Patents for H05K 1 - Printed circuits (98,583)
10/1997
10/07/1997US5673479 Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer
10/07/1997US5673478 Method of forming an electronic device having I/O reroute
10/02/1997WO1997036464A1 Production of electrical circuit boards
10/02/1997WO1997036340A1 Bidirectional non-solid impedance controlled reference plane
10/02/1997WO1997027728A3 Control device, especially for a motor vehicle
10/02/1997DE19648728A1 High density semiconductor integrated circuit package apparatus
10/02/1997DE19612907A1 Reglereinheit Controller unit
10/02/1997DE19612760A1 Carrier plate for electronic component connection structure, e.g for printhead of electrographic printer or copier
10/02/1997DE19612167A1 Computer housing
10/02/1997CA2250206A1 Bidirectional non-solid impedance controlled reference plane
10/01/1997EP0798954A1 Microelectronic casing with cooling system
10/01/1997EP0798779A1 Ceramic circuit board
10/01/1997EP0797558A1 Electrically conductive connection
10/01/1997CN1161065A High fatigue ductility electrodeposited copper foil
10/01/1997CN1160983A Method for detecting deterioration of solder paste printing
10/01/1997CN1160926A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/01/1997CN1160773A Tungsten-copper composite powder
09/1997
09/30/1997US5673179 Plastic integrated circuit card with reinforcement structure outer to the card and protecting integrated circuit module
09/30/1997US5673009 Connector for communication systems with cancelled crosstalk
09/30/1997US5672965 Evaluation board for evaluating electrical characteristics of an IC package
09/30/1997US5672414 Multilayered printed board structure
09/30/1997US5672407 Structure with etchable metal
09/30/1997US5672220 Method of producing a laminated electronic device
09/30/1997US5672062 Electrical connectors
09/30/1997US5671531 Fabrication process for circuit substrate having interconnection leads
09/25/1997WO1997035459A1 Module with a circuit arrangement
09/25/1997WO1997035457A1 Fillers for improved epoxy laminates
09/25/1997WO1997034889A1 N-aminoalkyldibenzothiophenecarboxamides; dopamine receptor subtype specific ligands
09/25/1997DE19610742A1 Baugruppe mit einer Schaltungsanordnung Module having a circuit arrangement
09/25/1997DE19610586A1 Circuit board for precise placement and soldering of electronic components e.g. for fitting overvoltage protection modules
09/24/1997EP0797381A2 Cast electric/electronic subassembly without using a PCB
09/24/1997EP0797379A2 Circuit board and process for mounting and soldering of electronic components in accurate positions on the surface of the circuit board
09/24/1997EP0797378A2 Copper-clad laminate, multilayer copper-clad laminate and process for producing the same
09/24/1997EP0797266A2 Dielectric filter and method of making same
09/24/1997EP0796551A1 Fabrication multilayer combined rigid/flex printed circuit board
09/24/1997CN1160449A Support element
09/24/1997CN1160448A Circuit with chip card module and coil connected therewith
09/24/1997CN1160407A Allyl-contg. epoxy resin composition comprising copolymer of ethylenically unsaturated anhydride and vinyl compound
09/24/1997CN1160289A Method and apparatus for forming conductive layer on printed wiring board terminal
09/24/1997CN1160261A Liquid crystal display
09/23/1997US5671125 Vertical package mounted on both sides of a printed circuit board
09/23/1997US5671123 IC card with a discharge pattern and a ground pattern separated from each other
09/23/1997US5671121 Printed circuit board assembly
09/23/1997US5670994 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion
09/23/1997US5670750 Electric circuit card having a donut shaped land
09/23/1997US5670749 Multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area
09/23/1997US5670262 High strength films as dielectric layers
09/23/1997US5670250 Hydrophobic fumed silica flow modifier controls uniform distribution of hollow inorganic microspheres
09/23/1997US5670241 Metal base board and electronic equipment using the same
