Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
08/2005
08/04/2005WO2005071028A1 Particulate filled fluoropolymer coating composition and method of making article therefrom
08/04/2005WO2005070281A1 Capsulated medical device
08/04/2005WO2005070280A1 Capsule-type endoscope
08/04/2005WO2005069734A2 A liquid thermosetting ink
08/04/2005WO2005069733A2 Reactive fine particles
08/04/2005WO2005036435A3 Adulteration control device for retail outlet
08/04/2005WO2005029634A3 Dielectric loading of distributed printed circuits
08/04/2005WO2004093221A3 Electrochemical cells
08/04/2005US20050171318 Heat resistance; stable storage modulus
08/04/2005US20050170691 Method for altering the delay properties of a transmission line using compensation tabs
08/04/2005US20050170673 Memory module, method and memory system having the memory module
08/04/2005US20050170631 Manufacturing method for wiring substrates
08/04/2005US20050170560 Method of manufacturing an electronic device
08/04/2005US20050170291 Process and apparatus for manufacturing printed circuit boards
08/04/2005US20050170270 Composition for forming wiring protective film and uses thereof
08/04/2005US20050170198 Includes an intermediate layer that contains at least one element selected from Mo, Cr, Ni, Si, Fe, Al and an oxygen and water barrier film; can enhance the bonding strength between a conductive layer and a polyimide film at high temperatures
08/04/2005US20050170078 Low cost method to form solderable contact points for structures manufactured from conductive loaded resin-based materials
08/04/2005US20050169620 Optical device
08/04/2005US20050169514 Systems and methods for detecting defects in printed solder paste
08/04/2005US20050169033 Semiconductor module
08/04/2005US20050168963 Multi-board optical tranceiver
08/04/2005US20050168961 Stereoscopic electronic circuit device, and relay board and relay frame used therein
08/04/2005US20050168960 Module with a built-in component, and electronic device with the same
08/04/2005US20050168957 Transmission/reception optical module
08/04/2005US20050168956 Printed wiring board for controlling signal transmission using paired inductance and capacitance
08/04/2005US20050168922 Surface mount optoelectronic component
08/04/2005US20050168917 Method for manufacturing ceramic multilayer substrate
08/04/2005US20050168913 Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode
08/04/2005US20050168878 Method for suppressing tribocharge in the assembly of magnetic heads
08/04/2005US20050168318 Laser trimming of resistors
08/04/2005US20050168304 Signal line circuit device
08/04/2005US20050168301 Double-sided, edge-mounted stripline signal processing modules and modular network
08/04/2005US20050168239 Low reflection driver for a high speed simultaneous bidirectional data bus
08/04/2005US20050168238 Power plane system of high-speed digital circuit for suppressing ground bounce noise
08/04/2005US20050168197 Power module
08/04/2005US20050168173 Discharge lamp lighting apparatus
08/04/2005US20050168141 Method for producing an electronic component and a display
08/04/2005US20050167931 Low cost gaskets manufactured from conductive loaded resin-based materials
08/04/2005US20050167873 Low cost fuel cell bipolar plates manufactured from conductive loaded resin-based materials
08/04/2005US20050167851 Semiconductor part for component mounting, mounting structure and mounting method
08/04/2005US20050167850 Flip-chip adaptor package for bare die
08/04/2005US20050167831 Semiconductor device and method of fabricating the same
08/04/2005US20050167823 Integrated VCSELs on traditional VLSI packaging
08/04/2005US20050167818 Mold release layer transferring film and laminate film
08/04/2005US20050167817 Microelectronic adaptors, assemblies and methods
08/04/2005US20050167815 Circuit carrier and package structure thereof
08/04/2005US20050167813 Method and apparatus for molding module electronic devices and a module electronic device molded thereby
08/04/2005US20050167811 Module power distribution network
08/04/2005US20050167803 Film substrate, fabrication method thereof, and image display substrate
08/04/2005US20050167794 Semiconductor device and method of manufacturing same
08/04/2005US20050167792 Integral ceramic circuit board and method for producing the same
08/04/2005US20050167660 Capacitor with a dielectric including a self-organized monolayer of an organic compound
08/04/2005US20050167640 adding reducing agents to aqueous reaction systems containing silver salts and silver oxide, to deposit silver particles, andadding a chelating agent to the aqueous reaction system as dispersants; free-flowing particles used to form films having a uniform thickness on substrates
