| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/03/2005 | US20050045697 Wafer-level chip scale package |
| 03/03/2005 | US20050045471 Process for producing transparent conductive laminate |
| 03/03/2005 | US20050045379 Circuit board and method of manufacturing the same |
| 03/03/2005 | US20050045377 Potting crack shield and related method |
| 03/03/2005 | US20050045376 High frequency multilayer circuit structure and method for the manufacture thereof |
| 03/03/2005 | US20050045374 Flexible circuit boards with tooling cutouts for optoelectronic modules |
| 03/03/2005 | US20050045371 Circuit board |
| 03/03/2005 | US20050045370 Printed board and method of displaying an identification mark on the same |
| 03/03/2005 | US20050045369 Circuit component built-in module and method for manufacturing the same |
| 03/03/2005 | US20050045268 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet |
| 03/03/2005 | US20050045223 Fabricating thin films for solid state storage devices without annealing; low cost, efficient energy conversion |
| 03/03/2005 | US20050044702 Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges |
| 03/03/2005 | DE10335153A1 Schaltungsanordnung auf einem Substrat und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat A circuit arrangement on a substrate and methods for producing the circuitry on the substrate |
| 03/03/2005 | DE10320441B3 Component carrier, e.g. for motor vehicle door lock, has casting tub defined by housing walls on floor with holders for electrical devices as openings, bounding walls with complementary grooves, protrusions in holders/on devices |
| 03/02/2005 | EP1511366A2 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board |
| 03/02/2005 | EP1511362A2 Automotive lamp |
| 03/02/2005 | EP1511090A2 Package for a semiconductor light emitting device |
| 03/02/2005 | EP1511075A2 Electronic part mounting substrate and method for producing same |
| 03/02/2005 | EP1510965A1 Card adapter |
| 03/02/2005 | EP1510797A1 Sensor arrangement, especially for vehicles |
| 03/02/2005 | EP1509992A1 Circuit arrangement for controlling electromotive driving means of a mobile working machine, particularly of an industrial truck |
| 03/02/2005 | EP1509479A1 Ltcc tape composition |
| 03/02/2005 | CN2682669Y Circuit board and casing capable of preventing incorrect splicing |
| 03/02/2005 | CN1589595A Data bus connection for memory device |
| 03/02/2005 | CN1589096A Hetero information isolator |
| 03/02/2005 | CN1589095A Electromagnetic interference masking method and shading device and printing circuit board |
| 03/02/2005 | CN1589092A Soft circuit board connecting structure |
| 03/02/2005 | CN1589091A Soft thin composite base plate |
| 03/02/2005 | CN1589090A Printing circuit layout method, printing circuit board and electronic device |
| 03/02/2005 | CN1588573A PTC thick film curc uit controllable electric heating element |
| 03/02/2005 | CN1191747C Electronic element assembling examining method |
| 03/02/2005 | CN1191746C Production Process of film-like flexible circuit board |
| 03/02/2005 | CN1191744C Printed circuit board with built-in resistor and its making method |
| 03/02/2005 | CN1191743C Flexible microsystem and building techniques and micro photoelectric motor |
| 03/02/2005 | CN1191742C Heat transfer substrate and method for mfg. same |
| 03/01/2005 | US6862436 High frequency circuit board and antenna switch module for high frequency using the same |
| 03/01/2005 | US6862192 Wiring layout of auxiliary wiring package and printed circuit wiring board |
| 03/01/2005 | US6862191 Volumetrically efficient electronic circuit module |
| 03/01/2005 | US6862190 Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers |
| 03/01/2005 | US6862186 Stack up assembly |
| 03/01/2005 | US6862185 Systems and methods that use at least one component to remove the heat generated by at least one other component |
| 03/01/2005 | US6862184 High performance microprocessor power delivery solution using flex connections |
| 03/01/2005 | US6862175 Memory card container |
| 03/01/2005 | US6861921 Removing ground plane resonance |
| 03/01/2005 | US6861920 Complex circuit board, nonreciprocal circuit device, resonator, filter, duplexer communications device, circuit module, complex circuit board manufacturing method, and nonreciprocal circuit device manufacturing method |
| 03/01/2005 | US6861899 Signal transmission circuit and electronic equipment |
| 03/01/2005 | US6861834 System and method for measuring the power consumed by a circuit on a printed circuit board |
| 03/01/2005 | US6861764 Wiring substrate having position information |
| 03/01/2005 | US6861757 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
| 03/01/2005 | US6861746 Electrical circuit apparatus and methods for assembling same |
| 03/01/2005 | US6861744 Multilayer ceramic substrate utilizing an intaglio plate with a plurality of grooves having different depths |
