| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 02/24/1998 | US5721335 Rigid-rod polymers |
| 02/24/1998 | US5721303 Organosulfur gold compounds, a process for their production and their use |
| 02/24/1998 | US5721076 Color filters and materials and resins therefor |
| 02/24/1998 | US5721044 Multiple substrate |
| 02/24/1998 | US5721007 Covering portions of deposited conductive metal with resist material to prevent electrochemical growth of metal circuit |
| 02/23/1998 | CA2213275A1 Adduct of bisepoxy compound and p-guanamine |
| 02/19/1998 | WO1998007302A1 Method for plating independent conductor circuit |
| 02/19/1998 | WO1998007193A1 Multichip module |
| 02/19/1998 | WO1998006765A1 Polysulfone copolymer compositions |
| 02/18/1998 | EP0824138A2 Water cleanable silver composition |
| 02/18/1998 | CN1173804A Earthing terminal structure |
| 02/18/1998 | CN1173803A Printed circuit board with embedded decoupling capactance and method for producing same |
| 02/18/1998 | CN1173714A Flexible circuit board fitting structure and recording copying device of using the same |
| 02/17/1998 | USRE35733 Device for interconnecting integrated circuit packages to circuit boards |
| 02/17/1998 | US5719752 Liquid crystal apparatus |
| 02/17/1998 | US5719750 Multilayer printed wiring board with plurality of ground layers forming separate ground planes |
| 02/17/1998 | US5719749 Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
| 02/17/1998 | US5719440 Flip chip adaptor package for bare die |
| 02/17/1998 | US5719354 Monolithic LCP polymer microelectronic wiring modules |
| 02/17/1998 | US5719253 Aprotic solvent-free |
| 02/17/1998 | US5719090 Multilayer coating of thermosetting resin filling interstices between fibers, first coating cured beyond b stage and second coating cured to b stage |
| 02/17/1998 | US5718593 Polarity-sensitive protector device |
| 02/17/1998 | US5718047 Method of manufacturing electrical junction box |
| 02/17/1998 | US5718039 Adhering copper foils, masking, etching |
| 02/12/1998 | WO1998006244A1 Surface mounting process of components for oscillators on printed circuits using conductive epoxy adhesive |
| 02/12/1998 | WO1998006243A1 Process for producing connecting conductors |
| 02/12/1998 | WO1998005715A1 Cross-linking polymer composition |
| 02/12/1998 | WO1998001013A3 Method and circuit board panel for preventing assembly-line delamination and sagging for circuit board manufacturing |
| 02/12/1998 | DE19647229C1 Plate type component carrier to component carrier connector device for e.g. circuit board |
| 02/12/1998 | DE19632200A1 Multichipmodul Multi-chip module |
| 02/11/1998 | EP0823833A2 Multilayer printed circuit boards |
| 02/11/1998 | EP0823193A1 Arrangement for the manufacture of multilayers |
| 02/11/1998 | EP0823096A1 Method of producing a smart card |
| 02/11/1998 | EP0822894A1 Anodized aluminum substrate having increased breakdown voltage |
| 02/11/1998 | EP0670779B1 A system of electronic laminates with improved registration properties |
| 02/11/1998 | CN1173269A Electronic circuit structure |
| 02/11/1998 | CN1173108A Multilayer printed circuit boards |
| 02/11/1998 | CN1173042A Direct chip attach for low alpha emission interconnect system |
| 02/10/1998 | US5717556 Printed-wiring board having plural parallel-connected interconnections |
| 02/10/1998 | US5717247 Microcircuit via interconnect |
| 02/10/1998 | US5717245 Ball grid array arrangement |
| 02/10/1998 | US5716663 Multilayer printed circuit |
| 02/10/1998 | US5716552 Paste; reducing leaching and solder diffusion; accuracy; bonding strength |
| 02/10/1998 | US5716481 Applying ceramic paste to surface, printing electrodes |
| 02/10/1998 | US5716220 Backplane arrangement for electrical equipment |
| 02/10/1998 | CA2119325C Molded plastic packaging of electronic devices |
| 02/05/1998 | WO1998005045A1 Conductor paste and multilayer ceramic part using the same |
| 02/05/1998 | WO1998004977A1 Computer backplane and supporting structure for printed circuit cards |
| 02/05/1998 | DE19733437A1 Einfache Harz Polybutadien und Polyisoren Heißfixierungszusammensetzungen und Verfahren zur Herstellung derselben Simple polybutadiene resin and Polyisoren heat-setting compositions and methods for manufacturing the same |
| 02/05/1998 | DE19630794A1 Temperature measuring system with temperature dependent measuring element as semiconductor resistor |
| 02/05/1998 | DE19630720A1 Filteranordnung zur Trennung eines HF-Felder enthaltenden Bereiches von einem gegen HF-Felder abgeschirmten Bereich Filter assembly containing the separation of RF fields range from a shielded from RF fields Area |
