| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/29/1998 | EP0855090A1 Multichip module |
| 07/29/1998 | EP0854759A1 Flip chip underfill system and method |
| 07/29/1998 | CN1189287A Method for forming fiducial mark in resin stencil and stencil formed thereby |
| 07/29/1998 | CN1189125A Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
| 07/29/1998 | CN1189087A Method for mounting optical semiconductor device on supporting substrate and their two formed component |
| 07/29/1998 | CN1188974A Electric switch device on printed circuit and watch comprising such device |
| 07/29/1998 | CN1188968A Flexible printed circuitry with pseudo-twisted conductors |
| 07/28/1998 | US5787498 Integrated circuit memory with verification unit which resets an address translation register upon failure to define one-to-one correspondences between addresses and memory cells |
| 07/28/1998 | US5787098 Complete chip I/O test through low contact testing using enhanced boundary scan |
| 07/28/1998 | US5786989 Printed circuit board mounting structure and electronic device using the same |
| 07/28/1998 | US5786986 Multi-level circuit card structure |
| 07/28/1998 | US5786785 Electromagnetic radiation absorptive coating composition containing metal coated microspheres |
| 07/28/1998 | US5786288 Low dielectric ceramic compositions for multilayer ceramic package |
| 07/28/1998 | US5786238 Laminated multilayer substrates |
| 07/28/1998 | US5785879 Concurrently firing ceramic and melting internal conductive powder |
| 07/28/1998 | US5785789 Applying first microsphere filled resin layer to first removable carrier, partiall-curing resin layer prior to introduction to multilayer structure and lamination of multilayer and first and second microspheres filled resins |
| 07/28/1998 | US5785787 Forming holes through low dielectric constant porous polymeic layer containing additives, metallizing and patterning the surface, then removing additives |
| 07/28/1998 | US5785786 Ultrasonic welding method |
| 07/28/1998 | US5785533 Termination panel for control unit |
| 07/28/1998 | US5785532 Power distribution box and system |
| 07/28/1998 | US5785418 Thermally protected LED array |
| 07/23/1998 | WO1998032314A2 Solder joints for surface mount chips |
| 07/23/1998 | WO1998032213A2 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 07/23/1998 | WO1998032193A1 Signal conductor |
| 07/23/1998 | WO1998031538A1 Laminate for printed circuit boards |
| 07/23/1998 | WO1998020402A3 Hand-held computer with communication through diffuse infrared with positioning sensors |
| 07/23/1998 | DE19800234A1 Brushless motor e.g.for vehicle air-conditioner fan |
| 07/23/1998 | DE19756569A1 Forming laminated ceramic substrate with conductive contacts on one main surface |
| 07/23/1998 | DE19708615C1 Chip-card module design and manufacture |
| 07/23/1998 | DE19701510A1 Signalleiter Signal conductor |
| 07/23/1998 | CA2278019A1 Solder joints for surface mount chips |
| 07/23/1998 | CA2274952A1 Laminate for printed circuit boards |
| 07/22/1998 | EP0854666A2 Control device comprising at least two housing parts |
| 07/22/1998 | EP0854664A1 Printed circuit board including crosstalk compensation |
| 07/22/1998 | EP0854541A1 Connector and wiring structure for high current |
| 07/22/1998 | EP0853919A2 A high resolution intravascular ultrasound transducer assembly having a flexible substrate and method for manufacture thereof |
| 07/22/1998 | EP0752154B1 Printed circuit board relay with insert connections |
| 07/22/1998 | CN1188388A Flexible printed circuit and process for producing the same |
| 07/22/1998 | CN1188305A Optical pickup device with biaxial drive for objective lens |
| 07/21/1998 | US5784264 MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form |
| 07/21/1998 | US5784262 Arrangement of pads and through-holes for semiconductor packages |
| 07/21/1998 | US5784261 Microchip module assemblies |
| 07/21/1998 | US5784259 Card-type electronic device with plastic frame sandwiched between printed circuit boarding metal panel |
| 07/21/1998 | US5784258 Wiring board for supporting an array of imaging chips |
| 07/21/1998 | US5784256 Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board |
| 07/21/1998 | US5784248 Method of mounting solid electrolytic capacitor onto printed circuit board, and assembly of the capacitor and the board |
| 07/21/1998 | US5783976 Composite high frequency apparatus and method of forming same |
| 07/21/1998 | US5783865 Wiring substrate and semiconductor device |
| 07/21/1998 | US5783639 Composition of epoxy group-containing cycloolefin resin |
| 07/21/1998 | US5783370 Panelized printed circuit cables for high volume printed circuit cable manufacturing |
| 07/21/1998 | US5783368 Method of forming conductive paths on a substrate containing depressions |
| 07/21/1998 | US5783252 Technique for forming resin-impregnated fiberglass sheets |
