Patents for H05K 1 - Printed circuits (98,583)
06/2005
06/16/2005US20050128720 Printed circuit embedded capacitors
06/16/2005US20050128717 Flexible printed circuit board(FPC) for liquid crystal display(LCD) module
06/16/2005US20050128692 Electric circuit module and method for its assembly
06/16/2005US20050128678 Electronic component
06/16/2005US20050128672 Closed loop backdrilling system
06/16/2005US20050128040 Magnetic assembly
06/16/2005US20050127940 Signal transmitting device suited to fast signal transmission
06/16/2005US20050127536 Conductor composition, a mounting substrate and a mounting structure utilizing the composition
06/16/2005US20050127531 Method for ball grid array chip packages having improved testing and stacking characteristics
06/16/2005US20050127527 Electronic component with flexible contacting pads and method for producing the electronic component
06/16/2005US20050127522 Semiconductor device and electronic device, as well as method for manufacturing the same
06/16/2005US20050127520 Device package, a printed wiring board, and an electronic apparatus
06/16/2005US20050127493 Semiconductor device and electronic device, and methods for manufacturing thereof
06/16/2005US20050127368 Memory module
06/16/2005US20050127332 Metal paste and film formation method using the same
06/16/2005US20050127191 Data storage device incorporating a two-dimensional code
06/16/2005US20050127143 Solder joint structure and method for soldering electronic components
06/16/2005US20050126820 Method for fabricating wiring board provided with passive element, and wiring board provided with passive element
06/16/2005US20050126819 Methods to prevent mechanical flexure related BGA failure
06/16/2005US20050126707 Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process
06/16/2005US20050126682 Shrinkage resistance during sintering; firing green laminate at the sintering temperature for the green functional ceramic material
06/16/2005US20050126003 Method of manufacturing electronic component and member to be used in the same method
06/16/2005US20050126002 Method of manufacturing electronic component and member to be used in the same method
06/16/2005US20050125994 Socket and/or adapter device, and an apparatus and process for loading a socket and/or adapter device with a corresponding semi-conductor component
06/16/2005DE19926746B4 Mehrfachanordnung von mit LEDs bestückten Leiterplatten und Steckverbinder für die Verbindung von Leiterplatten Multiple arrangement of printed circuit boards equipped with LEDs and connectors for the connection of printed circuit boards
06/16/2005DE19509173B4 Masse aus einem Epoxygruppen enthaltenden thermoplastischen Norbornenharz und ihre Verwendung Mass containing epoxy groups from a thermoplastic norbornene and their use
06/16/2005DE10350648A1 Transponder Transponder
06/16/2005DE10348980A1 Elektronisches Bauteil, beispielsweise Positionssensor Electronic component, such as position sensor
06/15/2005EP1542523A1 Part mounting recognition mark recognition device and method
06/15/2005EP1542519A1 Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board
06/15/2005EP1542518A1 Board for printed wiring, printed wiring board, and method for manufacturing them
06/15/2005EP1542517A1 Printed Circuit Board for Mounting a Quad Flat Package IC, Method of Soldering a Quad Flat Package IC, and Air Conditioning Apparatus with such a Printed Circuit Board
06/15/2005EP1542516A1 Heat dissipating microdevice and method of making the same
06/15/2005EP1542360A1 Integrated circuit power supply circuit
06/15/2005EP1542239A1 Metal paste and film formation method using the same
06/15/2005EP1542058A1 Diffraction grating-optical modulation apparatus with an improved heat stability
06/15/2005EP1541972A1 Dial module, manufacturing method thereof, led display element, display module, movement module, connector module, and meter using them
06/15/2005EP1541537A1 Dielectric ceramic powder, method for producing the same, and composite dielectric material
06/15/2005EP1541234A1 Hybrid microfluidic chip and method of manufacture
06/15/2005EP1541002A1 Apparatus and method for inspecting cream solder printed on a substrate
06/15/2005EP1540674A1 Transformer and transformer unit having the same
06/15/2005EP1435021B1 Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes
06/15/2005EP1314172B8 Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly
06/15/2005EP0840676B1 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
06/15/2005CN2704991Y Three primary LED module for display screen
06/15/2005CN1628321A Method for manufacturing RFID labels
06/15/2005CN1628032A Ink jet printhead chip with predetermined micro-electromechanical systems height
