| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/25/2005 | WO2005036937A3 Mechanism for disabling an electronic assembly |
| 08/25/2005 | WO2005008765A3 Semiconductor power module with strip conductors which are detached from a substrate as external connections |
| 08/25/2005 | WO2004105238B1 An enclosure and substate structure for a tuner module |
| 08/25/2005 | WO2004077897A3 A circuit assembly and electronic device incorporating such an assembly |
| 08/25/2005 | US20050188118 Enclosure slot identification by modules |
| 08/25/2005 | US20050187348 a mixture of acrylic polymers and phenolic resins having heat resistance and bonding strength, used for adhesion in flexible printing circuit boards |
| 08/25/2005 | US20050187329 comprising an electrically conductive powder, an organic solvent soluble, polyimide resin and solvent wherein the ratio of conductive powder to organic resin is from 80:20 to 99:1 |
| 08/25/2005 | US20050186996 Rotary module with digital camera module |
| 08/25/2005 | US20050186812 Resin substrate |
| 08/25/2005 | US20050186807 Apparatus inteconnecting circuit board and mezzanine card or cards |
| 08/25/2005 | US20050186772 Process for producing metallic interconnects and contact surfaces on electronic components |
| 08/25/2005 | US20050186768 Wiring substrate produced by transfer material method |
| 08/25/2005 | US20050186702 Semiconductor device manufacturing method and manufacturing apparatus |
| 08/25/2005 | US20050186437 Novel thin laminate as embedded capacitance material in printed circuit boards |
| 08/25/2005 | US20050186430 Thermosetting resin and photocurable resin, suitable for use in electronics requiring low dielectric constant, low dielectric loss at tangent and high toughness |
| 08/25/2005 | US20050186407 Method of manufacturing ceramic paste and ceramic multi-layer wiring substrate utilizing the same |
| 08/25/2005 | US20050186406 Multi-layer printed circuit board and method for manufacturing the same |
| 08/25/2005 | US20050186332 Forming an electroless nickel plating layer having an even thickness in a reliable manner; chromium and copper thin films are formed next sequentially on the surface of the supporting board exposed from the insulating base layer and on the entire surface of the insulating base layer |
| 08/25/2005 | US20050185951 Camera and photographing lens barrel |
| 08/25/2005 | US20050185880 Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication |
| 08/25/2005 | US20050185439 Memory module and a method of arranging a signal line of the same |
| 08/25/2005 | US20050185387 Printed circuit board structure for motor driving device |
| 08/25/2005 | US20050185382 Substrate for carrying a semiconductor chip and a manufacturing method thereof |
| 08/25/2005 | US20050185360 Integrated capacitor assembly |
| 08/25/2005 | US20050185353 Overcurrent protection for solid state switching system |
| 08/25/2005 | US20050185317 Recording/playback apparatus |
| 08/25/2005 | US20050185146 Optical modulator, optical device and projector |
| 08/25/2005 | US20050185127 Method of manufacturing liquid crystal display |
| 08/25/2005 | US20050184723 Circuit board component ambient moisture exposure monitoring |
| 08/25/2005 | US20050184393 Multilayer wiring board |
| 08/25/2005 | US20050184390 Optimized power delivery to high speed, high pin-count devices |
| 08/25/2005 | US20050184381 Connection member and mount assembly and production method of the same |
| 08/25/2005 | US20050184376 System in package |
| 08/25/2005 | US20050184372 Three-dimensional mounting structure and method for producing the same |
| 08/25/2005 | US20050184370 Embedded heat spreader for folded stacked chip-scale package |
| 08/25/2005 | US20050184313 Semiconductor device and method for mitigating electrostatic discharge (ESD) |
| 08/25/2005 | US20050184278 Conductive paste and ceramic electronic component |
| 08/25/2005 | US20050184047 PTC heater with flexible printed circuit board |
| 08/25/2005 | US20050183986 Fixture for accessing memory cards |
| 08/25/2005 | US20050183885 Conducting structure of a multi-layers IC board |
| 08/25/2005 | US20050183883 Printed circuit board substrate and method for constructing same |
| 08/25/2005 | US20050183872 Mounting components to a hardware casing |
| 08/25/2005 | US20050183817 Security tag system for fabricating a tag including an integrated surface processing system |
| 08/25/2005 | US20050183763 Thermoelectric generation system utilizing a printed-circuit thermopile |
| 08/25/2005 | US20050183543 Silver powder made of silver particles, each to which fine silver particles adhere and process of producing the same |
| 08/25/2005 | US20050183264 Method for aligning capacitor plates in a security tag and a capacitor formed thereby |
| 08/25/2005 | DE4343934B4 Verfahren zum Erzeugen von Vielfach-Dickschichtsubstraten A method of generating multiple thick film substrates |
| 08/25/2005 | DE10358705B3 Connectors for circuit boards with LED displays, comprise L-section holders at adjacent circuit board edges, which are clamped together |
| 08/25/2005 | DE10260184B4 Speichermodul mit einer Testeinrichtung Memory module with a test device |
