| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/29/2005 | CN2706993Y Pin grid matrix packaging carrying board |
| 06/29/2005 | CN1633790A 电磁总线耦合 Electromagnetic coupling bus |
| 06/29/2005 | CN1633635A Voltage regulator with voltage drop compensation |
| 06/29/2005 | CN1633228A An electromagnetic interference suppressive ground wiring method |
| 06/29/2005 | CN1633145A A TD-SCDMA handset circuit board realizing efficient integral layout |
| 06/29/2005 | CN1631665A Laminar composition and method for preparing the same |
| 06/29/2005 | CN1208992C Contact connection of electrostatic microphone converter |
| 06/29/2005 | CN1208835C Plane mounted electronic circuit unit |
| 06/29/2005 | CN1208792C Electronic element and making method thereof |
| 06/29/2005 | CN1208783C 介电陶瓷组合物 The dielectric ceramic composition |
| 06/29/2005 | CN1208782C Aqueous carbon composition and method for coating a non-conductive substrate |
| 06/28/2005 | US6912134 Fan control circuit and package |
| 06/28/2005 | US6912130 Combined member of aluminum-ceramics |
| 06/28/2005 | US6912113 Thin film capacitor using conductive polymers |
| 06/28/2005 | US6911941 Forming patterns of apertures in multilayers of ceramic tapes, then adjusting the apertures, laminating and firing to form radio frequency circuits having adjustable electrical properties |
| 06/28/2005 | US6911738 Method and apparatus for improving defective solder joint detection using x-ray inspection of printed assemblies |
| 06/28/2005 | US6911734 Semiconductor device and electronic device |
| 06/28/2005 | US6911733 Semiconductor device and electronic device |
| 06/28/2005 | US6911729 Tape carrier semiconductor device |
| 06/28/2005 | US6911728 Member for electronic circuit, method for manufacturing the member, and electronic part |
| 06/28/2005 | US6911624 Component installation, removal, and replacement apparatus and method |
| 06/28/2005 | US6911623 Carbon dioxide gas laser machining method of multilayer material |
| 06/28/2005 | US6911620 System and method for unveiling targets embedded in a multi-layered electrical circuit |
| 06/28/2005 | US6911606 Electronic component for adhesion of a plurality of electrodes and method of mounting the same |
| 06/28/2005 | US6911605 Flexible printed circuit |
| 06/28/2005 | US6911412 Carbon composite powders have a well-controlled microstructure, nanostructure and morphology having uniformly dispersed metal or metal oxide particles by heating an aerosol of precursors at low temperatures; fuel cells; |
| 06/28/2005 | US6911265 Laminate |
| 06/28/2005 | US6910897 Interconnection system |
| 06/28/2005 | US6910809 Electrical sub-assembly design for parallel optics modules |
| 06/28/2005 | US6910637 Stacked small memory card |
| 06/28/2005 | US6910636 IC card and manufacturing method thereof |
| 06/28/2005 | US6910266 Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| 06/28/2005 | US6910264 Method for making a multilayer circuit board having embedded passive components |
| 06/23/2005 | WO2005057999A1 Method for constructing emi shielding around a component embedded in a circuit board |
| 06/23/2005 | WO2005057887A1 Printed circuit board (pcb) structure comprising different levels |
| 06/23/2005 | WO2005057723A1 Folding mobile radio device |
| 06/23/2005 | WO2005057656A1 Apparatus and arrangement for shielding a light emitting diode against electrostatic discharge |
| 06/23/2005 | WO2005057596A1 Electronic component |
| 06/23/2005 | WO2005057591A1 Conductive paste for electrode layer of multilayer ceramic electronic component and method for producing multilayer unit for multilayer ceramic electronic component |
| 06/23/2005 | WO2005057471A1 An optical system, an analysis system and a modular unit for an electronic pen |
| 06/23/2005 | WO2005056871A1 Method of preparing a metal-silicone rubber composite |
| 06/23/2005 | WO2005056868A1 Method of metallizing a silicone rubber substrate |
| 06/23/2005 | WO2005056684A1 Thermoplastic resin composition, material for substrate and film for substrate |
| 06/23/2005 | WO2005056683A1 Thermosetting resin composition, material for substrate and film for substrate |
| 06/23/2005 | WO2005056632A1 Thermosetting resin composition, resin sheet and resin sheet for insulated substrate |
| 06/23/2005 | WO2005056274A2 Method and apparatus for producing a detail |
| 06/23/2005 | WO2005035456A9 Glass compositions, glass fibers, and methods of inhibiting boron volatization from glass compositions |
| 06/23/2005 | WO2005007724A8 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 06/23/2005 | WO2004107826B1 Multi functional timepiece module with application specific printed circuit boards |
| 06/23/2005 | US20050138592 Apparatuses and methods to route line to line |
| 06/23/2005 | US20050137371 Mechanical properties that exhibit a plateau value of the complex viscosity measured at frequencies below about 0.01 rad/s and at a temperature of 380 degrees C. and strong shear thinning, melt stretchability |
