and apparatus for providing welded joints
10/14/1997US5676855 Multiple substrate and process for its production
10/14/1997US5676788 Method for forming cavity structures using thermally decomposable surface layer
10/14/1997US5676781 Mixing hollow and non-hollow inorganic powders, binder, solvent to form slurry, spreading on substrate, drying, cutting into sheets, forming via holes, printing conductor paste on surface, stacking sheets, firing
10/14/1997US5675889 Solder ball connections and assembly process
10/14/1997US5675888 Molded printed circuit board with wipe-in connector and method of making same
10/09/1997WO1997037520A1 Method for depositing solder onto pad-on and pad-off via contacts
10/09/1997WO1997037360A1 Flat cable and method of making
10/09/1997WO1997036773A1 Control unit
10/09/1997WO1997036467A2 Protective module for a telecommunication system distributor
10/09/1997DE19615481A1 Metallised ceramic electrical or electronic substrate - has convex curvature for elastic bending into tight contact with heat sink
10/09/1997DE19614765A1 Manufacture of thin composites useful for e.g. circuit boards
10/09/1997DE19613587A1 Arrangement for reducing electromagnetic radiation with circuit boards and other electronic circuit carriers
10/08/1997EP0800338A2 Devices for minimising electromagnetic radiation in printed circuit boards and other electronic circuit carriers
10/08/1997EP0800334A2 Circuit for operating electric lamps
10/08/1997EP0800208A2 Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrier, and manufacturing method of the semiconductor device
10/08/1997EP0799912A1 Process for the electrolytic metallization of plastic surfaces
10/08/1997EP0799850A1 Phosphorus modified epoxy resins and a method for their preparation
10/08/1997EP0799849A1 Process for the preparation of phosphorus modified epoxy resins
10/08/1997EP0799848A1 Phosphorus modified epoxy resins from epoxy resins and phosphorus containing compounds
10/08/1997EP0799846A1 Phosphorus modified epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a curing agent
10/08/1997EP0799845A2 Phosphorus-modified epoxy resin compositions
10/08/1997EP0799279A1 A thermosetting material
10/08/1997EP0729695B1 Junction panel for control unit
10/07/1997US5675310 Thin film resistors on organic surfaces
10/07/1997US5675302 Microwave compression interconnect using dielectric filled three-wire line with compressible conductors
10/07/1997US5675300 In a coaxial cable distribution system
10/07/1997US5675299 Bidirectional non-solid impedance controlled reference plane requiring no conductor to grid alignment
10/07/1997US5675192 Printed circuit board with header for magnetics all mounted to mother board
10/07/1997US5675183 Hybrid multichip module and methods of fabricating same
10/07/1997US5674618 Comprising coupled zinc oxide particles; radiation transparent, uv light shielding, smooth surface
10/07/1997US5674595 Flexible dielectric adhesive polymer free of conductive material and free of pre-formed film
10/07/1997US5674077 Interleaved connector circuit having increased backplane impedance
10/07/1997US5673995 Support element for a motor vehicle indicating display, and a method of making it
10/07/1997US5673484 Method of manufacturing a magnetic head suspension
10/07/1997US5673480 SCSI cable with termination circuit and method of making