| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/17/2005 | CN2718950Y Positioning structure for piezoelectric sheet |
| 08/17/2005 | CN2718949Y 印刷电路板构造 A printed circuit board structure |
| 08/17/2005 | CN2718778Y 半导体基材构造 A semiconductor substrate structure |
| 08/17/2005 | CN1656861A Improved structure of stacked vias in multiple layer electronic device carriers |
| 08/17/2005 | CN1656860A Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 08/17/2005 | CN1656697A Signal reception device, signal reception circuit, and reception device |
| 08/17/2005 | CN1656573A Conductive paste, multilayer board including the conductive paste and process for producing the same |
| 08/17/2005 | CN1656401A Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly |
| 08/17/2005 | CN1656177A Fire retardant resin composition, method of its production, shaped articles comprising the same, and silica |
| 08/17/2005 | CN1655664A Ultrasonic manufacturing apparatus, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| 08/17/2005 | CN1655663A Ultrasonic manufacturing apparatus |
| 08/17/2005 | CN1655662A Printed circuit board having axially parallel via holes |
| 08/17/2005 | CN1655661A Mounting structure, electro-optical device, electronic apparatus, and method of manufacturing electro-optical device |
| 08/17/2005 | CN1655412A Discrete electronic component and related assembling method |
| 08/17/2005 | CN1655404A 信号传输模块 Signal transmission module |
| 08/17/2005 | CN1655348A Electronic part mounting substrate, electronic part, and semiconductor device |
| 08/17/2005 | CN1655059A Photosensitive transfer sheet, photosensitive laminated article, forming method of image pattern and cloth wire pattern |
| 08/17/2005 | CN1654539A Thermosetting resin compositions and film articles |
| 08/17/2005 | CN1654518A Method for preparing polyimide film for flexible printed plate board |
| 08/17/2005 | CN1215745C Wiring board and making method thereof |
| 08/17/2005 | CN1215743C Technology for making strengthened glass circuit board and its product and application |
| 08/17/2005 | CN1215742C Welding pad for printed circuit board and forming method thereof |
| 08/17/2005 | CN1215648C 电路器件 Circuit devices |
| 08/17/2005 | CN1215630C Electric motor |
| 08/17/2005 | CN1215612C Terminal structure for high frequency signal transmitting parts |
| 08/17/2005 | CN1215537C Elements with resin shell capsulation |
| 08/17/2005 | CN1215502C Synthetic multi-layer ceramic electronic component and mfg. method thereof |
| 08/17/2005 | CN1215484C Medium sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| 08/17/2005 | CN1215049C Polybenzoxazole resin and precursor thereof |
| 08/16/2005 | US6931650 Pickup device and disk drive |
| 08/16/2005 | US6931500 Method for bus capacitance reduction |
| 08/16/2005 | US6930903 Arrangement of integrated circuits in a memory module |
| 08/16/2005 | US6930900 Arrangement of integrated circuits in a memory module |
| 08/16/2005 | US6930890 Network device including reverse orientated modules |
| 08/16/2005 | US6930889 Circuit board and slot connector assembly |
| 08/16/2005 | US6930888 Mechanism to cross high-speed differential pairs |
| 08/16/2005 | US6930885 Densely packed electronic assemblage with heat removing element |
| 08/16/2005 | US6930884 Land grid array assembly using a compressive liquid |
| 08/16/2005 | US6930872 Spark gap device |
| 08/16/2005 | US6930400 Grid array microelectronic packages with increased periphery |
| 08/16/2005 | US6930395 conductor contains a resin composition, and a glass transition temperature of the resin composition is set lower than a glass transition temperature of a resin composition contained in base; high connection reliability |
| 08/16/2005 | US6930392 Electronic parts packaging structure and method of manufacturing the same |
| 08/16/2005 | US6930390 resin coating is removed at portion located at a top face of metal bump and top face of bump is exposed from surface of resin coating; resin coating has first coating made of rigid resin and second coating has adhesive contact with first |
| 08/16/2005 | US6930384 Tape carrier package |
| 08/16/2005 | US6930381 Wire bonding method and apparatus for integrated circuit |
| 08/16/2005 | US6930258 Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 08/16/2005 | US6930256 Integrated circuit substrate having laser-embedded conductive patterns and method therefor |
| 08/16/2005 | US6930255 In which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit; crack resistance |
| 08/16/2005 | US6930240 Flex-circuit shielded connection |