| 07/21/1998 | US5783113 Conductive paste for large greensheet screening including high thixotropic agent content |
| 07/21/1998 | US5783039 Wholly aromatic polyamide fiber sheet |
| 07/21/1998 | US5783026 Apparatus for stacking sheets by carriers |
| 07/21/1998 | US5783008 Apparatus and method for embedding conductors in a non-planar substrate |
| 07/21/1998 | US5782757 For non-invasive measurement of characteristics of a medium |
| 07/21/1998 | US5782555 Heat dissipating L.E.D. traffic light |
| 07/16/1998 | WO1998031204A1 Printed wiring board and method of manufacturing the same |
| 07/16/1998 | WO1998031203A1 Improvements in or relating to thermal trip arrangements |
| 07/16/1998 | WO1998031075A1 High density connector arrangement for a circuit board module |
| 07/16/1998 | WO1998030967A2 Flexible touchpad circuit with mounted circuit board |
| 07/16/1998 | DE19701163A1 Electrical circuit with contact track layer especially for chip card |
| 07/16/1998 | DE19700968A1 Flat-panel type electrical lighting module |
| 07/16/1998 | DE19700963A1 Verfahren zur Herstellung eines Leistungsmoduls mit einer aktive Halbleiterbauelemente und passive Halbleiterbauelemente aufweisenden Schaltungsanordnung Method for producing a power module having a semiconductor active devices and passive semiconductor devices having circuitry |
| 07/15/1998 | EP0853342A1 Plug-in type electronic control unit, connecting structure between wiring board and plug member, connecting unit between electronic parts and wiring board, and electronic parts mounting method |
| 07/15/1998 | EP0853321A1 Conductor paste and multilayer ceramic part using the same |
| 07/15/1998 | EP0852897A1 Method for surface mounting a heatsink to a printed circuit board |
| 07/15/1998 | EP0852896A2 Method and circuit board panel for preventing assembly-line delamination and sagging for circuit board manufacturing |
| 07/15/1998 | EP0852806A1 Apparatus and method for making laminated electrical and electronic devices |
| 07/15/1998 | EP0788726B1 Current supply module for mounting on a component-carrying printed circuit board |
| 07/15/1998 | EP0743929B1 Substrate of a ceramic material |
| 07/15/1998 | EP0662019A4 Method for making a ceramic metal composite. |
| 07/15/1998 | EP0650423B1 Electrical device, especially a switching and control device for motor vehicles |
| 07/15/1998 | CN1187897A Integrated head-electronics interconnection suspension for data recording disk drive |
| 07/15/1998 | CN1187751A Printed circuit board for large current |
| 07/14/1998 | US5781791 Digital microelectronic circuit package using buffer dies and programmable device or memory dies |
| 07/14/1998 | US5781551 Computer communications system with tree architecture and communications method |
| 07/14/1998 | US5781413 Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations |
| 07/14/1998 | US5781412 Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size |
| 07/14/1998 | US5781402 Improved electrical reliability by improving strength of bond between ceramic substrate and thick film electrode to improve adhesion of solder to thick film electrode |
| 07/14/1998 | US5781379 Single beam flexure for a head gimbal assembly |
| 07/14/1998 | US5781264 Liquid crystal display device |
| 07/14/1998 | US5781124 Electrically configurable connection matrix between lines of at least one input/output port for electrical signals |
| 07/14/1998 | US5781110 Electronic article surveillance tag product and method of manufacturing same |
| 07/14/1998 | US5781074 Low electromagnetic interference clock oscillator module |
| 07/14/1998 | US5780776 Multilayer circuit board unit |
| 07/14/1998 | US5780366 Technique for forming resin-impregnated fiberglass sheets using multiple resins |
| 07/14/1998 | US5780143 Circuit board |
| 07/14/1998 | US5779941 A stabilizer preventing the printed circuit boards from making noise |
| 07/14/1998 | US5779921 Coating, imaging, stripping, masking, electrically bussing, electroplating |
| 07/14/1998 | US5779836 Method for making a printed wiring board |
| 07/14/1998 | US5779134 Method for surface mounting a heatsink to a printed circuit board |
| 07/14/1998 | US5778529 Method of making a multichip module substrate |
| 07/14/1998 | US5778526 Method for mounting a power-dissipating component |
| 07/14/1998 | US5778523 Method for controlling warp of electronic assemblies by use of package stiffener |
| 07/14/1998 | CA2121772C Power supply structure for multichip package |
| 07/14/1998 | CA2089240C Method and apparatus for fabrication of thin film semiconductor devices using non-planar, exposure beam lithography |
| 07/09/1998 | WO1998030075A2 Method and arrangement for heating a component |
| 07/09/1998 | WO1998030072A1 Ceramic composite wiring structures for semiconductor devices and method of manufacture |