H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
11/1997
11/13/1997	WO1997042639A1 Polymeric compositions having a temperature-stable dielectric constant
11/13/1997	WO1997042599A1 Integrated circuit card comprising conductive tracks distant from the integrated circuit corners
11/13/1997	WO1997042515A1 Methods and systems for increased numbers of test points on printed circuit boards
11/13/1997	WO1997042060A1 Overlay substrate for securing electronic devices in a vehicle
11/13/1997	DE19718093A1 Assembly base plate for mounting electronic components
11/13/1997	DE19625466C1 Chip card with visible contact areas of different colour from usual silver or gold
11/13/1997	CA2253336A1 Methods and systems for increased numbers of test points on printed circuit boards
11/13/1997	CA2252884A1 Overlay substrate for securing electronic devices in a vehicle
11/12/1997	EP0806589A1 Vibration control
11/12/1997	EP0806429A2 Flame-retardant epoxy resins and flame retarders for epoxy resins
11/12/1997	EP0806127A1 An environmentally desirable method of manufacturing printed circuits, printed circuits made thereby and associated apparatus
11/12/1997	EP0806056A1 Glass bonding layer for a ceramic circuit board support substrate
11/12/1997	EP0795200A4 Mounting electronic components to a circuit board
11/12/1997	CN1036402C Curable polyphenylene ether resin composition and film therefrom
11/11/1997	US5687233 Modular jack having built-in circuitry
11/11/1997	US5687109 Integrated circuit module having on-chip surge capacitors
11/11/1997	US5687062 High-thermal conductivity circuit board
11/11/1997	US5686871 Method for minimizing radio frequency emissions from plug-in adapter cards in computer systems
11/11/1997	US5686833 Load board enhanced for differential pressure retention in an IC test head
11/11/1997	US5686702 Polyimide multilayer wiring substrate
11/11/1997	US5686697 Electrical circuit suspension system
11/11/1997	US5686230 Exposing senstive layer to collimated radiation through mask
11/11/1997	US5686191 Polyimide adhesive, elasticity
11/11/1997	US5686172 Metal-foil-clad composite ceramic board and process for the production thereof
11/11/1997	US5686135 Printed circuit board
11/11/1997	US5685968 Ceramic substrate with thin-film capacitor and method of producing the same
11/11/1997	US5685073 Method of manufacturing board-to-board connector
11/11/1997	US5685070 Method of making printed circuit board
11/11/1997	US5685069 Device for contacting electric conductors and method of making the device
11/06/1997	WO1997041710A1 Beside-the-door programming system for programming hearing aids
11/06/1997	WO1997041628A1 Method for interfacing to a powered bus
11/06/1997	WO1997041554A1 Esd protection of magnetic heads
11/06/1997	WO1997041543A1 Resonant tag and method of manufacturing the same
11/06/1997	WO1997040976A1 Press machine
11/06/1997	DE19716113A1 Elektrische Leistungsstrang-Baugruppe Electric power train assembly
11/05/1997	EP0805619A1 Molded shielding cap for electrical components
11/05/1997	EP0805615A2 Improved printed-circuit board
11/05/1997	EP0805614A1 Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar
11/05/1997	EP0805492A2 Curved metal ceramic substrate
11/05/1997	EP0804990A1 Method of mounting circuit components on a flexible substrate
11/05/1997	EP0804866A1 Electronic circuit structure
11/05/1997	EP0804865A1 Production of electrical circuit boards
11/05/1997	EP0804817A1 An electrically conductive wire
11/05/1997	EP0804806A1 Device for superheating steam
11/05/1997	CN1164245A Curable epoxy resin accelerated by boric acid and its analogs
11/05/1997	CN1164244A Low VOC laminating formulations
11/05/1997	CN1163899A Low dielectric polymer and film, substrate and electronic part using the same
11/04/1997	US5684677 Electronic circuit device
11/04/1997	US5684667 Full failure protector module
11/04/1997	US5684094 Curable resin composition
11/04/1997	US5683928 Method for fabricating a thin film resistor
11/04/1997	US5683791 Copper wire
11/04/1997	US5683788 Apparatus for multi-component PCB mounting
