Patents for H05K 1 - Printed circuits (98,583)
08/2005
08/23/2005US6934926 Method for compressing serpentine trace routing on printed circuit boards
08/23/2005US6934163 Capacitor for dram connector
08/23/2005US6934160 Printed circuit board arrangement
08/23/2005US6933892 Method for forming radio frequency antenna
08/23/2005US6933805 High density capacitor filter bank with embedded faraday cage
08/23/2005US6933800 Printed circuit suppression of high-frequency spurious signals
08/23/2005US6933615 Electronic component device and manufacturing method therefor
08/23/2005US6933604 Semiconductor device, semiconductor module and hard disk
08/23/2005US6933601 Semiconductor connection substrate
08/23/2005US6933587 Electronic circuit unit suitable for miniaturization
08/23/2005US6933450 High-frequency signal transmitting device
08/23/2005US6933443 Method for bonding ceramic to copper, without creating a bow in the copper
08/23/2005US6933437 Shielding apparatus for electronic device
08/23/2005US6933209 Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges
08/23/2005US6933050 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
08/23/2005US6932621 Connector interface pad for structurally integrated wiring
08/23/2005US6932617 Fragmented backplane system for I/O applications
08/23/2005US6932518 Circuit board having traces with distinct transmission impedances
08/23/2005US6931726 Method of making and interconnect structure
08/23/2005US6931725 Circuit component built-in module, radio device having the same, and method for producing the same
08/23/2005US6931724 Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon
08/23/2005US6931712 Method of forming a dielectric substrate having a multiturn inductor
08/19/2005CA2497099A1 Integrated detonators for use with explosive devices
08/18/2005WO2005076683A1 Multilayer printed wiring board
08/18/2005WO2005076682A1 Multilayer printed wiring board
08/18/2005WO2005076680A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate
08/18/2005WO2005076679A2 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
08/18/2005WO2005076677A1 Method for increasing a routing density for a circuit board and such a circuit board
08/18/2005WO2005076676A1 Circuit constituting body
08/18/2005WO2005076675A1 Method for bonding ceramic to copper, without creating a bow in the copper
08/18/2005WO2005076319A2 Semiconductor component comprising a semiconductor chip stack on a wiring frame and method for producing the same
08/18/2005WO2005076206A1 Method and device for continuously producing electronic film components, and an electronic film component
08/18/2005WO2005076202A1 Electronic device
08/18/2005WO2005076164A1 Printed circuit board return route check method and printed circuit board pattern design cad device
08/18/2005WO2005076163A1 Printed circuit board design method, program thereof, recording medium containing the program, printed circuit board design device using them, and cad system
08/18/2005WO2005075724A1 Double glass cloth, and prepreg and substrate for printed wiring board using the glass cloth
08/18/2005WO2005075571A1 RESIN COMPOSITION FOR GHz-BAND ELECTRONIC COMPONENT AND GHz-BAND ELECTRONIC COMPONENT
08/18/2005WO2005060401A9 Direct contact power transfer pad and method of making same
08/18/2005US20050183101 Flexible printed circuit for optical disk drive
08/18/2005US20050182203 2,6-bis(4-cyanate-3,5-dimethylphenylmethyl) naphthalene; giving a cured product excellent flame retardancy, a low dielectric constant, a low dielectric loss tangent, high heat resistance
08/18/2005US20050182202 3 to 6 Polyalkylene oxide, polyacrylate, a polylactone, polylactam or derivative side-branches connected to a benzene central molecule by a methylene group, especially initiated by hexakis(bromomethyl)benzene; films for electronic devices
08/18/2005US20050182161 Irregular shaped copper particles and methods of use
08/18/2005US20050181692 Resin-impregnated substrate
08/18/2005US20050181676 Methods and apparatus for reducing crosstalk in electrical connectors
08/18/2005US20050181662 Printed circuit board module and disconnect bow
08/18/2005US20050181643 Wireless communication port
08/18/2005US20050181642 Transmission module assembly having printed circuit board
08/18/2005US20050181637 System and method for electrically interconnecting boards
08/18/2005US20050181543 Semiconductor package module and manufacturing method thereof
08/18/2005US20050181541 Method of producing a COF flexible printed wiring board
08/18/2005US20050181537 Method for producing an electrical circuit
08/18/2005US20050181223 Adhesive layer being obtained by imidization of a polyamic acid mixture, a reaction product of 3,4,3',4'-biphenyltetracarboxylic anhydride with p-phenylenediamine, reaction product of 3,4,3',4'-biphenyltetracarboxylic anhydride with 4,4'-diaminodiphenyl ether; heat/curling resistance, high peel strength
