| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/14/2004 | EP1381108A2 High-frequency switch |
| 01/14/2004 | EP1381080A2 Component-embedded board fabrication method and apparatus |
| 01/14/2004 | EP1380193A1 A method for forming a printed circuit board and a printed circuit board formed thereby |
| 01/14/2004 | EP1380066A1 Microwave circuit |
| 01/14/2004 | EP1379340A1 Layered stacks and methods of production thereof |
| 01/14/2004 | EP1034091B1 Interior trim panel and electrical harness apparatus for an automotive vehicle |
| 01/14/2004 | EP0866649B1 Highly heat-conductive composite magnetic material |
| 01/14/2004 | CN2599833Y Power supply adapter |
| 01/14/2004 | CN2599832Y Power supply adapter |
| 01/14/2004 | CN2599820Y Modular connector (13) |
| 01/14/2004 | CN2599818Y Modular connector (2) |
| 01/14/2004 | CN2599783Y Electronic card connector assembly |
| 01/14/2004 | CN1468467A Thick film millimeter wave transceiver module |
| 01/14/2004 | CN1468177A Card type recording medium and production method therefor |
| 01/14/2004 | CN1468048A Enhancement of current-carrying capacity of a multilayer circuit board |
| 01/14/2004 | CN1468046A Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment |
| 01/14/2004 | CN1468045A Structure of printed circuit board |
| 01/14/2004 | CN1467831A Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
| 01/14/2004 | CN1467803A Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another |
| 01/14/2004 | CN1467760A Method for manufacturing laminated electronic device |
| 01/14/2004 | CN1467685A Ic card and manufacturing method thereof |
| 01/14/2004 | CN1467594A Circuit base plate and electronic installation |
| 01/14/2004 | CN1467541A Liquid crystal display device and method for manufacturing liquid crystal display device |
| 01/14/2004 | CN1467169A High k glass and tape composition for use at high frequency |
| 01/14/2004 | CN1467167A 高热膨胀玻璃和带子组合物 Thermal expansion glass and tape compositions |
| 01/14/2004 | CN1134888C Method of forming groove in surface of mother substrate |
| 01/14/2004 | CN1134798C Method for producing rotary print conductor and method for producing raw sheet in laminate |
| 01/13/2004 | USRE38381 Inverted board mounted electromechanical device |
| 01/13/2004 | US6678877 Creating a PC board (PCB) layout for a circuit in which the components of the circuit are placed in the determined PCB landing areas |
| 01/13/2004 | US6678169 Printed circuit board and electronic equipment using the board |
| 01/13/2004 | US6678167 High performance multi-chip IC package |
| 01/13/2004 | US6678145 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board |
| 01/13/2004 | US6678144 Capacitor, circuit board with built-in capacitor and method for producing the same |
| 01/13/2004 | US6678138 Environmentally insensitive surge suppressor apparatus and method |
| 01/13/2004 | US6677881 Radio wave absorber |
| 01/13/2004 | US6677847 In board filter inductor for switching power supply on a printed circuit board |
| 01/13/2004 | US6677831 Differential impedance control on printed circuit |
| 01/13/2004 | US6677670 Semiconductor device |
| 01/13/2004 | US6677580 Photo-interrupter and semiconductor device using it |
| 01/13/2004 | US6677553 Laser processing apparatus |
| 01/13/2004 | US6677521 Electrical junction box for a vehicle |
| 01/13/2004 | US6677248 Coaxial type signal line and manufacturing method thereof |
| 01/13/2004 | US6677073 Non-woven fiber webs |
| 01/13/2004 | US6676784 Process for the manufacture of multilayer ceramic substrates |
| 01/13/2004 | US6676457 Connector and method for connecting a connector to a printed-circuited board |
| 01/13/2004 | US6676440 Coin type battery and a coin type capacitor; soldering |
| 01/13/2004 | US6676438 Contact structure and production method thereof and probe contact assembly using same |
| 01/13/2004 | US6676431 PGA socket and contact |
| 01/13/2004 | US6675473 Method of positioning a conductive element in a laminated electrical device |
| 01/13/2004 | US6675471 Method of producing high-frequency modules |
| 01/13/2004 | US6675470 Method for manufacturing an electro-optical device |
| 01/13/2004 | US6675454 Method for recycling used printed circuit boards |
| 01/13/2004 | CA2322468C Integrated circuit connection using an electrically conductive adhesive |
| 01/08/2004 | WO2004004434A1 Multilayer stripline radio frequency circuits and interconnection methods |
| 01/08/2004 | WO2004004433A1 Process for creating vias for circuit assemblies |
