Patents for H05K 1 - Printed circuits (98,583)
03/2005
03/09/2005CN1591920A Light semiconductor device and optical signal input and output device
03/09/2005CN1591861A Circuit component built-in module and method for manufacturing the same
03/09/2005CN1591842A Circuit board and method of manufacturing the same
03/09/2005CN1591841A Tape circuit substrate and semiconductor chip package using the same
03/09/2005CN1591840A Flexible substrate, semiconductor package and method of manufacturing the same
03/09/2005CN1591715A Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
03/09/2005CN1591714A Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
03/09/2005CN1591621A Laser diode driving circuit and an optical head
03/09/2005CN1591191A Etching method and method for mfg circuit device thereby
03/09/2005CN1590596A Electroplating on composite substrates
03/09/2005CN1590438A Brown oxide pretreatment composition, and method for improving adhesion of polyimide surface
03/09/2005CN1590333A 导电糊及陶瓷电子部件 The conductive paste and ceramic electronic component
03/09/2005CN1590086A Process for producing transparent conductive laminate
03/09/2005CN1192696C Conducting pulp and method for producing laminated ceramic electronic parts by same
03/09/2005CN1192695C Multilayer substrate module and portable wireless terminal
03/09/2005CN1192694C Multilayer printed wiring board
03/09/2005CN1192692C Multiple printed circuitboard for electronic components esp. acoustic surface wave elements, and method for constructing bumps, soldering frames, spaces on said multiple printed circuitboard
03/09/2005CN1192690C Copper clad laminated sheet and its mfg. method
03/09/2005CN1192480C Electronic packaged assembly and prodn. method thereof
03/09/2005CN1192475C Frequency conversion module with thyristor
03/09/2005CN1192463C Connector for printed wiring board
03/09/2005CN1192456C Battery connector
03/09/2005CN1192452C Inverted microstrip transmission line integrated in multilayer structure
03/09/2005CN1192424C Method for preparing multiple layer inner connection circuit
03/09/2005CN1192421C Substrate element and soft substrate
03/09/2005CN1192283C Photosensitive insulation paste and thick film multilayer circuit substrate
03/09/2005CN1192130C Wholly aromatic polyamide fibers, sheet comprising same and method of producing the sheet
03/09/2005CN1192053C Method for improving adhesion of metal films to polyphenylene ether resins
03/09/2005CN1191904C Tungsten-copper composite oxide powder and its preparing process
03/09/2005CA2478906A1 Techniques for pin arrangements in circuit chips
03/08/2005US6865682 Microprocessor module with integrated voltage regulators
03/08/2005US6865307 Method for forming an optical printed circuit board
03/08/2005US6865279 Hearing aid with a flexible shell
03/08/2005US6865089 Module board having embedded chips and components and method of forming the same
03/08/2005US6865088 Electronic equipment with stay for reinforcing circuit board within casing
03/08/2005US6865074 Method of producing electronic unit of radio system and electronic unit
03/08/2005US6865071 Electrolytic capacitors and method for making them
03/08/2005US6864941 Display apparatus characterized by wiring structure
03/08/2005US6864776 Coupling adjusting structure for double-tuned circuit
03/08/2005US6864764 Dielectric porcelain composition, and dielectric resonator and nonradiative dielectric strip using same
03/08/2005US6864670 Method for eliminating noise interference and acoustic noise by printed circuit board ground plane layout
03/08/2005US6864586 Padless high density circuit board
03/08/2005US6864576 Large line conductive pads for interconnection of stackable circuitry
03/08/2005US6864569 Stackable module
03/08/2005US6864434 Warpage-preventive circuit board and method for fabricating the same
03/08/2005US6864306 High dielectric polymer composites and methods of preparation thereof
03/08/2005US6864119 COF semiconductor device and a manufacturing method for the same
03/08/2005US6863962 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
03/08/2005US6863936 Applying a strippable coating to the substrate, selective laser ablation to activate an underlying region of the substrate surface, immersing in solution of seeding particles to adhere them to activated region, plating; printed circuits
03/08/2005US6863923 Method and compositions for printing substrates
03/08/2005US6863548 Method and apparatus for improving the performance of edge launch adapters
03/08/2005US6863542 Interconnecting structure for electrically connecting two printed circuit boards
03/08/2005US6863444 Housing and mounting structure
03/08/2005US6863233 Magnetic tape cassette
03/08/2005US6862804 Method of mounting camera module on wiring board
03/03/2005WO2005020651A1 Method for manufacturing an electronic module, and an electronic module
03/03/2005WO2005020650A2 Printed circuit board
03/03/2005WO2005020648A2 Copper-faced modules, imprinted copper circuits, and their application to suptercomputers
03/03/2005WO2005020385A1 Connector having a built-in electronic part
03/03/2005WO2005020254A2 Ultra-thin flexible inductor
03/03/2005WO2005020253A2 Printed circuit board with integrated inductor
03/03/2005WO2005020249A2 Fabrication of thick film electrical components
03/03/2005WO2005020215A1 Electrical connection and component assembly for constitution of a hard disk drive
03/03/2005WO2005019336A1 Molded object, process for producing the same, product for high-frequency signal transmission, and high-frequency transmission cable
03/03/2005WO2005019329A1 Moulding materials and use thereof
03/03/2005WO2004093506A3 Electomagnetic interference shielding for a printed circuit board
03/03/2005WO2004036969A8 Method and device for joining at least two parts
03/03/2005US20050049385 Thermosetting resin
03/03/2005US20050048812 Attachment plate for directly mating circuit boards
03/03/2005US20050048810 Membrane switch with J-tail lead
03/03/2005US20050048809 Flexible flat cable termination structure for a clockspring
03/03/2005US20050048805 Apparatus interconnecting circuit board and mezzanine card or cards
03/03/2005US20050048683 Light emitting diode and method for producing it
03/03/2005US20050048680 Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit
03/03/2005US20050048415 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
03/03/2005US20050048306 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board
03/03/2005US20050048299 Flame retardant thermoplastic films and methods of making the same
03/03/2005US20050048297 Polyimide metal laminate
03/03/2005US20050047776 Camera
03/03/2005US20050047730 Optoelectronic packaging assembly
03/03/2005US20050047457 Laser diode driving circuit and an optical head
03/03/2005US20050047186 Vertical laminated electrical switch circuit
03/03/2005US20050047110 Illumination module of light emitting elements
03/03/2005US20050047103 Power supply circuit with three-dimensionally arranged circuit carriers, and production method
03/03/2005US20050047102 Keysheet module
03/03/2005US20050047101 Electronic part mounting substrate and method for producing same
03/03/2005US20050047032 Electronic control apparatus
03/03/2005US20050047022 Integrated lead suspension and method of construction
03/03/2005US20050047020 Integrated lead suspension and method of construction
03/03/2005US20050047009 Integrated lead suspension and method of construction
03/03/2005US20050046573 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
03/03/2005US20050046544 Ball grid array resistor network having a ground plane
03/03/2005US20050046536 Plated terminations
03/03/2005US20050046535 Precise multi-pole magnetic component and manufacturing method thereof
03/03/2005US20050046510 Embedded RF vertical interconnect for flexible conformal antenna
03/03/2005US20050046037 Buried solder bumps for AC-coupled microelectronic interconnects
03/03/2005US20050046033 Tape circuit substrate and semiconductor chip package using the same
03/03/2005US20050046011 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
03/03/2005US20050045901 Package for a semiconductor light emitting device
03/03/2005US20050045802 Sensor device, in particular for motor vehicles