Patents for H05K 1 - Printed circuits (98,583)
03/1998
03/19/1998WO1998011158A1 Flame-retardant organic formulations
03/19/1998WO1998010924A1 A reinforcement mat
03/19/1998WO1998010920A1 Maleimide containing formulations and uses therefor
03/19/1998DE19637888A1 Determining di-electricity and loss factor of individual insulating layers in multi-layer circuit boards
03/19/1998DE19637551A1 Production of ceramic constructional element, e.g. capacitor
03/18/1998EP0830053A2 Coil included printed wiring board
03/18/1998EP0829186A1 Composite materials
03/18/1998EP0699340B1 An electric fuse and protective circuit
03/18/1998CN1176571A Multilayer metallized printing plate and its forming module
03/18/1998CN1176505A Self-aligning low profile socket for connecting ball grid array devices through dendritic interposer
03/18/1998CN1176278A Water cleanable silver composition
03/18/1998CN1176262A Polyadduct resin (B) and use thereof
03/18/1998CN1176239A Large ceramic article and method of manufacturing
03/17/1998US5729752 Network connection scheme
03/17/1998US5729439 Printed wiring substrate
03/17/1998US5729438 Discrete component pad array carrier
03/17/1998US5729437 Electronic part including a thin body of molding resin
03/17/1998US5729433 Assembly for mounting electronic components
03/17/1998US5729316 Liquid crystal display module
03/17/1998US5729315 Circuit assembly and process for production thereof
03/17/1998US5729183 Tuned guard circuit for conductive transmission lines on a printed circuit board
03/17/1998US5729053 Apparatus and method for flat circuit assembly
03/17/1998US5728633 Interpenetrating network compositions and structures
03/17/1998US5728601 Process for manufacturing a single in-line package for surface mounting
03/17/1998US5728470 Multi-layer wiring substrate, and process for producing the same
03/17/1998US5728468 Epoxy resin networks and allyl group monomers
03/17/1998US5727956 Connector assembly including metal strips as contact members
03/12/1998WO1998010632A1 Highly heat-conductive composite magnetic material
03/12/1998WO1998010628A1 Carrier element(1) for a semi-conductor chip
03/12/1998WO1998010627A1 Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components
03/12/1998WO1998010626A1 Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg
03/12/1998WO1998010389A1 Electronic article surveillance protection for printed circuit boards
03/12/1998DE19639954C1 Liquid crystal display assembly used e.g. for electronic weigher
03/12/1998DE19638732A1 Electrical precision resistances applying method for plastic circuit board
03/12/1998DE19636756A1 Multilayer technology inductance components mfr
03/12/1998DE19636112A1 Carrier element for semiconductor chip
03/12/1998CA2265578A1 Electronic article surveillance protection for printed circuit boards
03/12/1998CA2185304A1 Digital data crosspoint switch with mirror pin-outs
03/11/1998EP0828410A2 Dual-solder process for enhancing reliability of thick-film hybrid circuits
03/11/1998EP0828291A2 Fine pitch via formation using diffusion patterning techniques
03/11/1998EP0828261A1 Control circuit for positioning a mobile element, in particular used in a device controlling the inclination of a vehicle headlamp, and method of fabrication thereof
03/11/1998EP0828260A1 Control circuit for positioning a mobile element, in particular used in a device controlling the inclination of a vehicle headlamp, and method of fabrication thereof
03/11/1998EP0827802A1 Method to produce a weakening line using a laser
03/11/1998EP0621888B1 Laminate on the basis of a strengthened polyimide film containing organometallic compounds for improving adhesion
03/11/1998CN1175882A Vibrator holding device
03/11/1998CN1175847A Camera head
03/10/1998US5726863 Multilayer printed circuit board
03/10/1998US5726622 Dew sensor having a conductive power-containing moisture sensing material disposed between opposing electrodes
03/10/1998US5726568 Magneto-repulsion punching with dynamic damping
