| Patents for H05K 1 - Printed circuits (98,583) |
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| 07/21/2005 | WO2005011341A3 Electronic module with dual connectvity |
| 07/21/2005 | WO2004093504A3 Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna |
| 07/21/2005 | WO2004053900B1 Flame sensor |
| 07/21/2005 | WO2003073357A8 Methods and apparatus for fabricating chip-on-board modules |
| 07/21/2005 | US20050159516 intramolecular compound having a phenol, an amine, formldehyde, dihydrobenzoxadine ring, epoxy resin, novolak or resol phenol resin, polyphosphate fire retardant, inorganic filler; heat resistance, high glass transition temperature; good copper peeling strength; no toxic carcinogen upon combustion |
| 07/21/2005 | US20050159024 Relay arrangement structure |
| 07/21/2005 | US20050158916 Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein |
| 07/21/2005 | US20050158911 Process for producing circuit board having built-in electronic part |
| 07/21/2005 | US20050158574 A printed circuit board having high-density wiring of ultra-fine width and line/spacing of <15 mu m or less where a carrier foil, a peeling layer, an ultra-thin copper foil are electroplated in this order, use of electrolytic copper foil having a specific roughness profile specific; antipeeling agents |
| 07/21/2005 | US20050158556 Nanoporous laminates |
| 07/21/2005 | US20050158553 Printed wiring board and manufacturing method of printed wiring board |
| 07/21/2005 | US20050158528 Wiring substrate |
| 07/21/2005 | US20050158527 Epoxy resins containing fine metal particle selected from platinum (Pt), palladium (Pd), copper (Cu), gold (Au), nickel (Ni), and silver (Ag).; rate of moisture absorption from 500 to 14500 ppm; electrostatic latent image is formed, by electrostatically attaching metal-containing resin particles |
| 07/21/2005 | US20050158502 Release process film |
| 07/21/2005 | US20050158456 Method and apparatus for making devices |
| 07/21/2005 | US20050157584 Memory module |
| 07/21/2005 | US20050157579 Memory device supporting a dynamically configurable core organization |
| 07/21/2005 | US20050157478 Printed circuit board and method for manufacturing printed circuit board |
| 07/21/2005 | US20050157477 Electronic device and production method thereof |
| 07/21/2005 | US20050157469 Cooling arrangement for a printed circuit board with a heat-dissipating electronic element |
| 07/21/2005 | US20050157447 Structure of multi-electrode capacitor and method for manufacturing process of the same |
| 07/21/2005 | US20050157241 Structure of liquid crystal display device for easy assembly and disassembly |
| 07/21/2005 | US20050157076 Printhead assembly with electrical connection member for interconnecting print engine controllers |
| 07/21/2005 | US20050157043 Printed circuit board with spring action |
| 07/21/2005 | US20050156705 Electronic pressure sensitive transducer apparatus and method for manufacturing same |
| 07/21/2005 | US20050156699 Coreless printed-circuit-board (PCB) transformers and operating techniques therefor |
| 07/21/2005 | US20050156698 Embedded toroidal inductors |
| 07/21/2005 | US20050156693 Quasi-coax transmission lines |
| 07/21/2005 | US20050156692 Double density quasi-coax transmission lines |
| 07/21/2005 | US20050156690 Electromagnetically shielded slot transmission line |
| 07/21/2005 | US20050156333 Fits into a standard USB socket |
| 07/21/2005 | US20050156327 Colored conductive wires for a semiconductor package |
| 07/21/2005 | US20050156326 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device |
| 07/21/2005 | US20050156319 Structure of stacked vias in multiple layer electronic device carriers |
| 07/21/2005 | US20050156307 Multilayer printed circuit board |
| 07/21/2005 | US20050156306 Circuit board device for information apparatus, multilayered module board and navigation system |
| 07/21/2005 | US20050156304 LSI package provided with interface module |
| 07/21/2005 | US20050156303 Structure of gold fingers |
| 07/21/2005 | US20050156295 Routing element for use in semiconductor device assemblies |
| 07/21/2005 | US20050156293 Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods |
| 07/21/2005 | US20050156034 Marking system for a flex circuit or printed cable |
| 07/21/2005 | US20050156015 Method and apparatus to create electrical junctions for information routing in textile structures |
| 07/21/2005 | US20050155957 Method of forming an opening or cavity in a substrate for receiving an electronic component |
| 07/21/2005 | US20050155791 Multilayer wiring board including stacked via structure |
| 07/21/2005 | US20050155789 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| 07/21/2005 | US20050155788 Flexible circuit with cover layer |