06/15/2005CN1627884A Manufacturing method of ceramic substrate and electronic component modular using such substrate
06/15/2005CN1627883A Method of making substrate for flexible circuit board
06/15/2005CN1627882A Printed circuit board for mounting a quad flat package IC, method of soldering a quad flat package IC, and air conditioning apparatus with such a printed circuit board
06/15/2005CN1627881A Printed circuit board (PCB) structure comprising different levels
06/15/2005CN1627880A 柔性印刷电路板 A flexible printed circuit board
06/15/2005CN1627514A Semiconductor device and electronic device, and methods for manufacturing thereof
06/15/2005CN1627513A Semiconductor device and electronic device, and methods for manufacturing thereof
06/15/2005CN1627412A Control circuit and method for starting up multiple hard disks with multiple backboards in sequence
06/15/2005CN1627366A Suspension board with circuit
06/15/2005CN1627178A Optical appts. and image generator
06/15/2005CN1626577A Resin composition, prepreg and laminate using the composition
06/15/2005CN1626299A Dielectric ceramic powder, method for producing the same, and composite dielectric material
06/15/2005CN1206897C Insulation barrier on a printed circuit board
06/15/2005CN1206896C Surface mount technology compatible EMI gasket and method of installing EMI gasket on ground trace
06/15/2005CN1206893C Electronic arrangement equiped with electronic circuit substrate
06/15/2005CN1206887C Printed circuit assembly, its mfg. method
06/15/2005CN1206886C Panel display and printed circuit board
06/15/2005CN1206885C Printed circuit and its mfg. method
06/15/2005CN1206727C Chip package and its making process
06/15/2005CN1206677C Method of manufacturing ceramic electronic components
06/15/2005CN1206667C Method for forming transparent cnoductive film by using chemically amplified resist
06/15/2005CN1206317C Liquid crystal polymer film and stacked body and its producing method, and laminated installation loop base plate
06/15/2005CN1206279C Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom and lamiated structure
06/15/2005CN1206264C Dielectric resin foam and lens antenna comprising the same
06/15/2005CN1206259C Adhesive polyimide resin and adhesive laminate
06/14/2005US6906910 Structures for implementing integrated conductor and capacitor in SMD packaging
06/14/2005US6906750 Optical apparatus and method for making the same
06/14/2005US6906429 Semiconductor device and method of fabricating the same
06/14/2005US6906423 Mask used for exposing a porous substrate
06/14/2005US6906415 Semiconductor device assemblies and packages including multiple semiconductor devices and methods
06/14/2005US6906411 Multilayer substrate module and portable wireless terminal
06/14/2005US6906407 Field programmable gate array assembly
06/14/2005US6906262 Flexible print circuit, wire harness, and wiring structure using shape memory material
06/14/2005US6906253 Method for fabricating a solar tile
06/14/2005US6905994 Microwave dielectric composition and method for producing the same
06/14/2005US6905979 Apparatus and method for improving AC coupling on circuit boards
06/14/2005US6905912 Semiconductor device and method for fabricating the same
06/14/2005US6905757 Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminate
06/14/2005US6905634 Heat curable thermosetting luminescent resins
06/14/2005US6905589 Multilayer printed circuits; vertical adjusted electroconductive apertures; high density circuits
06/14/2005US6905569 Method of embedding optical fiber in multilayer printed circuit board
06/14/2005US6905361 Electrical device
06/14/2005US6905349 Technique for connector to printed circuit board decoupling to eliminate flexure
06/14/2005US6905342 Protected electrical interconnect assemblies
06/14/2005US6905063 Method of manufacturing semiconductor device
06/14/2005US6904674 Producing a printed wiring board suitable as an interposer of chip size packages for electrically connecting a semiconductor chip to an external printed wiring board
06/09/2005WO2005053372A1 Electromagnetic wave shielding resin composition, ferrite-coated metal magnetic microparticle suitable for use therein and process for producing the same
06/09/2005WO2005053367A2 Method and apparatus for the manufacture of electric circuits
06/09/2005WO2005053366A1 Electric circuit arrangement
06/09/2005WO2005053324A2 Patch panel with crosstalk reduction system and method
06/09/2005WO2005052894A1 Electronic circuit wire and display device
06/09/2005WO2005052705A1 Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same
06/09/2005WO2005052692A1 Ultraviolet curable silver composition and related method