| 08/25/2005 | DE102004007740A1 Modulplatine und Trennbügel Module board and separating frame |
| 08/25/2005 | DE102004006457A1 Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile A method and apparatus for continuously producing electronic film components |
| 08/25/2005 | DE102004005850A1 Soldering electronic components onto a film, comprises applying a solder paste onto the component contacts, and melting the paste using a laser |
| 08/25/2005 | DE102004005699A1 Memory card structure has smaller sized case formed above circuit board, and space is formed between case and circuit board, for storing electronic components |
| 08/25/2005 | DE102004004621A1 Electrical power inverter circuit uses electro optical circuit board for transmission of signals |
| 08/25/2005 | DE102004004442A1 Liquid level sensor with capacitive sensor elements, has carrier foil as carrier material, partly surrounding conductor path structure |
| 08/25/2005 | DE102004003160A1 Circuit board e.g. for electronic appliance, has at least two circuit paths which are twisted relative to one another |
| 08/25/2005 | DE10156341B4 Verdrahtungsaufbau für Übertragungsleitung Wiring structure for transmission line |
| 08/24/2005 | EP1566995A1 Surface mount technology evaluation board |
| 08/24/2005 | EP1566993A1 Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board |
| 08/24/2005 | EP1566992A2 Technique for connector to printed circuit board decoupling to eliminate flexure |
| 08/24/2005 | EP1566410A1 Thermally vanishing material, transfer sheet using the same, and method for forming pattern |
| 08/24/2005 | EP1566377A1 Cyanate ester compound flame-retardant resin composition and cured product thereof |
| 08/24/2005 | EP1566263A1 Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby |
| 08/24/2005 | EP1565789A2 Photosensitive resin composition comprising a halogen-free colorant |
| 08/24/2005 | EP1399951A4 Interchangeable microdeposition head apparatus and method |
| 08/24/2005 | EP1399950A4 Formation of printed circuit board structures using piezo microdeposition |
| 08/24/2005 | EP1399269A4 Waveform generator for microdeposition control system |
| 08/24/2005 | EP1399268A4 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
| 08/24/2005 | EP1399267A4 Microdeposition apparatus |
| 08/24/2005 | EP1392449A4 Over-clocking in a microdeposition control system to improve resolution |
| 08/24/2005 | EP1095385B1 Electric component buried in multilayer pcb |
| 08/24/2005 | CN2720764Y Gold finger structure |
| 08/24/2005 | CN2720763Y Gold finger protection device |
| 08/24/2005 | CN1659939A Cooled power switching device |
| 08/24/2005 | CN1659938A Board for printed wiring, printed wiring board, and method for manufacturing them |
| 08/24/2005 | CN1659936A Flexible printed circuit board and process for producing the same |
| 08/24/2005 | CN1659925A An acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-boa |
| 08/24/2005 | CN1659787A Tuner unit, receiver and electronic apparatus |
| 08/24/2005 | CN1659701A Voltage variable material for direct application and devices employing same |
| 08/24/2005 | CN1659417A A system and method for manufacturing printed circuit boards employing non-uniformly modified images |
| 08/24/2005 | CN1659310A Method for electroless metalisation of polymer substrate |
| 08/24/2005 | CN1658743A Circuit forming board and method of manufacturing circuit forming board |
| 08/24/2005 | CN1658739A Production method of suspension board with circuit |
| 08/24/2005 | CN1658736A 电路装置 Circuit means |
| 08/24/2005 | CN1658735A Pressure welding structure and manufacturing method of flexible printed circuit board |
| 08/24/2005 | CN1658734A Printed circuit board substrate and method for constructing same |
| 08/24/2005 | CN1658519A TD-SCDMA mobile phone circuit board for implementing eftective integral distribution |
| 08/24/2005 | CN1658439A Connection member and mount assembly and production method of the same |
| 08/24/2005 | CN1658384A High-frequency wiring structure and method for producing the same |
| 08/24/2005 | CN1658332A Conductive paste and ceramic electronic component |
| 08/24/2005 | CN1658299A Distribution component of optical head device |
| 08/24/2005 | CN1658063A Optical modulator, optical device and projector |
| 08/24/2005 | CN1657999A Compact optical sub-assembly with integrated flexible circuit |
| 08/24/2005 | CN1657463A Sizing composition for glass fibers |
| 08/24/2005 | CN1216514C Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element |
| 08/24/2005 | CN1216505C Photoelectric device and electronic apparatus |
| 08/24/2005 | CN1216422C Manufacturing method and structure of electroplated nickel/gold for electric contact pad of chip package substrate |
| 08/24/2005 | CN1216420C Chip support capable of setting passive element |
| 08/24/2005 | CN1216381C Conductive sizing agent for high-power thick-film circuit based on stainless steel substrate and its producing process |
| 08/24/2005 | CN1216380C Resistance sizing agent for high-power thick-film circuit based on stainless steel substrate and its producing process |