Patents for H05K 1 - Printed circuits (98,583)
08/2005
08/11/2005US20050174820 Power converter and system using the same
08/11/2005US20050174748 Electronic control device
08/11/2005US20050174747 Printed-circuit board for high-speed communication
08/11/2005US20050174745 Electronic assembly
08/11/2005US20050174722 Flexible printed circuit board and process for producing the same
08/11/2005US20050174526 System and method of manufacturing liquid crystal display
08/11/2005US20050174468 Portable electronic device with camera
08/11/2005US20050174368 Recording apparatus
08/11/2005US20050174209 Wiring structure, and fabrication method of the same
08/11/2005US20050174207 Magnetic structure assembly
08/11/2005US20050174191 Transmission line having a transforming impedance
08/11/2005US20050173805 Micro pin grid array with pin motion isolation
08/11/2005US20050173796 Microelectronic assembly having array including passive elements and interconnects
08/11/2005US20050173780 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
08/11/2005US20050173680 electronic circuits comprising dielectrics and polyvinylpyrrolidone dispersed in organic solvents, water and/or mixtures
08/11/2005US20050173394 Control unit with thermal protection and an electrical heating device comprising the control unit
08/11/2005US20050173256 Used in the manufacture of an electrolytic copper foil that allows fine patterning and that is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures
08/11/2005US20050173152 Circuit board surface mount package
08/11/2005US20050173151 Substrate with via and pad structures
08/11/2005US20050173150 Multi-layer printed board
08/11/2005US20050172950 Low cost heated clothing manufactured from conductive loaded resin-based materials
08/11/2005US20050172778 Linear via punch
08/11/2005US20050172483 Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same
08/11/2005DE4117004B4 Verfahren zur Herstellung einer Schaltungsplatte A process for producing a circuit board
08/11/2005DE112004000007T5 Mehrschicht-Leiterplatte mit Metallkern Multi-layer printed circuit board with a metal core
08/11/2005DE10361393B3 Electroacoustic transducer, especially for use in motor vehicle, has circuit board acting as membrane; oscillations generated by exciter can be transferred to circuit board whereby system of circuit board and exciter forms flat loudspeaker
08/11/2005DE102004062194A1 Integrierte Halbleiterschaltungs-Vorrichtung A semiconductor integrated circuit device
08/11/2005DE102004061585A1 Direkte Verwendung spannungsvariabler Materialien, Bestandteile davon und Einrichtungen, bei denen diese zum Einsatz kommen Direct use voltage variable materials, components thereof and institutions where they come to use
08/11/2005DE102004053595A1 Doppeltdichte quasi-koaxiale Übertragungsleitungen Double density quasi-coaxial transmission lines
08/11/2005DE102004049660A1 Printed-board assembly for making up a T5/T8/T12 power-saving lamp has a magnetic choke device with a T5 fluorescent long-field lamp
08/11/2005DE102004045719A1 Gedruckte-Schaltungsplatine-Testzugangspunktstrukturen und Verfahren zum Herstellen derselben Printed circuit board test access point structures and method of making same
08/11/2005DE102004026052B3 Inductive coupling element has stacked structure with first, second transformer sides, 4 circuit carriers, first electrical connection between first component, first winding, second connection between second winding, second component
08/11/2005DE102004003891A1 Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung Oriented, can be structured by means of electromagnetic radiation sheet of thermoplastic polyester, processes for their preparation and their use
08/11/2005DE102004003890A1 Mittels elektromagnetischer Strahlung ein- oder mehrschichtige, orientierte strukturierbare Folie aus thermoplastischem Polymer, Verfahren zu ihrer Herstellung und ihre Verwendung By means of electromagnetic radiation single- or multilayer, oriented film of thermoplastic structurable polymer, processes for their preparation and their use
08/11/2005DE102004001698A1 Optisches Modul The optical module
08/11/2005DE102004001661A1 Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement und Vorrichtung A method for electrically connecting an electrical conductor to an electronic component device and
08/11/2005DE10158185B4 Leistungshalbleitermodul mit hoher Isolationsfestigkeit Power semiconductor module with high insulation strength
08/10/2005EP1562412A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
08/10/2005EP1562411A1 Metal/ceramic bonding member and method for producing same
08/10/2005EP1562410A2 Ink jet printable thick film ink compositions and processes
08/10/2005EP1562230A1 Packaging structure
08/10/2005EP1562104A1 Acoustic wave type contsct detector
