Patents for H05K 1 - Printed circuits (98,583)
01/1998
01/02/1998DE19638637A1 Mounting LED displays and other devices on printed circuit boards
01/02/1998DE19626227A1 Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere Multichipmodule Arrangement for heat dissipation in chip modules on multi-layered ceramic carriers, particularly multi-chip modules
01/02/1998DE19626082A1 Package for surface-mounted semiconductor device
01/02/1998DE19625756A1 Modul für ein elektrisches Gerät Module for an electrical appliance
01/02/1998DE19625386A1 Multilayer, double-sided, flexible or rigid electrical and optical circuit board production avoiding chemicals recovery
01/02/1998DE19624720A1 Ceramic and/or polymer substrate e.g. for SMD gas or heat sensor
01/01/1998CA2208292A1 Contact device for electrically connecting a printed circuit board with a liquid crystal display
12/1997
12/31/1997WO1997050281A1 Filter chip
12/31/1997WO1997050156A1 Printed circuit board with plug-in contact points of the printed conductor type
12/31/1997WO1997050123A1 A power-ground plane for a c4 flip-chip substrate
12/31/1997WO1997050121A1 Method for transferring conductor pattern to film carrier, mask used for the method and film carrier
12/31/1997WO1997049549A1 A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates
12/31/1997WO1997036467A3 Protective module for a telecommunication system distributor
12/31/1997CN1169235A Printed circuit board and heat sink arrangement
12/31/1997CN1169031A Method and device for forming convex
12/30/1997US5703891 Pulse forming network assembly
12/30/1997US5703761 Shielding for flat modules
12/30/1997US5703760 Mother board with flexible layout for accommodating computer system design options
12/30/1997US5703752 Heat dissipating apparatus for a semiconductor device for use in a motor drive
12/30/1997US5703542 Compact temperature stabilized crystal oscillator
12/30/1997US5703400 Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
12/30/1997US5703331 Circuitized structure including flexible circuit with elastomeric member bonded thereto
12/30/1997US5703144 Solid furan binders for composite articles
12/30/1997US5702991 Fiber reinforcement is impregnated with photopolymer
12/30/1997US5702807 Ceramic circuit board and manufacturing method thereof
12/30/1997US5702662 Process for ablating high density vias in flexible substrate
12/30/1997US5702254 Combination receptacle for interchangeable lamps in circuit boards
12/30/1997US5701667 Method of manufacture of an interconnect stress test coupon
12/29/1997EP0814644A1 Improved copper foil for printed circuit boards
12/29/1997EP0814643A2 Multilayer printed circuit board
12/29/1997EP0814539A2 Method and apparatus for connecting flexible circuits to printed circuit boards
12/29/1997EP0814511A2 Plastic ball grid array module
12/29/1997EP0814510A2 TAB tape and semiconductor device using the TAB tape
12/24/1997WO1997049130A1 Method and apparatus for manufacturing side-terminated chips
12/24/1997WO1997048752A1 Composite structures and prepreg therefor
12/24/1997WO1997048658A1 Photosensitive ceramic green sheet, ceramic package, and process for producing the same
12/24/1997CN1168618A High-frequency electron device
12/24/1997CN1168617A Plastic ball grid array module
12/23/1997US5701220 Magnetic disk drive
12/23/1997US5700987 Alignment and bonding techniques
12/23/1997US5700979 Flexible strip cable with extension for testing
12/23/1997US5700844 Process for making a foamed polymer
12/23/1997US5700623 Useful in articles that are exposed to high temperatures during and after manufacture
12/23/1997US5700562 Laminated resin films with predetermined coefficients of linear expansion
12/23/1997US5700549 Structure to reduce stress in multilayer ceramic substrates
12/23/1997US5700548 Multilayer film, multicolour screen-printing process for the manufacture of said multilayer film and the use of same
12/23/1997US5700373 Method for sealing a filter
12/23/1997US5700338 Method of manufacturing resistor integrated in sintered body and method of manufacturing multilayer ceramic electronic component
12/23/1997US5700167 In a communication system
12/23/1997US5699613 Fine dimension stacked vias for a multiple layer circuit board structure