03/10/1998US5726493 Semiconductor device and semiconductor device unit having ball-grid-array type package structure
03/10/1998US5726482 Device-under-test card for a burn-in board
03/10/1998US5726257 Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith
03/10/1998US5726211 Process for making a foamed elastometric polymer
03/10/1998US5725938 Metallization of ceramic through application of an adherent reducible layer
03/10/1998US5725808 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board
03/10/1998US5724728 Method of mounting an integrated circuit to a mounting surface
03/05/1998WO1998009376A1 Frequency-independent voltage divider
03/05/1998WO1998009350A1 Electrical terminal with integral capacitive filter
03/05/1998WO1998009341A1 Improved isolation in multi-layer structures
03/05/1998WO1998009331A1 Heat sink assembly and method of transferring heat
03/05/1998WO1998008672A1 Metal ceramic composites with improved interfacial properties
03/05/1998WO1998008644A1 Method and apparatus for forming termination stripes
03/05/1998DE19635575A1 Surface-mounted electronic component, e.g. relay
03/04/1998EP0827372A2 Electronic control module
03/04/1998EP0827360A2 A handset and a connector therefor
03/04/1998EP0827200A1 Arrangement for shielding a microelectronic circuit of an integrated circuit
03/04/1998EP0827198A2 Metal ceramic substrates for semiconductors of high reliability
03/04/1998EP0826950A1 Temperature and passive infrared sensor module
03/04/1998EP0826294A1 Printed wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof
03/04/1998EP0731992A4 High-density interconnect technique
03/04/1998EP0670081B1 Coaxial high-frequency plug-type connector for multiple coaxial lines
03/04/1998EP0649562B1 Circuit protection device
03/04/1998CN1174861A laminate struction comprising at least on cured polyphenylene ether resin composition ether
03/03/1998US5724232 Chip carrier having an organic photopatternable material and a metal substrate
03/03/1998US5724012 Transmission-line network
03/03/1998US5723908 Multilayer wiring structure
03/03/1998US5723903 Thin type semiconductor device, module structure using the device and method of mounting the device on board
03/03/1998US5723823 Circuit board with enhanced rework configuration
03/03/1998US5723535 Pastes for the coating of substrates, methods for manufacturing them and their use
03/03/1998US5723359 Method for concurrently forming thin film resistor and thick film resistor on a hybrid integrated circuit substrate
03/03/1998US5723206 Polyimide-metal foil composite film
03/03/1998US5723205 Fabrication multilayer combined rigid/flex printer circuit board
03/03/1998US5723073 Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same
03/03/1998US5722160 Packaging method of BGA type electronic component
02/1998
02/28/1998CA2212772A1 Temperature and passive infrared sensor module
02/26/1998WO1998008362A1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
02/26/1998WO1998008361A1 High performance flexible laminate
02/26/1998WO1998008216A1 Laminate for hdd suspension and its manufacture
02/26/1998WO1998007603A1 Solenoid coil structure and interconnection
02/26/1998DE19642563C1 Chipkarte mit einer Kontaktzone sowie Verfahren zur Herstellung einer solchen Chipkarte Chip card having a contact zone, as well as method of manufacturing such a chip card
02/26/1998DE19634371A1 Printed circuit board with curved region
02/25/1998EP0825809A2 Multilayer circuit board and photosensitive resin composition usable therefor
02/25/1998EP0825217A1 Adduct of bisepoxy compound and P-guanamine
02/25/1998EP0824426A1 Control system for an automotive vehicle multi-functional apparatus
02/25/1998CN1174491A Improved copper foil for printed circuit boards
02/25/1998CN1174451A Squelch filter for power converter
02/25/1998CN1174413A Coordinate input device
02/24/1998US5721785 Small-sized sound generator
02/24/1998US5721671 Subrack for electronic circuit boards and its support
02/24/1998US5721453 Integrated circuit package