08/10/2005EP1561789A1 Ink jet printable thick film ink compositions and processes
08/10/2005EP1561775A2 With electrogmagnetic radiation obtained mono- and multilayered, oriented structurable thermoplastic film, method for its manufacture and its use
08/10/2005EP1561368A1 Multi-layer circuit assembly and process for preparing the same
08/10/2005EP1561243A1 Highly adaptable heterogeneous power amplifier ic micro-systems using flip chip and microelectromechanical technologies on low loss substrates
08/10/2005EP1561237A2 Method and apparatus for reducing electromagnetic emissions from electronic circuits
08/10/2005EP1561099A1 Method of manufacture of electrochemical sensors
08/10/2005EP1560664A1 Nanostructured and nanoporous film compositions, structures, and methods for making the same
08/10/2005CN2717170Y Printed circuit board with bonded IC
08/10/2005CN1653878A Electromagnetically shielded circuit device and shielding method therefor
08/10/2005CN1653566A High energy density capacitors
08/10/2005CN1653559A Conductive ink
08/10/2005CN1653115A Polyimide film and method for production thereof, and polyimide/metal laminate using polyimide
08/10/2005CN1653016A Method for producing a ceramic-copper composite substrate
08/10/2005CN1652672A Patterned insulation layer and display paned using the same
08/10/2005CN1652666A Method for mfg wired substrate and method for mfg electronic apparatus
08/10/2005CN1652665A Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials
08/10/2005CN1652663A Stereoscopic electronic circuit device, and relay board and relay frame used therein
08/10/2005CN1652662A Multilayer printed wiring board and method of producing multilayer printed wiring board
08/10/2005CN1652395A Microstrip line
08/10/2005CN1652341A Optical device
08/10/2005CN1652333A High frequency circuit module
08/10/2005CN1651991A System and method of manufacturing liquid crystal display
08/10/2005CN1651169A Silver powder and method for producing same
08/10/2005CN1214492C System comprising at least two printed circuit boards
08/10/2005CN1214491C Connector for module
08/10/2005CN1214458C RF module member including surface elastic wave element and its manufacture method
08/10/2005CN1214453C Assembly for mounting driver IC
08/09/2005US6928205 Optical waveguide device, layered substrate and electronics using the same
08/09/2005US6927992 Trace-impedance matching at junctions of multi-load signal traces to eliminate termination
08/09/2005US6927982 Method of connecting a device to a support, and pad for establishing a connection between a device and a support
08/09/2005US6927966 Conductive paste and laminated ceramic electronic component
08/09/2005US6927663 Flyback transformer wire attach method to printed circuit board
08/09/2005US6927655 Optical transmission module
08/09/2005US6927491 Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
08/09/2005US6927490 Buried solder bumps for AC-coupled microelectronic interconnects
08/09/2005US6927486 Photo-interrupter and semiconductor device using the same
08/09/2005US6927471 Electronic system modules and method of fabrication
08/09/2005US6927424 Light emitting diode and method for producing it
08/09/2005US6927344 Flexible circuit board assembly
08/09/2005US6927180 Reducing line to line capacitance using oriented dielectric films
08/09/2005US6926751 Overcoating metal particles with high electroconductive paste; high density integrated circuits
08/09/2005US6926561 Integrated high and low frequency connector assembly
08/09/2005US6926548 Circuit card
08/09/2005US6926546 Foldable electronic device formed by pivotally connecting two casings through hinge
08/09/2005US6926540 Transmission module assembly having printed circuit board
08/09/2005US6926452 Mounting information-collecting device, connector, and mounting information-collecting method
08/09/2005US6926425 Method and arrangement for affixing LED on circuit board with lighting at both sides thereof
08/09/2005US6926387 Electrodes for a drop-on demand printer
08/09/2005US6926187 Ultrasonic manufacturing apparatus
08/09/2005CA2355615C Multi-chip module
08/04/2005WO2005072035A1 Method for the production of a circuit board element and circuit board element
08/04/2005WO2005072033A1 Circuit board and method for mounting chip component
08/04/2005WO2005072031A2 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
08/04/2005WO2005071745A1 Laminated electronic part and its manufacturing method
08/04/2005WO2005071742A1 Multilayer electronic component manufacturing method
08/04/2005WO2005071732A1 Carrier for electronic components and methods for encapsulating and separating an electronic component
08/04/2005WO2005071698A1 Ferrite/polymer composition and process of production thereof
08/04/2005WO2005071183A1 Façade covering