| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/22/2005 | US20050205972 COF flexible printed wiring board and semiconductor device |
| 09/22/2005 | US20050205970 [package with stacked substrates] |
| 09/22/2005 | US20050205957 Integrated VCSELs on traditional VLSI packaging |
| 09/22/2005 | US20050205778 Laser trim motion, calibration, imaging, and fixturing techniques |
| 09/22/2005 | US20050205712 Low cost magnetic brakes and motion control devices manufactured from conductive loaded resin-based materials |
| 09/22/2005 | US20050205642 PCB manufacturing system |
| 09/22/2005 | US20050205551 Low cost heated clothing manufactured from conductive loaded resin-based materials |
| 09/22/2005 | US20050205516 Wiring board and process for producing the same |
| 09/22/2005 | US20050205407 Multi-shot molded touch switch |
| 09/22/2005 | US20050205297 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
| 09/22/2005 | US20050205295 Apparatuses, systems and/or methods to affect impedance |
| 09/22/2005 | US20050205294 Flexible substrate, Multilayer flexible substrate and process for producing the same |
| 09/22/2005 | US20050205293 Substrate |
| 09/22/2005 | US20050205292 Circuit and method for broadband switching noise suppression in multilayer printed circuit boards using localized lattice structures |
| 09/22/2005 | US20050205291 Flexible substrate having interlaminar junctions, and process for producing the same |
| 09/22/2005 | US20050205286 Anti-abrasive mechanism confining flat flexible cable in position in flatbed image scanner |
| 09/22/2005 | US20050205201 Method of attaching optical waveguide component to printed circuit board |
| 09/22/2005 | US20050205197 Formed in layers and fused together; each layer of the ceramic and binder has a different purity of alumina; one outer layer is optimal for bonding to thick film conductors, and the other for bonding to thin film conductors; increased operational life |
| 09/22/2005 | US20050205196 Screen printing a predetermined thick film pattern onto a fused silica glass substrate to form constraint layers, boring holes and filling with a conductive paste, hydrostatic pressing, firing to obtain a low temperature co-firable ceramic; high density packaging for high frequency and microwave circuits |
| 09/22/2005 | US20050205195 Method of forming one or more base structures on an LTCC cofired module |
| 09/22/2005 | US20050204956 Writable and printable colloidal gold solution |
| 09/22/2005 | US20050204864 Thick-film dielectric and conductive compositions |
| 09/22/2005 | US20050204550 Board through-hole working method |
| 09/22/2005 | DE4324210B4 Kühlanordnung für elektronische Leistungsbauelemente Cooling arrangement for electronic power devices |
| 09/22/2005 | DE202005010815U1 Arrangement for contacting molded parts and circuit boards e.g. for hardware modules, has conductor path structure containing points of contact on molded parts |
| 09/22/2005 | DE19837138B4 Prüfkarte zum Prüfen von Chips mit integrierten Schaltungen Probe card for testing integrated circuit chips |
| 09/22/2005 | DE10343362B4 Verfahren zur Herstellung einer Leiterplatte mit verbessertem EMV-Verhalten A process for producing a circuit board having an improved EMI immunity |
| 09/22/2005 | DE102005009391A1 Verfahren zur Herstellung einer integrierten Brennstoffzelle aus flexiblem Substratlaminat und dessen Brennstoffzelle A method of manufacturing an integrated fuel cell made of a flexible laminate substrate and the fuel cell |
| 09/22/2005 | DE102005005910A1 Hydraulikcartridgeventil-Magnetspule zum direkten Anbringen an einer Leiterplatte Cartridge hydraulic valve solenoid for direct attachment to a printed circuit board |
| 09/22/2005 | DE102004053557A1 Verfahren und Vorrichtungen zum Drucken leitfähiger Dickfilme über Dickfilmdielektrika Methods and apparatus for printing conductive thick films on Dickfilmdielektrika |
| 09/22/2005 | DE102004010703A1 Bauelement mit WLP-fähiger Verkapselung und Herstellverfahren Component with WLP-efficient encapsulation and manufacturing |
| 09/22/2005 | DE102004009825A1 Leiterplatte Circuit board |
| 09/22/2005 | DE102004007812A1 Headlamp used in a vehicle for producing a dipped beam and a main beam comprises a reflector formed as an ellipsoidal support for illuminating diodes, a lens system and an illuminating unit arranged in the reflector |
| 09/22/2005 | DE10103390B4 Verfahren und System zum Herstellen einer im Wesentlichen ringförmigen Lotverbindung A method and system for producing a substantially annular solder joint |
| 09/22/2005 | CA2554371A1 Metal-containing fine particles, dispersion containing metal-containing fine particles and electroconductive metal-containing material |
| 09/21/2005 | EP1578179A2 Thick-film dielectric and conductive compositions |
| 09/21/2005 | EP1578178A1 Flexible substrate, multilayer flexible substrate and process for producing the same |
| 09/21/2005 | EP1578003A1 Electric machine with a device for connecting coil ends |
| 09/21/2005 | EP1577979A1 Board through hole working method |
| 09/21/2005 | EP1577945A2 Module power distribution network |