11/04/1997	US5683758 Apertures in substrates of barium titanate formed by beams of light and forming a coating on the substrate
11/04/1997	US5683743 Manufacturing circuit boards dipped in molten solder
11/04/1997	US5683627 Curable electroconductive composition
11/04/1997	US5683566 Surface mounted device
11/04/1997	US5683529 Process of producing aluminum nitride multiple-layer circuit board
11/04/1997	US5682814 Apparatus for manufacturing resonant tag
11/02/1997	CA2204226A1 Improved low profile mounting of electronic components
10/1997
10/30/1997	WO1997040651A1 Grid array assembly and method of making
10/30/1997	WO1997040529A1 Process for producing a ceramic multilayer substrate
10/30/1997	DE19714544A1 Dry-electrolyte capacitor mounting method for printed circuit board
10/30/1997	DE19712825A1 Production of ceramic conductor substrate
10/30/1997	DE19707298A1 Modular assembly group system
10/30/1997	DE19649889C1 Electrical switching device
10/30/1997	DE19616424A1 Electrically isolating material with electronic module
10/30/1997	CA2252379A1 Grid array assembly and method of making
10/29/1997	EP0804062A2 Electronic device unit
10/29/1997	EP0804059A1 Structure for mounting an electrical module on a board
10/29/1997	EP0804057A2 Improvements in or relating to connecting board for connection between base plate and mounting board
10/29/1997	EP0804056A2 Improvements in or relating to connecting board
10/29/1997	EP0804054A1 Insulated surface mount circuit board construction
10/29/1997	EP0804053A1 Assembly support having at least one heat generating component
10/29/1997	EP0803920A2 Rechargeable type small electric appliance
10/29/1997	EP0803887A2 Membrane keyboard
10/29/1997	EP0803822A1 Card slot unit and its manufacture
10/29/1997	EP0803499A1 1, 2 - N - acyl - N - methylene - ethylenediamine, and electroconductive paste comprising it
10/29/1997	EP0803135A1 Electrical connections with deformable contacts
10/29/1997	EP0678232B1 Plated compliant lead
10/29/1997	CN1163479A Semiconductor device and its producing technology
10/29/1997	CN1163469A Ceramic electronic parts
10/29/1997	CN1163318A Electrolytic copper foil for printed circuit board and its producing method
10/28/1997	US5682589 Multilayer; overcoated with tungsten, molybdenum alloy
10/28/1997	US5682298 Balancing power distribution in a power supply system with redundant power sources
10/28/1997	US5682297 Dual pattern microprocessor package footprint
10/28/1997	US5682296 Plastic integrated circuit card with reinforcement structure located over integrated circuit module for protecting same
10/28/1997	US5682295 Plastic integrated circuit card with reinforcement structure separated from integrated circuit module by card
10/28/1997	US5682294 Integrated circuit card with a reinforcement structure for retaining and protecting integrated circuit module
10/28/1997	US5682293 Integrated circuit card having a reinforcement structure and an integrated circuit module disposed on opposing surfaces
10/28/1997	US5682124 Technique for increasing the range of impedances for circuit board transmission lines
10/28/1997	US5682068 Power cap
10/28/1997	US5682057 Semiconductor device incorporating a temperature fuse
10/28/1997	US5682018 Interface regions between metal and ceramic in a metal/ceramic substrate
10/28/1997	US5681883 Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
10/28/1997	US5681662 Copper alloy foils for flexible circuits
10/28/1997	US5681648 Printed wiring board and method for preparing the same
10/28/1997	US5681624 Liquid crystal polymer film and a method for manufacturing the same
10/28/1997	US5681485 Bisphenol-epichlorohydrin resin as photosensitive film for laminating onto insulating material carrying conductor pattern
10/28/1997	US5681444 Electroplating connector holes with nickel, then oxidizing it and covering with screen printed dielectric glass, firing to remove organic binders and solvents, applying conductive ink containing metal powder and glass, then more firing

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