Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/1998
11/11/1998CN1040649C Process for preparing vegetable oil-modified phenolic resin
11/10/1998USRE35950 Recording medium cassette and a recording/reproducing apparatus
11/10/1998US5835979 Wiring pattern preventing EMI radiation
11/10/1998US5835781 Break-away key for electronic circuitry
11/10/1998US5835359 Apparatus for coupling power transmission mediums to a contact point
11/10/1998US5835358 Power supply module for equipping an assembly PC board
11/10/1998US5835356 Power substrate module
11/10/1998US5835352 Power amplifying module
11/10/1998US5834991 Thick film lange coupler
11/10/1998US5834833 Electrical component having a selective cut-off conductor
11/10/1998US5834832 Packing structure of semiconductor packages
11/10/1998US5834824 Use of conductive particles in a nonconductive body as an integrated circuit antifuse
11/10/1998US5834753 Laser scanner module having integral interface with hand-held data capture terminal proximity and label sensing, and enhanced sensitivity and power efficiency
11/10/1998US5834705 Arrangement for modifying eletrical printed circuit boards
11/10/1998US5834704 Pattern structure of flexible printed circuit board
11/10/1998US5834565 Curable polyphenylene ether-thermosetting resin composition and process
11/10/1998US5834537 Curable material which phase separates during heat curing process
11/10/1998US5834366 Method for fabricating microbump interconnect for bare semiconductor dice
11/10/1998US5834336 Backside encapsulation of tape automated bonding device
11/10/1998US5834140 Foil having one shiny and one matte surface; plated from an electrolyte containing 3-mercapto-1-propanesulfonate(sodium salt), a carbohydrate or natural rubber, adhesive and chloride ions, bonding strength, printed circuits
11/10/1998US5834106 Ceramic substrate and producing process thereof, and a suction carrier for wafers using a ceramic wafer-chucking substrate
11/10/1998US5834101 Heat resistance, resistance against electrical discharge
11/10/1998US5834084 Dielectric layer comprising an epoxy interleaved with polytetrafluroethylene fibers
11/10/1998US5833941 Raw material for producing powder of indium-tin oxide aciculae and method of producing the raw material, powder of indium-tin oxide aciculae and method of producing the powder, electroconductive paste and light-transmitting electroconductive film
11/10/1998US5833883 Cross-linked biobased materials and uses thereof
11/10/1998US5833819 Copper foil for a printed circuit board, a process and an apparatus for producing the same
11/10/1998US5833807 Aramid dispersions and aramid sheets of increased uniformity
11/10/1998US5833516 Method of manufacturing a plate of electrically insulating material having a pattern of apertures and/or cavities
11/10/1998US5832602 Method of making wire-circuit sheet
11/10/1998US5832601 Method of making temporary connections between electronic components
11/10/1998US5832599 Method of interfacing detector array layers
11/10/1998US5832598 Method of making microwave circuit package
11/10/1998US5832595 Method of modifying conductive lines of an electronic circuit board and its apparatus
11/07/1998CA2236693A1 Laser sub-mount
11/06/1998CA2213085A1 Board for mounting display element
11/05/1998WO1998049876A2 Capacitive device on a circuit board
11/05/1998WO1998049873A1 Display device and method therefor
11/05/1998WO1998042510A3 Viewing and imaging systems
11/05/1998WO1998041069A3 Flat assembly and method for post-assembling additional components on a printed circuit board
11/05/1998DE19717882A1 Circuit carrier in form of injection moulded plastic connector
11/05/1998DE19713950A1 Electric assembly with disturbance protection
11/05/1998CA2289258A1 Display device and method therefor
11/04/1998EP0876089A2 Method for judging the propriety of cutting position on laminated board and laminated ceramic electronic part
11/04/1998EP0876088A2 Semiconductor microwave amplifier
11/04/1998EP0875936A2 Wiring substrate having vias
11/04/1998EP0875934A2 System and method for reinforcing a bond pad
11/04/1998EP0875928A2 Metallization in semiconductor devices
11/04/1998EP0875906A2 Electronic part and process for manufacturing the same
11/04/1998EP0875331A2 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate
