Patents for H05K 1 - Printed circuits (98,583)
07/2005
07/07/2005US20050147740 Method of applying a cover layer to a structured base layer
07/07/2005US20050147522 Conductive material and method for filling via-hole
07/07/2005US20050146977 Circuit
07/07/2005US20050146859 Compact display assembly
07/07/2005US20050146858 Card-type electronic device having multilayer printed wiring board and method for manufacturing card-type electronic device
07/07/2005US20050146857 Anti-strip screw boss
07/07/2005US20050146856 Memory module
07/07/2005US20050146854 High frequency module
07/07/2005US20050146840 Structure of an interleaving striped capacitor substrate
07/07/2005US20050146839 Forming thin layer structures by ablation
07/07/2005US20050146828 Coaxial module with surge protector
07/07/2005US20050146811 Method for suppressing tribocharge in the assembly of magnetic heads
07/07/2005US20050146510 Printable electromechanical input means and an electronic device including such input means
07/07/2005US20050146403 High-frequency module and its manufacturing method
07/07/2005US20050146390 Multi-layer substrate having impedance-matching hole
07/07/2005US20050146347 Techniques for controlling movement of a circuit board module along card cage slot
07/07/2005US20050146340 Method and apparatus for attaching a sensor assembly in a control unit
07/07/2005US20050146336 Connector for measuring electric resistance, apparatus and method for measuring electric resistance of circuit board
07/07/2005US20050146280 Method and apparatus for the reduction of electromagnetic radiation from display screens
07/07/2005US20050146072 Low cost method to form solderable contact points for structures manufactured from conductive loaded resin-based materials
07/07/2005US20050146052 Semiconductor device and semiconductor module
07/07/2005US20050146049 RF and MMIC stackable micro-modules
07/07/2005US20050146039 High reliability multilayer circuit substrates and methods for their formation
07/07/2005US20050146038 Multilayer interconnection board and production method thereof
07/07/2005US20050146031 Low profile stacking system and method
07/07/2005US20050146030 Solder ball pad structure
07/07/2005US20050146025 Method of forming an opening or cavity in a substrate for receiving an electronic component
07/07/2005US20050146024 Electronics unit
07/07/2005US20050146019 Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
07/07/2005US20050146017 Power supply connection structure to a semiconductor device
07/07/2005US20050146016 Electronic package with improved current carrying capability and method of forming the same
07/07/2005US20050146011 Pitch change and chip scale stacking system and method
07/07/2005US20050145997 Layer sequence for producing a composite material for electromechanical components
07/07/2005US20050145832 Polyimide based compositions comprising doped polyaniline and methods and compositions relating thereto
07/07/2005US20050145701 Image manipulation and printing device
07/07/2005US20050145609 Method of forming an opening or cavity in a substrate for receiving an electronic component
07/07/2005US20050145608 Method of forming an opening or cavity in a substrate for receiving an electronic component
07/07/2005US20050145595 Process for Manufacturing Printed Circuit Boards with Protected Spaces Between Tracks
07/07/2005US20050145414 Metal core multilayer printed wiring board
07/07/2005US20050145413 Method for fabricating a warpage-preventive circuit board
07/07/2005US20050145411 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects
07/07/2005US20050145319 Adhesive coating on substrate film; applying a ceramic slip to the substrate film; drying the ceramic slip
07/07/2005US20050144767 Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board
07/07/2005DE19935677B4 Paste für den Siebdruck von elektrischen Strukturen auf Trägersubstraten Paste for screen printing of electrical structures to support substrates
07/07/2005DE19781160B4 Elektrooptische hybride Verdrahtungsplatine und Verfahren zur Herstellung derselben An electro-optic hybrid wiring board and method for producing same
07/07/2005DE19716113B4 Elektrische Leistungsstrang-Baugruppe Electric power train assembly
07/07/2005DE19637886B4 Substrat für gedruckte Schaltungen und Verfahren zum Anlöten eines ersten und eines zweiten Bauteils an einem gedruckten Leitungsmuster auf einem Substrat A substrate for printed circuits and methods for soldering a first and a second component on a printed wiring pattern on a substrate
07/07/2005DE10392736T5 Leuchtmodul Light module
07/07/2005DE10358691A1 Sockel- bzw. Adapter-Einrichtung, sowie Vorrichtung und Verfahren zum Beladen einer Sockel- bzw. Adapter-Einrichtung mit einem entsprechenden Halbleiter-Bauelement Socket or adapter device, and apparatus and method for loading a socket or adapter device with a corresponding semiconductor device
