Patents for H05K 1 - Printed circuits (98,583)
07/2005
07/19/2005US6919642 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed
07/19/2005US6919635 High density microvia substrate with high wireability
07/19/2005US6919622 For improved signal transduction/reduced electrical noises; for packaging
07/19/2005US6919535 Electric heating for motor vehicles
07/19/2005US6919529 Method of laser welding a flexible circuit board with a metal contact
07/19/2005US6919508 Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing
07/19/2005US6919387 Electromagnetic wave absorber, method of manufacturing the same and appliance using the same
07/19/2005US6919227 Semiconductor part of component mounting, mounting structure and mounting method
07/19/2005US6919221 Electronic module having a plastic housing with conductive tracks and method of its production
07/19/2005US6919125 Contains upper and lower side surfaces that differ in composition, one contains percentage of ceramic material (alumina) optimal for application of thin film conductor, opposed surface contains percentage optimal for thick film
07/19/2005US6918791 Electrical connector having a reliable internal circuit board
07/19/2005US6918778 Configuration, plug-in mount and contact element for fixing and contacting switching assemblies on a substrate
07/19/2005US6918693 Light source device for endoscope and assembly method for light source unit
07/19/2005US6918542 Data distribution mechanism in the form of ink dots on cards
07/19/2005US6918529 Method for producing metal/ceramic bonding circuit board
07/19/2005US6918179 Method of deforming flexible cable sections extending between rigid printed circuit boards
07/14/2005WO2005065000A1 Electromagnetically shielded slot transmission line
07/14/2005WO2005064999A1 A printed wire board and associated mobile terminal
07/14/2005WO2005064770A1 Surface mount-type vibration motor and fixation structure for surface mount-type vibration motor
07/14/2005WO2005064755A1 Inductive and capacitive coupling balancing electrical connector
07/14/2005WO2005064739A1 Multi-channel waveguide structure
07/14/2005WO2005064646A2 An integrated circuit package substrate having a thin film capacitor structure
07/14/2005WO2005064450A1 Printable electromechanical input means and an electronic device including such input means
07/14/2005WO2005064381A1 Printed circuit board element comprising at least one optical waveguide, and method for the production of such a printed circuit board element
07/14/2005WO2005064262A1 Granular matter filled weapon guidance electronics unit
07/14/2005WO2005064228A2 Lighting device of discharge lamp, illumination apparatus and illumination system
07/14/2005WO2005063860A1 Polyimide film
07/14/2005WO2005063839A1 Article and its production
07/14/2005WO2005063467A1 Method for producing flexible laminate
07/14/2005WO2005063466A1 Method of producing flexible laminate sheet
07/14/2005WO2005062803A2 Printed circuit dielectric foil and embedded capacitors
07/14/2005WO2005062689A2 Suspension assembly method and the manufacture process
07/14/2005WO2005008733A3 Modular electronic assembly and method of making
07/14/2005WO2005004558A3 Method for the manufacture of printed circuit boards with embedded resistors
07/14/2005WO2004112128A3 Low profile stacking system and method
07/14/2005WO2004099826A3 Polished polyimide substrate
07/14/2005US20050154181 For electronic screen printable pastes
07/14/2005US20050154110 Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin composition
07/14/2005US20050154105 Compositions with polymers for advanced materials
07/14/2005US20050154092 a high glass transition temp. epoxy resin system, ferroelectric ceramic particles having two particle size distributions, one of them pertaining to a nano level, a flexibilizer; a macromolecular dispersant and additives
07/14/2005US20050153610 Particulate filled fluoropolymer coating composition and method of making article therefrom
07/14/2005US20050153483 Carrier, method of manufacturing a carrier and an electronic device
07/14/2005US20050153220 Method of producing electronic circuit, and electronic circuit substrate
07/14/2005US20050153060 Structure and method of embedding components in multi-layer substrates
07/14/2005US20050152184 Circuit substrate
07/14/2005US20050152142 Methods and apparatus relating to improved visual recognition and safety
07/14/2005US20050152138 Small portable flashlight
07/14/2005US20050152118 Device to cool integrated circuit element and disk drive having the same
07/14/2005US20050152117 Stack up assembly