| 08/16/2005 | US6930184 Functional fluorescent dyes |
| 08/16/2005 | US6930020 Method for fabricating large area flexible electronics |
| 08/16/2005 | US6929978 Method of fabricating an integrated circuit package utilizing a conductive structure for improving the bond strength between an IC package and a printed circuit board |
| 08/16/2005 | US6929976 Multi-die module and method thereof |
| 08/16/2005 | US6929975 Method for the production of an electronic component |
| 08/16/2005 | US6929900 for detection of intrusion by mechanical means for the purpose of reading the data stored in a memory; method making involves steps of screen printing and photolithography |
| 08/16/2005 | US6929848 Sheet material especially useful for circuit boards |
| 08/16/2005 | US6929169 Solder joint structure and method for soldering electronic components |
| 08/16/2005 | US6928726 Circuit board with embedded components and method of manufacture |
| 08/11/2005 | WO2005074344A1 Device for the vibration-proof mounting of electric special components and/or electric circuits |
| 08/11/2005 | WO2005074343A1 Electronic device |
| 08/11/2005 | WO2005074340A1 Multilayer printed wiring board and method for manufacturing same |
| 08/11/2005 | WO2005074338A1 Circuit substrate |
| 08/11/2005 | WO2005074336A2 Multilayered circuit board for high-speed, differential signals |
| 08/11/2005 | WO2005074335A1 Conductive vias and associated methods and structures |
| 08/11/2005 | WO2005074172A1 Electronic interface for long reach optical transceiver |
| 08/11/2005 | WO2005074029A1 Module and mounting structure using the same |
| 08/11/2005 | WO2005073765A1 Polymer waveguide for optoelectronic circuit supports |
| 08/11/2005 | WO2005073618A1 Deformable illumination module |
| 08/11/2005 | WO2005073434A1 Ultrahigh-purity copper and process for producing the same |
| 08/11/2005 | WO2005073146A1 Composition for ceramic substrate, ceramic substrate, process for producing ceramic substrate and glass composition |
| 08/11/2005 | WO2005065000B1 Electromagnetically shielded slot transmission line |
| 08/11/2005 | WO2005033161A3 Epoxy resin compositions, processes utilzing same and articles made therefrom |
| 08/11/2005 | WO2004064158A3 Component with ultra-high frequency connections in a substrate |
| 08/11/2005 | WO2004039897A8 Process for making an electrochemical sensor |
| 08/11/2005 | WO2004034434A3 Components, methods and assemblies for multi-chip packages |
| 08/11/2005 | US20050177662 Modular broadcast television products |
| 08/11/2005 | US20050177319 Optical communications module |
| 08/11/2005 | US20050176909 Curable polyvinyl benzyl compound and process for producing the same |
| 08/11/2005 | US20050176849 Ink jet printable thick film compositions and processes |
| 08/11/2005 | US20050176380 Radio frequency circuit module |
| 08/11/2005 | US20050176310 Connection structure of rigid printed circuit board and flexible circuit, the connection process and the circuit module using it |
| 08/11/2005 | US20050176302 Electrical socket |
| 08/11/2005 | US20050176301 Connector providing capacitive coupling |
| 08/11/2005 | US20050176272 Interconnect structure and method for connecting buried signal lines to electrical devices |
| 08/11/2005 | US20050176271 Electrical connection and component assembly for constitution of a hard disk drive |
| 08/11/2005 | US20050176268 Grouped element transmission channel link with pedestal aspects |
| 08/11/2005 | US20050176255 Electronic package repair process |
| 08/11/2005 | US20050176246 Ink jet printable thick film ink compositions and processes |
| 08/11/2005 | US20050176209 Embedded passive components |
| 08/11/2005 | US20050176175 Method of manufacturing hybrid integrated circuit device |
| 08/11/2005 | US20050176161 Circuit board integrated optical coupling elements |
| 08/11/2005 | US20050175925 Photocurable compositions containing reactive particles |
| 08/11/2005 | US20050175850 Flexible metal laminate and heat-resistant adhesive composition |
| 08/11/2005 | US20050175773 Metal/ceramic bonding member and method for producing same |
| 08/11/2005 | US20050175385 Method of producing printed circuit board with embedded resistor |
| 08/11/2005 | US20050175352 Optical module having small stray capacitance and stray inductance |
| 08/11/2005 | US20050175350 Electronic interface for long reach optical transceiver |
| 08/11/2005 | US20050175312 Optical transmitter |
| 08/11/2005 | US20050175299 Compact optical sub-assembly with integrated flexible circuit |
| 08/11/2005 | US20050175297 Optical sub-assembly for opto-electronic modules |