Patents for H05K 1 - Printed circuits (98,583)
01/2004
01/01/2004US20040002206 Wiring layout of auxiliary wiring package and printed circuit wiring board
01/01/2004US20040001961 Dry films; reducing dielectric interface
01/01/2004US20040001661 Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling of member the module
01/01/2004US20040001328 Back Plane Structure for SCSI
01/01/2004US20040001327 Foolproof polarity indications of poled electronic parts or devices in printed circuit board
01/01/2004US20040001325 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
01/01/2004US20040001324 Module board having embedded chips and components and method of forming the same
01/01/2004US20040001319 Circuit-constituting member and circuit unit
01/01/2004US20040001303 Computer system employing redundant power distribution
01/01/2004US20040000979 Multilayer stripline radio frequency circuits and interconnection methods
01/01/2004US20040000978 Substrate enhancement for improved signal characteristics on a discontinuous transmission line
01/01/2004US20040000977 Transmission line structure for reduced coupling of signals between circuit elements on a circuit board
01/01/2004US20040000976 High efficiency resonant line
01/01/2004US20040000975 High efficiency single port resonant line
01/01/2004US20040000972 High efficiency interdigital filters
01/01/2004US20040000970 High efficiency coupled line filters
01/01/2004US20040000966 High efficiency four port circuit
01/01/2004US20040000964 High efficiency directional coupler
01/01/2004US20040000963 Broadband impedance transformers
01/01/2004US20040000962 High efficiency quarter-wave transformer
01/01/2004US20040000961 High efficiency three port circuit
01/01/2004US20040000960 High efficiency low pass filter
01/01/2004US20040000711 Insitu-cooled electrical assemblage
01/01/2004US20040000710 Printed circuit board and fabrication method thereof
01/01/2004US20040000709 Internal package interconnect with electrically parallel vias
01/01/2004US20040000708 Memory expansion and chip scale stacking system and method
01/01/2004US20040000707 Modularized die stacking system and method
01/01/2004US20040000584 Carriers for printed circuit board marking
01/01/2004US20040000427 Process for creating vias for circuit assemblies
01/01/2004US20040000425 Methods for fabricating three-dimensional all organic interconnect structures
01/01/2004US20040000204 Method and apparatus for attaching a sensor assembly in a control unit
01/01/2004US20040000049 Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
12/2003
12/31/2003WO2004002204A1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
12/31/2003WO2004002203A1 Circuit board device and method for board-to-board connection
12/31/2003WO2004002202A1 Printed board for electronic devices controlling a motor vehicle
12/31/2003WO2004001967A1 Semiconductor switching device
12/31/2003WO2004001963A1 Electronic component comprising a multilayer substrate and corresponding method of production
12/31/2003WO2004001906A1 Connection device for flexible circuit
12/31/2003WO2004001848A1 Electronics circuit manufacture
12/31/2003WO2004001773A2 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface
12/31/2003WO2004001603A1 Memory module having a path for transmitting high-speed data and a path for transmitting low-speed data and memory system having the memory module
12/31/2003WO2004001567A2 Tablet computing device with three-dimensional docking support
12/31/2003WO2004000937A1 Molding of wholly aromatic liquid crystal polyester resin
12/31/2003CN1465218A Method and material for manufacturing circuit formed substrate
12/31/2003CN1465217A Method for manufacturing ceramic multilayer circuit board
12/31/2003CN1465216A Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet
12/31/2003CN1465215A Circuit board, circuit board use member and production method therefor and method of laminating fexible film
12/31/2003CN1465214A Circuit module
12/31/2003CN1465213A Circuit formed substrate and method of manufacturing circuit formed substrate
12/31/2003CN1465212A Manufacturing fire retardant circuit boards without the use of fire retardant resin additives
12/31/2003CN1465099A Power module and air conditioner
12/31/2003CN1465098A Semiconductor device and its manufacturing method
12/31/2003CN1465076A Method for producing nanocomposite magnet using atomizing method
12/31/2003CN1465075A Production method for conductive paste and production method for printed circuit board
12/31/2003CN1464898A 树脂组合物 Resin composition
12/31/2003CN1464863A Method for producing spherical oxide powder and apparatus for producing spherical powder, composite dielectric material, and substrate and process for producing substrate
12/31/2003CN1464838A Capacitor layer forming both side copper clad laminated heet and production method therefor
12/31/2003CN1464829A Method and device for forming module electronic component and module electronic component
12/31/2003CN1133242C Power connector
12/31/2003CN1133240C 非圆形微通道 Non-circular microchannel
12/31/2003CN1132800C Dielectric ceramic composite
12/30/2003US6671808 USB-compliant personal key
12/30/2003US6671183 Electronic equipment having two circuit boards overlapping only partly
12/30/2003US6671176 Method of cooling heat-generating electrical components
12/30/2003US6671173 Substrate-stacking structure
12/30/2003US6671163 Integrated spark and switch unit for combustion fastener driving tool
12/30/2003US6671154 Surge protector for high speed data networks
12/30/2003US6670819 Methods of engaging electrically conductive pads on a semiconductor substrate
12/30/2003US6670816 Test coupon for measuring a dielectric constant of a memory module board and method of use
12/30/2003US6670795 Apparatus for providing regulated power to an integrated circuit
12/30/2003US6670718 Wiring board utilizing a conductive member having a reduced thickness
12/30/2003US6670706 Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same
12/30/2003US6670701 Semiconductor module and electronic component
12/30/2003US6670700 Interconnect substrate and semiconductor device electronic instrument
12/30/2003US6670699 Semiconductor device packaging structure
12/30/2003US6670697 Semiconductor device module frame and group thereof
12/30/2003US6670696 Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof
12/30/2003US6670558 Inline and “Y” input-output bus topology
12/30/2003US6670557 Design for constructing an input circuit to receive and process an electrical signal
12/30/2003US6670556 Printed circuit board unit with detachment mechanism for electronic component
12/30/2003US6670548 Electrical junction box for a vehicle
12/30/2003US6670285 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials
12/30/2003US6670101 For making additional interconnect layers on commercially available printed circuit boards
12/30/2003US6669871 ESD dissipative ceramics
12/30/2003US6669801 Device transfer method
12/30/2003US6669501 Wiring circuit member for vehicle
12/30/2003US6669489 Interposer, socket and assembly for socketing an electronic component and method of making and using same
12/30/2003US6668451 Methods for trimming electrical parameters in an electrical circuit
12/30/2003US6668449 Method of making a semiconductor device having an opening in a solder mask
12/30/2003US6668448 Method of aligning features in a multi-layer electrical connective device
12/30/2003US6668447 Multilayered board comprising folded flexible circuits and method of manufacture
12/26/2003CA2433711A1 Solid-state warning light with environmental control
12/25/2003WO2003106740A1 Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board
12/25/2003US20030236359 Polyimide substrates having an interpenetrating network morphology and methods relating thereto
12/25/2003US20030236335 Shaping 20-80% by weight of a polymer matrix, e.g., poly-phenylene sulfide, and a thermoconductive, dielectric, e.g., boron nitride; low dielectric constant; good mechanical strength; molding materials; circuit supports
12/25/2003US20030236078 Wireless receiving device
12/25/2003US20030236009 Circuit board terminal
12/25/2003US20030236005 Electromagnetic bus coupling
12/25/2003US20030235721 Redundant battery connections
12/25/2003US20030235044 Electronic circuit board manufacturing process and associated apparatus