| 03/01/2005 | US6861740 Flip-chip die and flip-chip package substrate |
| 03/01/2005 | US6861655 Non-destructive method for testing curing level of cured product of curable adhesive composition and manufacturing method of electronic devices |
| 03/01/2005 | US6861591 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same |
| 03/01/2005 | US6861588 Laminated ceramic electronic component and method of producing the same |
| 03/01/2005 | US6861290 Flip-chip adaptor package for bare die |
| 03/01/2005 | US6861284 Semiconductor device and production method thereof |
| 03/01/2005 | US6861283 Package for integrated circuit with thermal vias and method thereof |
| 03/01/2005 | US6861282 Semiconductor package and semiconductor package mounting method |
| 03/01/2005 | US6861269 Electric-circuit fabricating method and system, and electric-circuit fabricating program |
| 03/01/2005 | US6861092 Low signal loss bonding ply for multilayer circuit boards |
| 03/01/2005 | US6860954 Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof |
| 03/01/2005 | US6860744 Low-profile connector |
| 03/01/2005 | US6860620 Light unit having light emitting diodes |
| 03/01/2005 | US6860592 Inkjet cartridge and method of identifying color of ink thereof by flexible printed circuit board |
| 03/01/2005 | US6860006 Method for manufacturing a monolithic ceramic electronic component |
| 03/01/2005 | US6860004 Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink |
| 03/01/2005 | US6860003 I-channel surface-mount connector |
| 03/01/2005 | US6860000 Method to embed thick film components |
| 03/01/2005 | US6859990 Characteristics evaluation method of intermediate layer circuit |
| 02/24/2005 | WO2005018294A1 Device for fixing a module to a printed circuit board |
| 02/24/2005 | WO2005018293A2 Circuit board design |
| 02/24/2005 | WO2005017592A1 Optical element device and two-dimensional optical waveguide device and optoelectronic circuit board using the same |
| 02/24/2005 | WO2005017510A1 Generation of test patterns for subsequent inspection |
| 02/24/2005 | WO2005017247A2 Cellulosic fibers having enhanced reversible thermal properties and methods of forming thereof |
| 02/24/2005 | WO2005016587A1 Method for determining the position of the surface of a workpiece inside a laser machining unit |
| 02/24/2005 | WO2004113041A3 Method for producing a ceramic/metal substrate |
| 02/24/2005 | WO2004099729A3 Measuring device comprising a probe |
| 02/24/2005 | WO2004099725A3 Measuring device comprising a probe |
| 02/24/2005 | WO2004053544A3 Photonic circuit board |
| 02/24/2005 | US20050044517 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations |
| 02/24/2005 | US20050043826 Method and apparatus for positioning a test head on a printed circuit board |
| 02/24/2005 | US20050043600 Low-noise optical probes for reducing ambient noise |
| 02/24/2005 | US20050043502 The polyimide contains 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane and the addition-condensation polyamide contains carboxylated polybutadiene with an optional acrylonitrile block; low elasticity, excellent flexibility and heat resistance |
| 02/24/2005 | US20050043443 glass fibers reinforced polyamides and sizing agents, used to form moldings having resistance to hydrolysis and heat, flexibility, tensile and impact strength |
| 02/24/2005 | US20050042930 Electrical connector |
| 02/24/2005 | US20050042894 Electrical connection and component assembly for constitution of a hard disk drive |
| 02/24/2005 | US20050042893 Fragmented backplane system for I/O applications |
| 02/24/2005 | US20050042892 Printed circuit board and an image forming apparatus having the printed circuit board |
| 02/24/2005 | US20050042801 Electronic parts packaging structure and method of manufacturing the same |
| 02/24/2005 | US20050042466 for a laminate which composition has a low dielectric constant and a low dielectric loss tangent, is capable of giving a prepreg having no tackiness and does not decrease properties such as moldability and heat resistance |
| 02/24/2005 | US20050042381 Fully automated paste dispense system for dispensing small dots and lines |
| 02/24/2005 | US20050042366 Forming openings in dielectric layer laminated onto substrate; applying uniform copper plating |
| 02/24/2005 | US20050041946 Planar layer with optical path |
| 02/24/2005 | US20050041935 Optoelectronics processing module and method for manufacturing thereof |
| 02/24/2005 | US20050041405 Stacked via structure that includes a skip via |
| 02/24/2005 | US20050041404 Integrated circuit stacking system and method |
| 02/24/2005 | US20050041403 Integrated circuit stacking system and method |
| 02/24/2005 | US20050041402 Integrated circuit stacking system and method |
| 02/24/2005 | US20050041401 Module with FPC and manufacturing method for the same |