| 06/23/2005 | US20050137293 a high glass transition temp. epoxy resin system, ferroelectric ceramic particles having two particle size distributions, one of them pertaining to a nano level, a flexibilizer; a macromolecular dispersant and additives |
| 06/23/2005 | US20050137277 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 06/23/2005 | US20050136747 Inductive and capacitive coupling balancing electrical connector |
| 06/23/2005 | US20050136731 Serial-to-ethernet conversion port |
| 06/23/2005 | US20050136729 Patch panel with crosstalk reduction system and method |
| 06/23/2005 | US20050136718 Connecting structure between busbar base and printed circuit board and assemblies thereof |
| 06/23/2005 | US20050136713 Power connector |
| 06/23/2005 | US20050136703 Flexible cable interconnect assembly |
| 06/23/2005 | US20050136699 Signal channel configuration providing increased capacitance at a card edge connection |
| 06/23/2005 | US20050136646 Method of providing printed circuit board with conductive holes and board resulting therefrom |
| 06/23/2005 | US20050136638 Low temperature sintering nanoparticle compositions |
| 06/23/2005 | US20050136625 Ultra-thin glass devices |
| 06/23/2005 | US20050136620 Maleimide compounds in liquid form |
| 06/23/2005 | US20050136609 Capacitor having an anodic metal oxide substrate |
| 06/23/2005 | US20050136608 Capacitor having an anodic metal oxide substrate |
| 06/23/2005 | US20050136326 Low cost electrical terminals manufactured from conductive loaded resin-based materials |
| 06/23/2005 | US20050136233 Sheet material especially useful for circuit boards |
| 06/23/2005 | US20050135758 Optical data link |
| 06/23/2005 | US20050135074 Printed circuit dielectric foil and embedded capacitors |
| 06/23/2005 | US20050135072 Printed wire board and associated mobile terminal |
| 06/23/2005 | US20050135071 Package structure of optical sensitive device and method for packaging optical sensitive device |
| 06/23/2005 | US20050135067 Semiconductor module with vertically mounted semiconductor chip packages |
| 06/23/2005 | US20050135043 Integrated circuit package substrate having a thin film capacitor structure |
| 06/23/2005 | US20050135015 Disc drives having flexible circuits with liquid crystal polymer dielectric |
| 06/23/2005 | US20050134554 Microencapsulated electrophoretic display with integrated driver |
| 06/23/2005 | US20050134420 Microconverter and laminated magnetic-core inductor |
| 06/23/2005 | US20050134408 Circuit device and printed circuit board |
| 06/23/2005 | US20050133929 Flexible package with rigid substrate segments for high density integrated circuit systems |
| 06/23/2005 | US20050133922 Tapered dielectric and conductor structures and applications thereof |
| 06/23/2005 | US20050133918 Via including multiple electrical paths |
| 06/23/2005 | US20050133913 Stress distribution package |
| 06/23/2005 | US20050133906 Thermally enhanced semiconductor package |
| 06/23/2005 | US20050133903 Integrated circuit package substrate having a thin film capacitor structure |
| 06/23/2005 | US20050133901 System and method for delivering power to a semiconductor device |
| 06/23/2005 | US20050133900 Microelectronic assemblies with composite conductive elements |
| 06/23/2005 | US20050133898 Printed circuit board and inkjet head |
| 06/23/2005 | US20050133767 Water-soluble electrically conductive composition, modifications, and applications thereof |
| 06/23/2005 | US20050133698 Optical apparatus and image production apparatus |
| 06/23/2005 | US20050133574 Emulsified in water by a (meth)acrylic acid-ethylene glycol graft polymer modified with a hydrophobic phenylalkylphenol and a stabilizing tris(phenylalkyl)phenol; prefered epoxy being bisphenol A propoxylate diglycidyl ether; nanoemulsions with reasonable viscosity |
| 06/23/2005 | US20050133257 Printed circuit board with low cross-talk noise |
| 06/23/2005 | US20050133256 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board |
| 06/23/2005 | US20050133252 Printed circuit board noise suppression device and method of manufacturing |
| 06/23/2005 | US20050133251 Substrate with micro-via structures by laser technique |
| 06/23/2005 | US20050133250 Packaging structure and packaging method of electronic components |
| 06/23/2005 | US20050133249 Printed wiring board and semiconductor device |
| 06/23/2005 | US20050132566 Circuits, multilayer circuits, and method of manufacture thereof |
| 06/23/2005 | DE10356305A1 Flat conductor for use in motor vehicle, has isolation body including protruding sections on its external surface, where the sections provide defined gap, so that adhesive is uniformly distributed on surface of conductor |
| 06/23/2005 | DE10355003A1 Inductive sensor for producing switching signal when electromagnetic radiation damping material approaches has flat circuit board with at least one through opening through which coil core is passed |
| 06/23/2005 | DE10353890A1 Nanocomposites for use e.g. in adhesives, circuit boards, construction parts or fire retardants contain an organic binder and a layered silicate modified by phosphorus-containing cations |