08/18/2005US20050181215 Epoxy resin, setting agents containing a novolak-type phenol resin and a benzooxazine compound, and a siloxane-modified polyamide-imide resin; low dielectric constant; excellent peel strength
08/18/2005US20050180142 Backlight module and heat dissipation structure thereof
08/18/2005US20050180122 Electronic circuit module
08/18/2005US20050180120 Compact navigation device assembly
08/18/2005US20050180116 Heatsink
08/18/2005US20050180111 Low thermal stress composite heat sink assembly
08/18/2005US20050180100 System and method for flexible circuits
08/18/2005US20050179850 Liquid crystal display module
08/18/2005US20050179600 Low-loss printed circuit board antenna structure and method of manufacture thereof
08/18/2005US20050179552 RFID tag and its manufacturing method
08/18/2005US20050179549 Electronic tag, system and method for selecting component
08/18/2005US20050179136 Multi-layer substrate module and wireless terminal device
08/18/2005US20050179129 High-frequency wiring structure and method for producing the same
08/18/2005US20050179128 Semiconductor device with capacitor
08/18/2005US20050179121 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless
08/18/2005US20050178846 Data storage device incorporating a two-dimensional code
08/18/2005US20050178585 Printed circuit board having axially parallel via holes
08/18/2005US20050178583 Structure of a circuit board for improving the performance of routing traces
08/18/2005US20050178582 Circuit board with mounting pads for reducing parasitic effect
08/18/2005US20050178581 Underfilling efficiency by modifying the substrate design of flip chips
08/18/2005US20050178574 Electronic part mounting substrate, electronic part, and semiconductor device
08/18/2005US20050178501 Process for producing a multi-layer printer wiring board
08/18/2005US20050178496 Low cost electrically conductive tapes and films manufactured from conductive loaded resin-based materials
08/18/2005US20050178282 Integrated detonators for use with explosive devices
08/18/2005US20050178002 Surface mounting structure for surface mounting an electronic component
08/18/2005DE202005007501U1 Vehicle light, consists of at least one light diode chip mechanically and electrically fixed to a circuit board
08/18/2005DE19616451B4 Folientastatur Keypad
08/18/2005DE102005005524A1 Ohm resistance structure for thick-film technology/cermetology has strip conductors set apart and linked electrically to an active resistance surface adjusted by movement in the surface/conductors
08/18/2005DE102005001146A1 Elektronische Steuervorrichtung Electronic control means
08/18/2005DE102004006047A1 Polymerwellenleiter für opto-elektrische Schaltungsträger Polymer waveguides for electro-optical circuit boards
08/18/2005DE102004005255A1 Verfahren zum Anordnen einer Leitungsstruktur auf einem Substrat und Substrat mit der Leitungsstruktur A method of disposing a line structure on a substrate and substrate with the conduit structure
08/18/2005DE102004005082A1 Kondensator mit einem Dielektrikum aus einer selbstorganisierten Monoschicht einer organischen Verbindung Capacitor having a dielectric made of a self-assembled monolayer an organic compound
08/18/2005DE102004003342A1 High frequency arrangement having high frequency terminals on an antenna carrier and on an integrated circuit coupled to each ohter
08/18/2005DE102004002421A1 Düsenanordnung Nozzle assembly
08/18/2005DE10020761B4 Folienleiter sowie Verfahren zur Herstellung eines Folienleiters Foil conductor as well as method for producing a foil conductor
08/17/2005EP1565047A1 Circuit board surface mount package
08/17/2005EP1565046A1 Surface mounting structure for surface mounting an electronic component
08/17/2005EP1565045A1 Discrete electronic component and related assembling method
08/17/2005EP1564580A1 Optical projector
08/17/2005EP1564265A1 Ink jet printable thick film ink compositions and processes
08/17/2005EP1563573A2 Apparatus for crosstalk compensation in a telecommunications connector
08/17/2005EP1563085A1 Cooling stations for use in a web printing process for the manufacture of electrochemical sensors
08/17/2005EP1562755A1 Method for producing a partially metallised film-type element
08/17/2005EP1388186A4 Electrically conductive patterns, antennas and methods of manufacture
08/17/2005EP1356306A4 Inner component board assembly for an electric utility meter
08/17/2005EP1351826B1 Electrodes for a drop-on-demand printer
08/17/2005EP0859686B1 Fabricating interconnects and tips using sacrificial substrates
08/17/2005CN2718952Y Electronic element