11/04/1998EP0875011A1 Optical circuit on printed circuit board
11/04/1998CN1198268A Device with amplifier means including safety means, and with filter means connected to the amplifier means
11/04/1998CN1198243A Conductor paste and multi-layer ceramic part using the same
11/04/1998CN1198073A Interlaminar connection of stacked electronic components
11/04/1998CN1198009A Semiconductor device package having end-fach halved through-holes and inside-area through-holes
11/04/1998CN1197996A Solder alloy and their use
11/03/1998US5831890 Single in-line memory module having on-board regulation circuits
11/03/1998US5831835 Press grid for electrically connecting circuit components
11/03/1998US5831834 Circuit board with detachable battery
11/03/1998US5831833 Bear chip mounting printed circuit board and a method of manufacturing thereof by photoetching
11/03/1998US5831831 Bonding material and phase change material system for heat burst dissipation
11/03/1998US5831828 Flexible circuit board and common heat spreader assembly
11/03/1998US5831826 Heat transfer apparatus suitable for use in a circuit board assembly
11/03/1998US5831788 Circuit connector
11/03/1998US5831445 Wafer scale burn-in apparatus and process
11/03/1998US5831348 Secondary circuit device for wireless transmit-receive system and induction coil for wireless transmit-receive system
11/03/1998US5831218 Method and circuit board panel for circuit board manufacturing that prevents assembly-line delamination and sagging
11/03/1998US5831214 Electrical circuit
11/03/1998US5830973 From a diphosphinic acid and a polyepoxide
11/03/1998US5830570 Aluminum nitride substrate and process for preparation thereof
11/03/1998US5830564 Aromatic polyimide film
11/03/1998US5830563 Fluorene-skeleton epoxy acrylate
11/03/1998US5830389 Electrically conductive compositions and methods for the preparation and use thereof
11/03/1998US5830374 Method for producing multi-layer circuit board and resulting article of manufacture
11/03/1998US5829128 Method of mounting resilient contact structures to semiconductor devices
11/03/1998US5829124 Method for forming metallized patterns on the top surface of a printed circuit board
10/1998
10/29/1998WO1998048454A1 Method of forming redundant signal traces and corresponding electronic components
10/29/1998WO1998048378A2 Card inlay for chip cards
10/29/1998WO1998048197A2 Vibration control system, especially for circuit boards
10/29/1998WO1998048084A1 Method of electrophoretic deposition of laminated green bodies
10/29/1998WO1998043311A3 Flexible strip transmission line
10/29/1998DE19716946A1 Heat-producing component to circuit board contacting method
10/29/1998DE19715028A1 Bus System Driven Units for luminosity level adjustment
10/28/1998EP0874367A2 Recording medium cassette
10/28/1998EP0873913A2 Method to prevent, minimize, or stop influences of humidity on electronic components
10/28/1998EP0873879A2 An ink jet recording apparatus
10/28/1998EP0873860A2 Laminate and process for producing the same
10/28/1998EP0838133B1 Device for mounting electrical components on printed-circuit boards
10/28/1998EP0769214B1 Process for producing an electrically conductive connection
10/28/1998EP0682852B1 A circuit board arrangement including shielding grids, and constructing thereof
10/28/1998CN1197365A Collection substrate and making method of electronic products of using the same
10/28/1998CN1197309A Circular-polarization antenna
10/28/1998CN1197306A Laminated electronic spares
10/28/1998CN1197008A Process for joining flexible circuit to polymeric container and for forming barrier layer over sections of flexible circuit and other elements using encapsulant material
10/27/1998US5828555 Multilayer printed circuit board and high-frequency circuit device using the same
10/27/1998US5828188 Over temperature protection circuit having plural thermal components
10/27/1998US5828128 Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device
10/27/1998US5828125 Ultra-high density warp-resistant memory module
10/27/1998US5828010 Connection of electrically conducting layers with ceramic prominences
10/27/1998US5827951 System to analyze solderability of printed wiring boards
10/27/1998US5827907 Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
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