Patents for H05K 1 - Printed circuits (98,583)
06/2005
06/23/2005DE10353042A1 Verfahren zur Verifizierung von Haarrissen in einer Lötstelle, die ein Bauteil mit einer Leiterplatte verbindet A method of verification of hairline cracks in a solder joint connecting a component to a circuit board
06/23/2005DE10335129B3 Kühlanordnung für auf einer Leiterplatte angeordnete elektrische Bauelemente, insbesondere SMD-Bausteine Cooling arrangement for arranged on a printed circuit board electrical components, in particular SMD components
06/23/2005DE10231044B4 Halteanordnung für ein flaches Schaltkreiselement Support assembly for a flat circuit element
06/23/2005DE102004052227A1 Speichersystem und Speichermodul Storage system, and storage modulus
06/23/2005DE102004014221A1 Gedruckte Schaltkarte und Herstellungsverfahren für diese Printed circuit board and manufacturing method for this
06/23/2005DE10055436B4 Kühlverguss für ein elektrisches Bauteil Kühlverguss for an electrical part
06/22/2005EP1545175A2 Method of providing printed circuit board with conductive holes and board resulting therefrom
06/22/2005EP1545174A2 Method and apparatus for soldering or repairing an electronic component mounted on a circuit board
06/22/2005EP1545173A1 Wiring circuit board
06/22/2005EP1545172A1 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board
06/22/2005EP1545171A1 Method of forming pattern on ceramic green sheet and conductive paste for use in the method
06/22/2005EP1545170A1 Wiring circuit board
06/22/2005EP1545169A2 Switch module
06/22/2005EP1544948A2 Flexible cable interconnect assembly
06/22/2005EP1544916A1 Raised solder pad and method using the same
06/22/2005EP1544337A1 Glass cloth and film substrate using it
06/22/2005EP1543558A2 Radio frequency identificaton device and method
06/22/2005EP1543532A1 Hf-reactor
06/22/2005EP1543453A1 System and method for modifying electronic design data
06/22/2005EP1393371B1 Electronic module and method for assembling same
06/22/2005CN2705992Y Automatic sucking screw pile
06/22/2005CN2705991Y Hollow coil using printed circuit plate structure
06/22/2005CN1631067A Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board
06/22/2005CN1630946A Electronic circuit component
06/22/2005CN1630939A Forming printed circuit board structure using piezoelectric micro-coating method
06/22/2005CN1630917A Etching solution for forming an embedded resistor
06/22/2005CN1630855A Memory module having a path for transmitting high-speed data and a path for transmitting low-speed data and memory system having the memory module
06/22/2005CN1630680A 双轴取向热塑性树脂薄膜 Biaxially oriented thermoplastic resin film
06/22/2005CN1630673A Indole resins epoxy resins and resin compositions containing the same
06/22/2005CN1630463A Operating circuit for a lamp with a heat sink
06/22/2005CN1630459A Printed wiring board and method for manufacturing the same
06/22/2005CN1630456A Electric contact arrangement and method for preparing same
06/22/2005CN1630455A Wired circuit board holding sheet and production method thereof
06/22/2005CN1630454A Printed wiring board and semiconductor device
06/22/2005CN1630068A Wiring circuit board
06/22/2005CN1630067A Wiring circuit board
06/22/2005CN1630066A High wireability microvia substrate
06/22/2005CN1630057A Socket and/or adapter device, and an apparatus and process for loading a socket and/or adapter device with a corresponding semi-conductor component
06/22/2005CN1629946A Optical pickup actuator
06/22/2005CN1629240A 丙烯酸粘合剂片材 Acrylic adhesive sheet
06/22/2005CN1207947C Printed circuit board assembly
06/22/2005CN1207946C Circuit substrate connecting structure, liquid crystal display with same and mounting method
06/22/2005CN1207531C Plate for measuring deviation of element mounting device and its measuring method
06/22/2005CN1207249C Ceramic parts and method for manufacturing the same
06/21/2005US6909911 Wireless terminal
06/21/2005US6909818 Optoelectronic packaging substrate and production method of the same
06/21/2005US6909604 Cooling device capable of reducing thickness of electronic apparatus
06/21/2005US6909593 Multi-layer capacitor, wiring board, and high-frequency circuit
06/21/2005US6909354 Electronic pressure sensitive transducer apparatus and method for manufacturing same