| 09/21/2005 | EP1577942A2 Device with through-hole interconnection and method for manufacturing the same |
| 09/21/2005 | EP1577916A1 Switch unit for a vehicle |
| 09/21/2005 | EP1577690A1 Fabrication of an optical interconnection layer on an electronic circuit |
| 09/21/2005 | EP1577274A2 Inorganic article and circuit substrate |
| 09/21/2005 | EP1576703A1 Flat cable harness |
| 09/21/2005 | EP1576205A1 Plating of multi-layer structures |
| 09/21/2005 | EP1014302B1 Noncontact ic card and manufacture thereof |
| 09/21/2005 | CN2728167Y Elastic fatigue resistant surface adhesion spring |
| 09/21/2005 | CN2728166Y Grounding spring having line fixing function |
| 09/21/2005 | CN1672481A Apparatus and method for insepecting cream solder printed on a substrate |
| 09/21/2005 | CN1672479A Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system |
| 09/21/2005 | CN1672478A Part mounting recognition mark recognition device and method |
| 09/21/2005 | CN1672475A Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 09/21/2005 | CN1672474A Process for creating holes of circuit assembly |
| 09/21/2005 | CN1672473A Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 09/21/2005 | CN1672471A Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| 09/21/2005 | CN1672294A Connection device for flexible circuit |
| 09/21/2005 | CN1672287A Non-uniform transmission line and method of fabricating the same |
| 09/21/2005 | CN1672225A Device comprising a circuit arrangement with an inductive element |
| 09/21/2005 | CN1671805A Low sintering temperatures conductive nano-inks and a method for producing the same |
| 09/21/2005 | CN1671804A Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 09/21/2005 | CN1671481A Method for patterning carbon nanotube coating and carbon nanotube wiring |
| 09/21/2005 | CN1671276A 多层电路板 The multilayer circuit board |
| 09/21/2005 | CN1671274A Flexible substrate having interlaminar junctions, and process for producing the same |
| 09/21/2005 | CN1671273A Device with through-hole interconnection and method for manufacturing the same |
| 09/21/2005 | CN1671269A Circuit module |
| 09/21/2005 | CN1671268A Flexible substrate, multilayer flexible substrate and process for producing the same |
| 09/21/2005 | CN1670999A Panel type antenna mounted on surface and its mounting method |
| 09/21/2005 | CN1670936A Semiconductor device |
| 09/21/2005 | CN1670910A Circuit device and manufacturing method thereof |
| 09/21/2005 | CN1670868A Dielectric ceramic composition and multilayer ceramic part using the same |
| 09/21/2005 | CN1670787A Image display apparatus using thin-film transistors |
| 09/21/2005 | CN1670107A Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 09/21/2005 | CN1669788A Metallized polyimide film |
| 09/21/2005 | CN1669787A Metallized polyimide film |
| 09/21/2005 | CN1220413C Printed circuit board with welding trace and circuit module with printed circuit board |
| 09/21/2005 | CN1220412C Interlayer arrangement structure for multilayer circuit board |
| 09/21/2005 | CN1220260C Semiconductor device and making method, and printing mask |
| 09/21/2005 | CN1220116C Device for measuring relative position error |
| 09/21/2005 | CN1220078C 2-D optical waveguide device and photoelectric fuse wiring substrate using same |
| 09/21/2005 | CN1219822C Thermosetting resin composition and prepreg, laminate for circuit board and printed circuit board each made therewith |
| 09/21/2005 | CN1219808C Novel polyimide copolymer and metal laminate using the same |
| 09/21/2005 | CN1219775C Halogen contained aromatic compound |
| 09/21/2005 | CN1219647C Circuit board connector, integrated circuit chip and ink cartridge with the chip |
| 09/21/2005 | CN1219562C Controller |
| 09/20/2005 | US6948137 Semiconductor integrated device |
| 09/20/2005 | US6947477 Apparatus and method for creating signal and profiles at a receiving station |
| 09/20/2005 | US6947332 Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems |
| 09/20/2005 | US6947304 DDR memory modules with input buffers driving split traces with trace-impedance matching at trace junctions |
| 09/20/2005 | US6947295 Ball grid array package with an electromagnetic shield connected directly to a printed circuit board |
| 09/20/2005 | US6947293 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 09/20/2005 | US6947292 Primary functional circuit board suitable for use in verifying chip function by alternative manner |
| 09/20/2005 | US6947289 Memory card |
| 09/20/2005 | US6947286 Stack up assembly |
| 09/20/2005 | US6947273 Power, ground, and routing scheme for a microprocessor power regulator |
| 09/20/2005 | US6947090 Microminiature image pickup device |
| 09/20/2005 | US6947070 Video scope utilized in electronic endoscope system |
| 09/20/2005 | US6947036 Liquid crystal display with space-saving conversion module |
| 09/20/2005 | US6947005 Low cost antennas and electromagnetic (EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials |
| 09/20/2005 | US6946926 Wired transmission path with plural equidistant differential conductors |