08/04/2005US20050167639 Electronic material composition, electronic product and method of using electronic material composition
08/04/2005US20050167281 Production method of suspension board with circuit
08/04/2005US20050167189 Low cost acoustical structures manufactured from conductive loaded resin-based materials
08/04/2005US20050167188 Low cost acoustical structures manufactured from conductive loaded resin-based materials
08/04/2005US20050167153 Spacer, printed circuit board, and electronic equipment
08/04/2005US20050167133 Low cost gaskets manufactured from conductive loaded resin-based materials
08/04/2005US20050167047 Method of fabricating radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates
08/04/2005US20050166956 Low cost roofing shingles manufactured from conductive loaded resin-based materials
08/04/2005DE4313980B4 Integrierte Hybridschaltung und Verfahren zu deren Herstellung A hybrid integrated circuit, and processes for their preparation
08/04/2005DE10340438B4 Sendemodul mit verbesserter Wärmeabführung Transmitter module with improved heat dissipation
08/04/2005DE10330754B4 Verfahren zur Herstellung einer elektrischen Schaltung A method of producing an electrical circuit
08/04/2005DE10254662B4 Montageträger für Lichtemissionsdioden, Verfahren zum Montieren von Lichtemissionsdioden, flexibles Lichtemissionsdioden-Modul und Verfahren zur Herstellung desselben The same mounting support for light-emitting diodes, method for mounting light emitting diodes, a flexible light-emitting diode module and process for preparing
08/04/2005DE102004019724A1 Memory module with bracing element for reducing bending stress, with circuit board carrying semiconductor memory component
08/04/2005DE102004001368A1 New alkyphenyl-amino-silane compounds, used as coupling agents on woven glass mat for production of reinforced epoxy resin laminates, e.g. printed circuit boards
08/04/2005CA2554113A1 Method for the production of a circuit board element and circuit board element
08/03/2005EP1560271A2 Optical device
08/03/2005EP1560242A1 Controller with a thermal protector and a heating device incorporating the controller
08/03/2005EP1560227A1 Conductive paste
08/03/2005EP1559801A1 Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part
08/03/2005EP1559740A1 Oriented, with electromagnetic radiation patternable foil made of thermoplastic polyester, process of preparation and use
08/03/2005EP1559738A1 Polyimide film and process for producing the same
08/03/2005EP1559301A1 A mechanism to cross high-speed differential pairs
08/03/2005EP1559296A1 Transparent window with non-transparent contact surface for a soldering bonding
08/03/2005EP1559165A2 Improved energy devices
08/03/2005EP1559147A2 Film comprising organic semiconductors
08/03/2005EP1558923A2 Preconditioning of a substrate in a continuous process for manufacture of electrochemical sensors
08/03/2005EP1558442A1 Porous polymeric membrane toughened composites
08/03/2005EP1252804B1 Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
08/03/2005CN2715467Y Covering board with stress-relieving design
08/03/2005CN2715466Y Mixed insulation layer for soft printed circuit board
08/03/2005CN1650680A Circuit board with at least one electronic component
08/03/2005CN1650678A Method for creating a trench structure in a polymer substrate
08/03/2005CN1650677A Low loss dielectric material for printed circuit boards and integrated circuit chip packaging
08/03/2005CN1650429A A modular integrated circuit chip carrier
08/03/2005CN1650230A Photocurable compositions containing reactive particles
08/03/2005CN1650176A Connector for measuring electric resistance, apparatus and method for measuring electric resistance of circuit board
08/03/2005CN1650057A Plural layer woven electronic textile, article and method
08/03/2005CN1649962A Heat resistant film and its metal laminate
08/03/2005CN1649480A Printed circuit board with electromagnetic interferring radiation inhibiting function
08/03/2005CN1649473A Production method of suspension board with circuit
08/03/2005CN1649472A Surface-mount base for electronic element
08/03/2005CN1649471A Resin particles and resin layer containing metal micro particles, its forming method and circuit base board
08/03/2005CN1649470A Flexible board, connection method thereof, and connection structure thereof
08/03/2005CN1649145A Module with a built-in component, and electronic device with the same
08/03/2005CN1649140A Hybrid integrated circuit device and method of manufacturing the same
08/03/2005CN1649119A Semiconductor device
08/03/2005CN1649114A Method for producing wiring base board
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