07/14/2005US20050152098 Capacitor, circuit board with built-in capacitor and method of manufacturing the same
07/14/2005US20050152097 Capacitor, circuit board with built-in capacitor and method of manufacturing the same
07/14/2005US20050152090 High energy density capacitors
07/14/2005US20050151604 Triangular conforming transmission structure
07/14/2005US20050151599 Module for radio-frequency applications
07/14/2005US20050151597 Transmission line with a transforming impedance and solder lands
07/14/2005US20050151303 Method for producing ceramic substrate and electronic component module using ceramic substrate
07/14/2005US20050151271 comprising: curing agent to generate free radicals with heating; a radically polymerizable substance; and film-forming polymer, wherein a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m
07/14/2005US20050151269 UBM for fine pitch solder balland flip-chip packaging method using the same
07/14/2005US20050151267 Semiconductor device and manufacturing method for the same
07/14/2005US20050151247 Electronic device and intermediate product of electronic device
07/14/2005US20050151246 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
07/14/2005US20050151245 Power supply component assembly on a printed circuit and method for obtaining same
07/14/2005US20050151241 Multilayer ceramic substrate with single via anchored pad and method of forming
07/14/2005US20050151240 Radio frequency module
07/14/2005US20050151197 Production method of flexible electronic device
07/14/2005US20050151062 Semiconductor device, optoelectronic board, and production methods therefor
07/14/2005US20050150963 Data storage device incorporating a two-dimensional code
07/14/2005US20050150595 Process for producing substrate for flexible circuit board
07/14/2005US20050150106 Embedded inductor and method of making
07/14/2005US20050150105 Method of reducing noise induced from reference plane currents
07/14/2005DE10361344A1 Schaltermodul Switch module
07/14/2005DE10357111A1 System of electronic and electromechanical modules solderable, or insertable on bale platelets, consisting of two types, first one containing electronic, electromechanical and mechanical component
07/14/2005DE102004061526A1 Verbindungsstruktur zwischen einer Stromschienenbasis und einer gedruckten Schaltungsplatte Connection structure between a power rail base and a printed circuit board
07/14/2005DE102004056466A1 Wärmeisolierungselement für Schaltungsanordnung Thermal insulation element for circuitry
07/14/2005DE10019410B4 Flexibler Flachleiter Flexible flat cable
07/14/2005CA2551654A1 Printed circuit board element comprising at least one optical waveguide, and method for the production of such a printed circuit board element
07/13/2005EP1553812A2 Semiconductor chip and circuit including a shielded inductance
07/13/2005EP1553630A1 Modular board device and high frequency module and method for producing them
07/13/2005EP1553626A1 Multilayer printed wiring board
07/13/2005EP1553519A1 Adapter, memory card, and memory card module
07/13/2005EP1553142A2 Polyimide based compositions comprising doped polyaniline and methods relating thereto
07/13/2005EP1553134A2 Polyimide compositions having resistance to water sorption, and methods relating thereto
07/13/2005EP1553131A1 Compositions with polymers for advanced materials
07/13/2005EP1553130A1 Porous membrane of poly(metaphenylene isophthalamide) and process for producing the same
07/13/2005EP1552732A1 Method and device for joining at least two parts
07/13/2005EP1552729A2 Method for the manufacture of printed circuit boards with integral plated resistors
07/13/2005EP1552569A2 Electroluminescent assembly
07/13/2005EP1514327A4 Non-uniform transmission line and method of fabricating the same
07/13/2005EP1478607B1 Method for metallizing titanate-based ceramics
07/13/2005EP0932500B1 Method to control cavity dimensions of fired multilayer circuit boards on a support
07/13/2005CN2710321Y 芯片模块 Chip Module
07/13/2005CN2710310Y Device for automatic absorbing screw bolt
07/13/2005CN2710309Y Bridging element for mounting electronic element on circuit board
07/13/2005CN2710308Y Wiring substrate
07/13/2005CN2710160Y Circuit substrate
07/13/2005CN1640218A Electrical circuit arrangement comprised of a number of electrically interconnected circuit components
07/13/2005CN1640217A Laminated socket contacts
07/13/2005CN1640155A Telecommunications patch panel
07/13/2005CN1639970A Dielectric loss compensation methods and apparatus
07/13/2005CN1639923A EMI shielded module