| 02/05/1998 | DE19621545C1 Production of circuit board |
| 02/04/1998 | EP0822740A2 Automatic mounting or connecting recognition apparatus |
| 02/04/1998 | EP0822737A2 Unit type clip lead terminal, connecting method, connecting board and method of producing such board |
| 02/04/1998 | EP0822595A2 Hybrid module |
| 02/04/1998 | EP0822224A2 Antistatic aromatic polyimide film |
| 02/04/1998 | EP0821708A1 Process for producing a polyamide based on a dicarboxylic acid and a diamine |
| 02/04/1998 | CN1172414A Printed-wiring board and production method thereof |
| 02/04/1998 | CN1172292A Module structure and electronic device |
| 02/03/1998 | US5715144 Multi-layer, multi-chip pyramid and circuit board structure |
| 02/03/1998 | US5715141 Control circuit arrangement having a clamping structure which connects a heat conductive substrate to a circuit board and provides electrically conducting leads therebetween |
| 02/03/1998 | US5715140 Overlay substrate for securing electronic devices in a vehicle |
| 02/03/1998 | US5714794 Electrostatic protective device |
| 02/03/1998 | US5714789 Circuit board-mounted IC package cooling apparatus |
| 02/03/1998 | US5714744 Wave pickup in the form of a printed coil for an electronic portable object such as a no-contact card or badge |
| 02/03/1998 | US5714718 Laminate wiring board |
| 02/03/1998 | US5714246 Unfired green tape consists of a binder, silver and solid glass portion; can be used as heat sink in a multi-chip module or multilayer circuit |
| 02/03/1998 | US5714241 Rganic binder, solvent, and inorganic component containing powdery gold, vanadium pentaoxide, and copper(ii) oxide |
| 02/03/1998 | US5714239 Composite component |
| 02/03/1998 | US5714238 Conductive adhesive and circuit using the same |
| 02/03/1998 | US5714112 Mixing fine silica powder and fine quartz powder with binder and solvent to from slurry, slip-casting and heating |
| 02/03/1998 | US5714050 Electroplating mold surface, pressing the mold against a borad made of a thermoplastic resin, heating and pressing, bonding circuit body to inner surface of casing, releasing male mold from female mold after cooling |
| 02/03/1998 | US5714013 Mixing rare earth compounds and metallic fluorides with solder and flux |
| 02/03/1998 | US5713762 Selectively metallized plastic hold-down connector |
| 02/03/1998 | US5713563 Wire bonding to flexible substrates |
| 02/03/1998 | US5713127 Non-annular lands |
| 02/03/1998 | US5713126 Method of mounting electronic connector on an end of printed circuit board |
| 01/29/1998 | WO1998004109A1 Non-mechanical magnetic pump for liquid cooling |
| 01/29/1998 | WO1998004107A1 Z-axis interconnect method and circuit |
| 01/29/1998 | WO1998004021A1 Assembly of connector and printed circuit board |
| 01/29/1998 | WO1998004020A1 Reduced cross talk electrical connector |
| 01/29/1998 | WO1998004000A1 Plug-in type electronic control unit, connecting structure between wiring board and plug member, connecting unit between electronic parts and wiring board, and electronic parts mounting method |
| 01/29/1998 | WO1998003896A1 Electronically addressable microencapsulated ink and display thereof |
| 01/29/1998 | DE19732572A1 Simplified dashboard for motor-vehicle |
| 01/29/1998 | DE19730323A1 Electrical connectors for motor vehicle door-mounted equipment |
| 01/29/1998 | DE19726850A1 Moulded circuit board preparation |
| 01/29/1998 | CA2553137A1 Electronically addressable microencapsulated ink and display thereof |
| 01/29/1998 | CA2260947A1 Electronically addressable microencapsulated ink and display thereof |
| 01/29/1998 | CA2211535A1 Automatic mounting or connecting recognition apparatus |
| 01/28/1998 | EP0821427A1 Dielectric line waveguide |
| 01/28/1998 | EP0820965A1 Inorganic composition for low temperature firing |
| 01/28/1998 | EP0820643A1 Integrated circuit packages |
| 01/28/1998 | EP0820540A1 Unidirectional glass fabric produced with continuous yarn which is twisted, has a low number of twists or zero twisting turns and interlaced with thin glass yarns as a stabilizing binding, and use thereof in the manufacture of printed circuits |
| 01/28/1998 | CN1171718A Multi-layered interconnection board capable of reducing cross-talk noise |
| 01/28/1998 | CN1171602A Composition and process for filling vias |
| 01/28/1998 | CN1037212C Photosensitive aqueous developable ceramic coating composition |
| 01/27/1998 | US5712769 Subrack for electronic circuit boards |
| 01/27/1998 | US5712768 Space-saving assemblies for connecting integrated circuits to circuit boards |
| 01/27/1998 | US5712767 Circuit elements mounting |
| 01/27/1998 | US5712765 Housing for printed circuit board |