Patents for H05K 1 - Printed circuits (98,583)
07/2005
07/13/2005CN1639837A Optical chip packaging via through hole
07/13/2005CN1639806A Conductor composition and method for production thereof
07/13/2005CN1639398A Fabric woven with flat glass fibers and production method
07/13/2005CN1639282A Varnish containing polyamide resin and use thereof
07/13/2005CN1639246A Printing of organic conductive polymers containing additives
07/13/2005CN1639236A Continuous filament mat binder system
07/13/2005CN1639229A Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board
07/13/2005CN1639223A Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate board
07/13/2005CN1639085A Method for metallizing titanate-based ceramics
07/13/2005CN1638879A Silicone resin based composites interleaved for improved toughness
07/13/2005CN1638618A Electromagnetic masking flexible circuit substrate
07/13/2005CN1638612A Multilayer printed wiring board and producing method thereof
07/13/2005CN1638611A Printed circuit board and package having oblique vias
07/13/2005CN1638610A Method for producing circuit substrate, and circuit substrate and electronic machine
07/13/2005CN1638608A 印刷电路板 A printed circuit board
07/13/2005CN1638606A Method for producing electronic circuit and electronic circuit substrate
07/13/2005CN1638604A Method and device for contactless treatment of flat objects in through type treatment equipment
07/13/2005CN1638602A Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit
07/13/2005CN1638601A Impregnated resin substrate
07/13/2005CN1638600A Wiring circuit board and production method thereof
07/13/2005CN1638563A Organic electroluminescent device having supporting plate and method of fabricating the same
07/13/2005CN1638194A Adhesive film for circuit connection, and circuit connection structure
07/13/2005CN1638169A Preparation of flexible metal foil/polyimide laminate
07/13/2005CN1638152A LSI package, interposer, interface module and signal processing LSI monitoring circuit
07/13/2005CN1638121A 半导体集成电路装置 The semiconductor integrated circuit device
07/13/2005CN1638117A High frequency module
07/13/2005CN1638114A Power converter package with enhanced thermal management
07/13/2005CN1638106A Device to cool integrated circuit element and disk drive having the same
07/13/2005CN1638104A Hybrid integrated circuit device and manufacturing method of the same
07/13/2005CN1638103A Tape circuit substrate with reduced size of base film
07/13/2005CN1638101A Inductor element containing circuit board and power amplifier module
07/13/2005CN1638074A Semiconductor device and electronic equipment using the same
07/13/2005CN1638072A Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
07/13/2005CN1638002A Manufacturing method of plasma display device
07/13/2005CN1637973A Thin film capacitors on ceramic
07/13/2005CN1637971A Capacitor and method for manufacturing the same
07/13/2005CN1637963A Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same
07/13/2005CN1637960A Direct application voltage variable material, components thereof and devices employing
07/13/2005CN1637957A Thick film conductor case compositions for LTCC tape
07/13/2005CN1637582A Lens holder apparatus of camera lens module
07/13/2005CN1637450A Opto-electronic module comprising flexible electric connection cable and method of making the same
07/13/2005CN1637424A Techniques for controlling movement of a circuit board module along card cage slot
07/13/2005CN1636796A Connecting structure between busbar base and printed circuit board
07/13/2005CN1211002C Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
07/13/2005CN1211001C Flexible circuit base board and its manufacturing method
07/13/2005CN1211000C Rigidity flexible base board and camera using the same
07/13/2005CN1210800C Memory module with improved data bus performance
07/13/2005CN1210796C Power transistor module, power amplifier and method in fabrication thereof
07/13/2005CN1210795C Electronic device and its manufacturing method
07/13/2005CN1210794C Carrier-belt automatic bonding type semiconductor device
07/13/2005CN1210739C Electric substrate apparatus
07/13/2005CN1210636C Temp. characteristic compensation device
07/13/2005CN1210612C Motor connecting structure for camera
07/13/2005CN1210223C Preparation method of lead zirconate titanate thick fiml material
07/12/2005US6918078 Systems with modules sharing terminations
07/12/2005US6917526 Electronic component module
07/12/2005US6917524 Extension mechanism and method for assembling overhanging components
07/12/2005US6917523 Thermal solution for a mezzanine card
07/12/2005US6917482 Optical module mounted body and securing method of optical module
07/12/2005US6917262 Integrated microwave filter module with a cover bonded by strips of conductive paste
07/12/2005US6917259 High-frequency module substrate device
07/12/2005US6917258 High frequency switch
07/12/2005US6917120 Microchip controller board
07/12/2005US6917118 Semiconductor device
07/12/2005US6917104 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
07/12/2005US6917100 Circuit module having interleaved groups of circuit chips
07/12/2005US6916996 Symmetric electrical connection system
07/12/2005US6916995 Optimization of routing layers and board space requirements for ball grid array package implementations including single and multi-layer routing
07/12/2005US6916994 Conformal sealing film
07/12/2005US6916959 Halogen-containing aromatic compound
07/12/2005US6916873 Mixture of epoxy resin, curing agent and filler
07/12/2005US6916856 Thermosetting resin compositions containing maleimide and/or vinyl compounds
07/12/2005US6916706 Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device
07/12/2005US6916670 Electronic package repair process
07/12/2005US6916544 Highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine and 0.1 to 5.0 mole % of a dicarboxylic acid including at least one crosslinkable group
07/12/2005US6916539 Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof
07/12/2005US6916527 Resin moldings
07/12/2005US6916184 Electrical connector housing
07/12/2005US6916183 Array socket with a dedicated power/ground conductor bus
07/12/2005US6916182 Connection arrangements for electrical devices having a ledge on which contact terminals are provided
07/12/2005US6916121 Optical sub-assembly for optoelectronic modules
07/12/2005US6916118 Rolling bearing with rotation sensor
07/12/2005US6915566 Method of fabricating flexible circuits for integrated circuit interconnections
07/12/2005CA2310765C Stress relaxation type electronic component, a stress relaxation type circuit board, and a stress relaxation type electronic component mounted member
07/07/2005WO2005062464A1 Surface-mounted passive electronic components, and structure and method for mounting them
07/07/2005WO2005062414A1 Thin film impedance termination
07/07/2005WO2005062382A2 Light emitting diode based illumination assembly
07/07/2005WO2005061598A1 Low temperature sintering nanoparticle compositions
07/07/2005WO2005061586A1 Polyamide acid resin having unsaturated group, photosensitive resin composition using same, and cured product thereof
07/07/2005WO2005061585A1 Polyamic acid and polyimide
07/07/2005WO2005061473A1 Epoxy compounds and cured epoxy resins obtained by curing the compounds
07/07/2005WO2005060401A2 Direct contact power transfer pad and method of making same
07/07/2005WO2005048323A3 Detachable on package voltage regulation module
07/07/2005WO2004045016A3 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
07/07/2005WO2002099849A3 Apparatus for microdeposition of multiple fluid materials
07/07/2005US20050148696 High thermal conductive halogen-free phosphorus-free retardant resin composition for printed circuit board materials
07/07/2005US20050148237 Electronic circuit device
07/07/2005US20050148217 Memory card with chamfer
07/07/2005US20050148165 Conductive pattern producing method and its applications
07/07/2005US20050148164 A suspension for filling via holes in silicon and method for making the same