12/23/1997US5699612 Method of checking connected state between IC socket and printed wiring board
12/23/1997US5699610 Process for connecting electronic devices
12/23/1997US5699609 Method of making power substrate assembly
12/23/1997CA2103966C Connector for communication systems with cancelled crosstalk
12/18/1997WO1997048258A1 Screen printing method and screen printing apparatus
12/18/1997WO1997048257A1 Electrical circuit
12/18/1997WO1997048256A1 Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same
12/18/1997WO1997048187A1 Printed circuit board having integrated broadside microwave coupler
12/18/1997DE19725108A1 Hot melt adhesive for making printed circuit boards
12/18/1997CA2258108A1 Microwave stripline structure
12/17/1997EP0813355A2 Printed circuit board with embedded decoupling capacitance and method for producing same
12/17/1997EP0813235A2 Method for manufacturing multilayer wiring board and wiring pattern forming apparatus
12/17/1997EP0813205A2 Single in-line memory module
12/17/1997EP0813204A2 Single in-line memory module
12/17/1997EP0812258A1 Electrical feedthroughs for ceramic circuit board support substrates
12/17/1997CN1168080A Attached terminal component mounting structure
12/17/1997CN1168078A Printed-circuit board and method for precise assembly and soldering of electronic components on surface of printed-circuit board
12/17/1997CN1168077A Wiring board and its making method
12/17/1997CN1036739C Automotive glass thick film conductor paste and application method thereof
12/17/1997CA2208098A1 Radio pager
12/16/1997US5699235 Electronic control board assembly including embedded lead frames for electrically connecting the circuit boards of the assembly
12/16/1997US5699234 Stacking of three dimensional high density interconnect modules with metal edge contacts
12/16/1997US5699233 Control unit housing with interconnecting conductor paths
12/16/1997US5699231 Method of packaging high voltage components with low voltage components in a small space
12/16/1997US5699230 Electric circuit device and ignition apparatus for internal combustion engine using the same
12/16/1997US5699212 Method of electrostatic discharge protection of magnetic heads in a magnetic storage system
12/16/1997US5698725 Surface treating agent for glass fiber substrates
12/16/1997US5698623 Resin precursors having thixotropic properties and fillers stabilized against settling
12/16/1997US5698299 Thin laminated microstructure with precisely aligned openings
12/16/1997US5698268 Resin composition for electroless metal deposition and method for electroless metal deposition
12/16/1997US5698015 Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste
12/11/1997WO1997047165A1 Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device
12/11/1997WO1997047164A2 Method of exposing a path on a curved, or otherwise irregularly shaped surface
12/11/1997WO1997047103A2 Reconfigurable node for a communications network
12/11/1997WO1997047087A1 Proximity switches with mechanical decoupling of terminal pins and plug-in unit
12/11/1997WO1997047031A1 Method for mounting semiconductor chip
12/11/1997WO1997046349A1 Blind via laser drilling system
12/11/1997DE19724473A1 Suppression filter for reducing switching interference signals in static converter
12/11/1997DE19715479A1 New polyimide copolymer with good solubility in volatile solvents
12/11/1997DE19625398C1 Leiterplatte mit leiterbahnartigen Steckkontaktstellen PCB with conductor track-like plug contact positions
12/10/1997EP0812030A1 Chip Antenna
12/10/1997EP0812015A1 A heat dissipator for integrated circuits
12/10/1997EP0811993A2 Electrical devices
12/10/1997EP0811619A1 Novel ester compound and thermosetting resin composition using the same
12/10/1997CN1167563A Chemically grafted electrical device
12/09/1997US5696667 Backplane for high speed data processing system
12/09/1997US5696404 Semiconductor wafers with device protection means and with interconnect lines on scribing lines
12/09/1997US5696353 Flexible circuit
12/09/1997US5695861 Composition containing titanium hydride and metal(s); leach resistance
12/09/1997US5695860 Resonant tag and method of manufacturing the same