07/07/2005DE10356498A1 Elektrisches Bauelement und Schaltungsanordnung Electrical component and circuit
07/07/2005DE10351720A1 Prüfnormal zum Prüfen von in der SMD-Montage eingesetzten optischen Erkennungssystemen und Verfahren zum Herstellen desselben Test standard for testing thereof used in the surface mounting optical recognition systems and methods for preparing
07/07/2005DE10208172B4 Zwischenträger zum Einsetzen in einen Träger und Träger mit einem Zwischenträger Between the carrier for insertion into a carrier and the carrier with an intermediate carrier
07/07/2005DE102004015929A1 Electronic component, typically memory module, containing semiconductor element on main face of circuit board, and heat convecting element extending along entire semiconductor element and thermally coupled to circuit board
07/07/2005DE102004014439A1 Circuit assembly with circuit module on supporting circuit board, with housing containing integrated circuit chip and electrically conductive plate, aligned with circuit chip on its underside
07/07/2005CA2550676A1 Polyamide acid resin containing unsaturated group, photosentive resin composition using same, and cured product thereof
07/06/2005EP1551041A1 Thin film capacitors on ceramic substrate
07/06/2005EP1551037A1 Flexible carrier with electrically conducting structure
07/06/2005EP1550889A2 Opto-electronic module comprising flexible electric connection cable and method of making the same
07/06/2005EP1550888A1 Methods of forming electronic and optical components using laser ablation
07/06/2005EP1550875A1 Apparatus and method for controlling insertion of a module
07/06/2005EP1550698A2 Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto
07/06/2005EP1550697A1 Heat-resistant film and metal laminate thereof
07/06/2005EP1550678A1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same
07/06/2005EP1550361A1 Electronic substrate of a three-dimensional electronic module
07/06/2005EP1550358A2 Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards
07/06/2005EP1550176A1 Electronic circuitry provided with an integrated antenna
07/06/2005EP1550174A2 Proton-conducting membrane and use thereof
07/06/2005EP1550162A2 Multilayer substrate
07/06/2005EP1550140A1 Techniques for fabricating a resistor on a flexible base material
07/06/2005EP1513621A4 Method for patterning carbon nanotube coating and carbon nanotube wiring
07/06/2005CN1636302A Shielded carrier for land grid array connectors and a process for fabricating same
07/06/2005CN1636167A Method and materials for printing particle-enhanced electrical contacts
07/06/2005CN1635949A Apparatus for microdeposition of multiple fluid materials
07/06/2005CN1635825A A circuit board and manufacturing method thereof
07/06/2005CN1635824A Highly radiating multi-layer circuit board and manufacturing method thereof
07/06/2005CN1209951C Method for manufacturing ceramic multi-layer substrate, and unbaked composite laminated body
07/06/2005CN1209949C Method of forming welding zone on circuit board
07/06/2005CN1209877C Appts. and method for generating electromigration
07/06/2005CN1209815C Welding pad structure for semiconductor package
07/06/2005CN1209814C Process for the manufacture of printed circuit board with plated resistor
07/06/2005CN1209802C Method for producing electronic device and electronic device
07/06/2005CN1209771C Insulator ceramic composition
07/06/2005CN1209747C Suspension holder for HDD and its producing method
07/06/2005CN1209670C Liquid crystal display device with flexible printed circuitboard
07/06/2005CN1209417C Active energy line solidified polyimide resin composition
07/06/2005CN1209321C Porous ceramic and method for prepartion thereof and microstrip substrate
07/05/2005US6914787 Electronic component module
07/05/2005US6914786 Converter device
07/05/2005US6914566 Ball grid array antenna
07/05/2005US6914513 Materials system for low cost, non wire-wound, miniature, multilayer magnetic circuit components
07/05/2005US6914508 Simplified transformer design for a switching power supply
07/05/2005US6914502 Wiring structure for transmission line having grooved conductors
07/05/2005US6914500 Filter circuit device and method of manufacturing the same
07/05/2005US6914379 Thermal management in electronic displays
07/05/2005US6914334 Circuit board with trace configuration for high-speed digital differential signaling
07/05/2005US6914328 Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layers
07/05/2005US6914324 Memory expansion and chip scale stacking system and method
07/05/2005US6914322 Semiconductor device package and method of production and semiconductor device of same
07/05/2005US6914200 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
07/05/2005US6914199 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof