| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/22/1998 | US5811727 In-line coupler |
| 09/22/1998 | US5811188 For dielectrics, prepregs or other electrical equipmewnt |
| 09/22/1998 | US5809675 Board for mounting display element |
| 09/22/1998 | US5809642 Method for detecting deterioration of solder paste printing |
| 09/22/1998 | US5809634 Method of manufacturing magnetic head suspension having circuit wiring pattern |
| 09/22/1998 | CA2137388C Ceramic substrate for semiconductor device |
| 09/22/1998 | CA2101454C Ink jet recording head, ink jet recording head cartridge, recording apparatus using the same and method of manufacturing the head |
| 09/17/1998 | WO1998041074A1 Elektrische verbindungsmittel für baugruppenträger |
| 09/17/1998 | WO1998041072A2 A power supply unit for a plug-in unit of a communications apparatus and a communications equipment using a plurality of such plug-in units |
| 09/17/1998 | WO1998041071A1 Hybrid module assembling method and apparatus |
| 09/17/1998 | WO1998041069A2 Flat assembly and method for post-assembling additional components on a printed circuit board |
| 09/17/1998 | WO1998041068A1 Substrate for mounting package |
| 09/17/1998 | WO1998041067A1 Electronic parts module and electronic equipment |
| 09/17/1998 | WO1998041066A1 Circuit board for electrical apparatus with hf components, particularly for mobile radiocommunications equipment |
| 09/17/1998 | WO1998040935A1 Electric subassembly |
| 09/17/1998 | WO1998040914A1 Printed wiring board and method for manufacturing the same |
| 09/17/1998 | WO1998040776A2 Opto-electric module |
| 09/17/1998 | WO1998040754A1 Mounting structure of electric parts on circuit board |
| 09/17/1998 | DE19710047A1 Flexible circuit board for electronic circuit |
| 09/17/1998 | DE19710034A1 Double sided flexible printed circuit board manufacturing method |
| 09/17/1998 | DE19709985A1 Smart card for data transmission using contact- or contactless technology |
| 09/16/1998 | EP0865232A2 Mounting of chip modules on printed writing boards |
| 09/16/1998 | EP0865118A1 Electrical assembly |
| 09/16/1998 | EP0865102A2 Solder connection for electrical connections |
| 09/16/1998 | EP0864248A1 Fillers for improved epoxy laminates |
| 09/16/1998 | EP0618309B1 Metal powder composition for metallization and metallized substrate |
| 09/16/1998 | CN1193360A High-tensile electrolytic copper foil and process for producing the same |
| 09/16/1998 | CN1193311A Photosensitive ceramic blank plate, ceramic package and process for producing same |
| 09/16/1998 | CN1193172A Feedthrough thin-film capacitor and interfering-signal-removing assembly fitted with same |
| 09/15/1998 | US5809361 Flexible printed circuit board |
| 09/15/1998 | US5808878 Circuit substrate shielding device |
| 09/15/1998 | US5808853 Capacitor with multi-level interconnection technology |
| 09/15/1998 | US5808529 Printed circuit board layering configuration for very high bandwidth interconnect |
| 09/15/1998 | US5808521 Printed wiring board with the characteristic impedance of wiring pattern changed on the way thereof |
| 09/15/1998 | US5808360 Microbump interconnect for bore semiconductor dice |
| 09/15/1998 | US5808357 Semiconductor device having resin encapsulated package structure |
| 09/15/1998 | US5808351 Programmable/reprogramable structure using fuses and antifuses |
| 09/15/1998 | US5808259 Thick film apparatus and method for customizing IC test PCB |
| 09/15/1998 | US5808241 Shielded delay line and method of manufacture |
| 09/15/1998 | US5807967 Heating, cyclization a fluorinated dicyanate to give polycyanurate |
| 09/15/1998 | US5807910 Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive |
| 09/15/1998 | US5807793 Laminates for printed circuits using unidirectional glass fabric |
| 09/15/1998 | US5807626 Ceramic circuit board |
| 09/15/1998 | US5807606 Applying adhesive to substrates |
| 09/15/1998 | US5807508 Copper oxide, polymer composite |
| 09/15/1998 | US5807455 System and method for uniform product compressibility in a high throughput uniaxial lamination press |
| 09/15/1998 | US5807136 Space saving connector layout |
| 09/15/1998 | US5807122 Adaptor for mounting on a circuit board |
| 09/15/1998 | US5806181 Method of probing an electronic component |
| 09/15/1998 | US5806178 Circuit board with enhanced rework configuration |