| 07/21/2005 | US20050155787 Transparent small memory card |
| 07/21/2005 | US20050155222 Circuit substrate manufacturing method |
| 07/21/2005 | DE10360128A1 Circuit board has flexible connecting contacts that facilitates the formation of soldered joints to electronic components |
| 07/21/2005 | DE10360127A1 Electronic circuit board has embedded contacts that are flexibility provided by surface cuts |
| 07/21/2005 | DE10309805B4 Flammschutzmittel-Dispersion Flame retardant dispersion |
| 07/21/2005 | DE10297754T5 Speichermodul mit einem Übertragungspfad für Highspeed-Daten und einem Übertragungspfad für Lowspeed-Daten sowie Speichersystem, daß das Speichermodul aufweist Memory module with a transmission path for high-speed data and a transmission path for low-speed data and storage system that has the memory module |
| 07/21/2005 | DE102004003880B3 Cladding panels for outer walls of buildings and other constructions comprise electronic circuit boards |
| 07/21/2005 | CA2638973A1 Biosensor and method of making |
| 07/20/2005 | EP1555864A1 RF circuit with stacked printed circuit boards |
| 07/20/2005 | EP1555862A2 Process for producing circuit board having built-in electronic part |
| 07/20/2005 | EP1555810A2 Imaging apparatus |
| 07/20/2005 | EP1555121A1 Method for manufacturing a laminated board |
| 07/20/2005 | EP1420928B1 Grinding of liquid crystalline polymers |
| 07/20/2005 | EP1328982B1 Device enclosures and devices with integrated battery |
| 07/20/2005 | EP1097617B1 Interconnect assembly for printed circuit boards and method of fabrication |
| 07/20/2005 | EP0970480A4 Vertically interconnected electronic assemblies and compositions useful therefor |
| 07/20/2005 | CN2712047Y Foldable multi-layer flexible board |
| 07/20/2005 | CN2712046Y Multi-layer wire distribution board and based board material for same |
| 07/20/2005 | CN2711899Y Electronic package unit with passive component |
| 07/20/2005 | CN2711864Y Printed resistor capable of quick test |
| 07/20/2005 | CN1644006A Holding/convey jig and holding/convey method |
| 07/20/2005 | CN1643999A Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 07/20/2005 | CN1643998A Printed-circuit board, electronic part having shield structure, and radio communication apparatus |
| 07/20/2005 | CN1643863A Symbol-based signaling device for an elctromagnetically-coupled bus system |
| 07/20/2005 | CN1643743A Plug for connection strips and method for the production thereof |
| 07/20/2005 | CN1643670A Organic compositions |
| 07/20/2005 | CN1643071A Resin composition |
| 07/20/2005 | CN1643070A Resin composition |
| 07/20/2005 | CN1643025A Organic compositions |
| 07/20/2005 | CN1642701A Punching machine |
| 07/20/2005 | CN1642680A Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder |
| 07/20/2005 | CN1642407A Release process film |
| 07/20/2005 | CN1642406A Electronic device and intermediate product of electronic device |
| 07/20/2005 | CN1642393A Electronic devices and methods of forming electronic devices |
| 07/20/2005 | CN1642384A Noise-suppressed dielectric structure and its manufacturing method |
| 07/20/2005 | CN1642232A Imaging apparatus |
| 07/20/2005 | CN1641946A Electronic device, connector assembly and signal line |
| 07/20/2005 | CN1641876A Mounting structure in integrated circuit module |
| 07/20/2005 | CN1641367A Printed circuit board maintenance and measurement memory device |
| 07/20/2005 | CN1212049C Circuit forming board and method of manufacturing circuit forming board |
| 07/20/2005 | CN1211914C Temp. compensating crystal oscillator and its mfg. method |
| 07/20/2005 | CN1211871C Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |
| 07/20/2005 | CN1211848C Circuit device mfg. method |
| 07/20/2005 | CN1211807C Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof |
| 07/20/2005 | CN1211767C Display module |
| 07/20/2005 | CN1211709C Photoreactive resin composition and circuit board and method for making multilayer ceramic base material |
| 07/20/2005 | CN1211197C Method for producing three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 07/19/2005 | US6920052 Dynamic isolating mount for processor packages |
| 07/19/2005 | US6920051 Hybrid capacitor, circuit, and system |
| 07/19/2005 | US6920046 Dissipating heat in an array of circuit components |
| 07/19/2005 | US6920014 Magnetic head comprising slider and flexure bonded with conductive resin |
| 07/19/2005 | US6919813 Built-in circuitry and method to test connector loading |
| 07/19/2005 | US6919782 Filter structure including circuit board |
| 07/19/2005 | US6919772 Wiring board comprising granular magnetic film |