| 01/08/2004 | WO2004004432A1 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 01/08/2004 | WO2004004428A1 Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| 01/08/2004 | WO2004004427A1 Carriers for printed circuit board marking |
| 01/08/2004 | WO2004004017A2 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof |
| 01/08/2004 | WO2004004000A1 Structure for connecting power supply to semiconductor device |
| 01/08/2004 | WO2004003992A1 Cof film carrier tape and its manufacturing method |
| 01/08/2004 | WO2004003991A2 Electronic component with a housing packaging |
| 01/08/2004 | WO2004003571A1 Assembling method and sensor assembly including stacked printed circuit boards with common attachment |
| 01/08/2004 | WO2004003284A1 Collecting agent for glass fiber yarn and glass fiber yarn using the same |
| 01/08/2004 | WO2004003283A1 Collecting agent for glass fiber yarn and method for producing glass fiber yarn |
| 01/08/2004 | WO2004003282A1 Collecting agent for glass fiber yarn and glass fiber yarn using the same |
| 01/08/2004 | WO2004003259A1 Method of forming polyimide coating containing dielectric filler on surface of metallic material, process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process |
| 01/08/2004 | WO2004003086A1 Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 01/08/2004 | WO2004003057A1 Curable composition, cured article obtained therefrom, and polyimide resin for use in the same |
| 01/08/2004 | WO2004003055A1 Biaxially oriented polyester film and laminates thereof with copper |
| 01/08/2004 | WO2004002745A1 Ink jet printhead chip with predetermined micro-electromechanical systems height |
| 01/08/2004 | WO2003081966A3 Process and apparatus for manufacturing printed circuit boards |
| 01/08/2004 | WO2002100952A3 Tab circuit for ink jet printer cartridges |
| 01/08/2004 | WO2002097534A3 Apparatus and method for aligning an article with a reference object |
| 01/08/2004 | WO2002041397A3 Low profile integrated module interconnects |
| 01/08/2004 | US20040006676 Method for bus capacitance reduction |
| 01/08/2004 | US20040006675 Method for bus capacitance reduction |
| 01/08/2004 | US20040006407 Layer allocating apparatus for multi-layer circuit board |
| 01/08/2004 | US20040005790 Ball grid array jumper |
| 01/08/2004 | US20040005506 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern |
| 01/08/2004 | US20040005109 Optoelectronic packaging substrate and production method of the same |
| 01/08/2004 | US20040004844 Illuminated message sign with angled light emitting device array |
| 01/08/2004 | US20040004823 COF flexible printed wiring board and method of producing the wiring board |
| 01/08/2004 | US20040004822 Method, adapter card and configuration for an installation of memory modules |
| 01/08/2004 | US20040004293 Semiconductor package |
| 01/08/2004 | US20040004292 Non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads. |
| 01/08/2004 | US20040004285 BGA substrate via structure |
| 01/08/2004 | US20040004276 Optical apparatus and method for making the same |
| 01/08/2004 | US20040004228 Methods of fabricating semiconductor substrate-based BGA interconnection |
| 01/08/2004 | US20040004209 Low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked |
| 01/08/2004 | US20040004129 Identifying card |
| 01/08/2004 | US20040003999 Such as cationic tetrabromobisphenol a-diethylene glycol-diethanolamine resin and curing agent; flame resistance protective layer; circuit board fabrication |
| 01/08/2004 | US20040003942 System and method for minimizing a loading effect of a via by tuning a cutout ratio |
| 01/08/2004 | US20040003941 Technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device |
| 01/08/2004 | US20040003743 Integrated activating device for explosives |
| 01/08/2004 | US20040003691 Forming folded-stack packaged device using vertical progression folding tool |
| 01/08/2004 | DE20220681U1 Mirror-symmetrical electronic module for required mirror-symmetrical applications with circuit board and electronic circuit with electronic components and conductive tracks |
| 01/08/2004 | DE10325569A1 IC Karte und Verfahren zu ihrer Herstellung IC card and processes for their preparation |
| 01/08/2004 | DE10225431A1 Verfahren zur Anschlußkontaktierung von elektronischen Bauelementen auf einem isolierenden Substrat und nach dem Verfahren hergestelltes Bauelement-Modul A process for Contact connection of electronic components on an insulating substrate and component produced by the process module |
| 01/08/2004 | DE10224057A1 Kontaktverbindung und Verfahren zu deren Herstellung Contact compound and processes for their preparation |