| 09/11/1998 | WO1998039803A2 Circuit configuration comprising semi-conductor components which has devices for monitoring junction temperature |
| 09/11/1998 | WO1998039784A1 Ceramic multilayer printed circuit boards with embedded passive components |
| 09/11/1998 | WO1998039781A1 Vertically interconnected electronic assemblies and compositions useful therefor |
| 09/11/1998 | WO1998039732A2 Chip card module and chip card comprising the latter |
| 09/11/1998 | WO1998039105A1 Metal-plating of cured and sintered transient liquid phase sintering pastes |
| 09/10/1998 | DE19758452A1 Metal-ceramic substrate for electrical circuit |
| 09/10/1998 | DE19755398A1 Multi-layer 3D printed circuit board manufacturing method |
| 09/10/1998 | DE19735074A1 Power module |
| 09/10/1998 | DE19732645A1 Combination chip card manufacturing method |
| 09/10/1998 | DE19709551A1 Electrical printed circuit board |
| 09/10/1998 | DE19708653A1 Verfahren zur Bestimmung der Junktion-Temperatur von gehäusten Halbleiterbauelementen Method for determining the temperature of Junktion-packaged semiconductor components |
| 09/09/1998 | EP0863550A2 Metallurgical interconnect composite |
| 09/09/1998 | EP0863530A2 Electric circuit board and method of producing the same |
| 09/09/1998 | EP0863426A1 Liquid crystal display device |
| 09/09/1998 | EP0863116A1 Low-temperature sinterable ceramic composition, and monolithic ceramic substrate using the same |
| 09/09/1998 | EP0862541A1 Glass and glass-ceramic bubbles having an aluminum nitride coating |
| 09/09/1998 | EP0794979B1 Blends of cyanate-triazine copolymers and epoxy resins |
| 09/09/1998 | CN1192717A Debossable films |
| 09/09/1998 | CN1192716A Conductive film composite |
| 09/08/1998 | US5805903 Protection of computer system against incorrect card insertion during start-up |
| 09/08/1998 | US5805756 Subrack with routing modules |
| 09/08/1998 | US5805428 Transistor/resistor printed circuit board layout |
| 09/08/1998 | US5805425 Microelectronic assemblies including Z-axis conductive films |
| 09/08/1998 | US5805422 Semiconductor package with flexible board and method of fabricating the same |
| 09/08/1998 | US5805417 For an electronic equipment |
| 09/08/1998 | US5805402 Integrated interior trim and electrical assembly for an automotive vehicle |
| 09/08/1998 | US5805249 Liquid crystal display device having video signal driving circuit mounted on one side |
| 09/08/1998 | US5805037 Distributed transmission line structure |
| 09/08/1998 | US5805030 Enhanced signal integrity bus having transmission line segments connected by resistive elements |
| 09/08/1998 | US5804880 For electrical connection to a die |
| 09/08/1998 | US5804771 For an integrated circuit package assembly |
| 09/08/1998 | US5804672 Thermally crosslinkable heat-sealing adhesive |
| 09/08/1998 | US5804607 Process for making a foamed elastomeric polymer |
| 09/08/1998 | US5804288 A fired metal oxide layer comprising manganese for reducing porosity |
| 09/08/1998 | US5804254 Method for flexibilizing cured urea formaldehyde resin-bound glass fiber nonwovens |
| 09/08/1998 | US5803344 Dual-solder process for enhancing reliability of thick-film hybrid circuits |
| 09/08/1998 | US5803343 Solder process for enhancing reliability of multilayer hybrid circuits |
| 09/08/1998 | US5802713 Circuit board manufacturing method |
| 09/08/1998 | US5802711 Process for making an electrical interconnect structure |
| 09/08/1998 | US5802702 Method of making a device including a metallized magnetic substrate |
| 09/08/1998 | US5802699 Methods of assembling microelectronic assembly with socket for engaging bump leads |
| 09/08/1998 | US5802688 Method of producing electronic parts with an electrode pattern between two dielectric substrates |
| 09/03/1998 | WO1998038678A1 Semiconductor module |
| 09/03/1998 | WO1998022987A3 Laminated sheet product containing a printed battery |
| 09/03/1998 | DE19808178A1 Conductive plastic compound manufacturing process e.g. for switch |
| 09/03/1998 | DE19804337A1 Motor vehicle dashboard of reduced depth |
| 09/03/1998 | DE19707769A1 Electrostatic discharge protection device for automobile integrated electrical control circuits |
| 09/02/1998 | EP0862245A1 Assembly containing a modular jack and a light emitting diode |
| 09/02/1998 | EP0862238A2 Multilayer microelectronic circuit |
| 09/02/1998 | EP0862237A1 Tunable passive-gain equalizer |