09/23/1997US5670187 Plurality of rolls or strips
09/23/1997US5670063 Method for making an interface connection through an insulating part
09/23/1997US5669783 IC socket permitting checking connected state between IC socket and printed wiring board
09/23/1997US5669775 Assembly for mounting components to flexible cables
09/23/1997US5669548 Soldering method
09/23/1997CA2080333C Surge absorber
09/18/1997WO1997034459A2 Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation
09/18/1997WO1997034307A1 Method of producing a fibre-reinforced insulating body
09/18/1997WO1997034247A2 Smart card, connection arrangement and method of producing a smart card
09/18/1997WO1997034189A1 Liquid crystal display
09/18/1997WO1997033713A1 Method for isolating ultrafine and fine particles and resulting particles
09/18/1997DE19710187A1 Flat surfaced ceramic multilayer substrate production
09/18/1997DE19707253A1 Repeated firing resistant ceramic circuit substrate
09/18/1997DE19610113A1 Verfahren zur Herstellung eines faserverstärkten Isolierkörpers A process for producing a fiber-reinforced insulating body
09/18/1997DE19610044A1 Smart card with inductive antenna for contactless data transmission
09/18/1997CA2248127A1 A method to make a metallic layer on a surface of a detail for screening against electromagnetic radiation
09/18/1997CA2199898A1 Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board
09/17/1997EP0796038A2 High-frequency module
09/17/1997EP0795908A2 Multilayer high frequency circuit with integrated active elements
09/17/1997EP0795907A1 Multilayer high-frequency circuit with integrated active elements
09/17/1997EP0795906A2 An electronic-circuit assembly and its manufacturing method
09/17/1997EP0795570A1 Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same
09/17/1997EP0795262A1 Chemically grafted electrical devices
09/17/1997EP0795200A1 Mounting electronic components to a circuit board
09/17/1997EP0794983A1 Conductive ink
09/17/1997EP0794979A1 Multifunctional cyanate ester and epoxy blends
09/17/1997EP0715636B1 Allyl-epoxy ipn
09/17/1997CN1159730A Flexible printed circuit and making method
09/17/1997CN1159678A Surface sound wave device
09/16/1997US5668834 Signal transmitting device suitable for fast signal transmission including an arrangement to reduce signal amplitude in a second stage transmission line
09/16/1997US5668700 Panel assembly structure capable of connecting wiring line with electrode at fine pitch
09/16/1997US5668698 Smart connector for an electrical device
09/16/1997US5668406 Semiconductor device having shielding structure made of electrically conductive paste
09/16/1997US5668405 Semiconductor device with a film carrier tape
09/16/1997US5668399 Semiconductor device with increased on chip decoupling capacitance
09/16/1997US5667884 Area bonding conductive adhesive preforms
09/16/1997US5667851 Process for preparing a metallized polymide film containing a hydrocarbyl tin compound
09/16/1997US5667394 Electro-luminescent strip and connector set therefor
09/16/1997US5667391 Electrical connector having a two part articulated housing
09/16/1997US5667388 Printed circuit board adapter carrier for input/output cards
09/16/1997US5666722 Method of manufacturing printed circuit boards
09/16/1997US5666721 Method of soldering an electronic connector on a printed circuit board
09/12/1997WO1997033311A1 Method for making electrical connections
09/11/1997DE19608938A1 Electrical switching arrangement for operating lamps
09/11/1997DE19608683A1 Production of substrate
09/11/1997DE19608661A1 Moisture resistant contact for resistive rain sensor on motor vehicle window glass
09/10/1997EP0794606A1 Electrical circuit arrangement for operating lamps
09/10/1997EP0794227A2 Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
09/10/1997EP0793903A1 Coating for the structured production of conductors on the surface of electrically insulating substrates
09/10/1997CN1159201A Plated molding and process for preparing plated moldings
09/10/1997CN1159135A 柔性印制电路 Flexible printed circuit