06/21/2005US6909246 Electronic ballast and electronic transformer
06/21/2005US6909184 TAB type semiconductor device
06/21/2005US6909183 Substrate for an electric component and method for the production thereof
06/21/2005US6909173 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system
06/21/2005US6909056 Compliant electrical contact assembly
06/21/2005US6909055 Electrical device allowing for increased device densities
06/21/2005US6909054 Multilayer printed wiring board and method for producing multilayer printed wiring board
06/21/2005US6909053 Circuit substrate connecting structure, liquid crystal display device having the connecting structure and mounting method of liquid crystal display device
06/21/2005US6909052 Techniques for making a circuit board with improved impedance characteristics
06/21/2005US6909051 Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric
06/21/2005US6908960 Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin
06/21/2005US6908855 Plating tail design for IC packages
06/21/2005US6908809 Embedded capacitors using conductor filled vias
06/21/2005US6908790 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film
06/21/2005US6908786 Method for producing a contactless chip card using transfer paper
06/21/2005US6908685 Film made from polyamic acid prepared from pyromellitic dianhydride, 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4'-oxydianiline; high elastic modulus, low thermal expansion coefficient, alkali etchability, film formability
06/21/2005US6908583 System and method for bending a substantially rigid substrate
06/21/2005US6907824 Screen printing apparatus and method of the same
06/21/2005US6907658 Manufacturing methods for an electronic assembly with vertically connected capacitors
06/21/2005CA2253347C Resonant tag and method of manufacturing the same
06/19/2005CA2491276A1 Procedure for brazing an electronic component onto an electronic board, procedure for repairing the board and facility for implementing the procedure
06/16/2005WO2005055684A1 Multilayer printed wiring board
06/16/2005WO2005055683A1 Electronic part and manufacturing method thereof
06/16/2005WO2005055680A1 Method of manufacturing an electrical component
06/16/2005WO2005055679A1 Method for the production of an electromagnetic component
06/16/2005WO2005054345A1 Production process tape for film-shaped wiring board
06/16/2005WO2005054118A1 Fine product manufacturing method
06/16/2005WO2005053847A1 Hybrid microfluidic chip and method for manufacturing same
06/16/2005WO2005039254A3 Electrical circuit apparatus and method for assembling same
06/16/2005WO2005012368A3 Method and chemistry for automatic self-joining of failures in polymers
06/16/2005WO2004093100A3 Method for producing soldering globules on an electrical component
06/16/2005WO2004053900A3 Flame sensor
06/16/2005US20050132387 Electronic apparatus and optical disk recording/reading device including circuit board
06/16/2005US20050131552 System and method for starting up plural electronic devices in an orderly manner
06/16/2005US20050131167 Indole resins epoxy resins and resin compositions containing the same
06/16/2005US20050131166 reacting polyphenylene ether (PPE) with an epoxy resin that has low bromine content in a non-polar solvent in the presence of a catalyst in a reactor; PPE needs not to be cleaved into small molecules and instead mixes and react directly reducing reaction time
06/16/2005US20050131122 Free-flowing mixture with resin; milling
06/16/2005US20050130447 Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin composition
06/16/2005US20050130446 Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin composition
06/16/2005US20050130431 Method for making a package substrate without etching metal layer on side walls of die-cavity
06/16/2005US20050130413 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
06/16/2005US20050130368 Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
06/16/2005US20050130349 Electronic parts built-in substrate and method of manufacturing the same
06/16/2005US20050129895 Adhesive film and prepreg
06/16/2005US20050129397 Exposure device
06/16/2005US20050129349 System and method for integrating optical layers in a PCB for inter-board communications
06/16/2005US20050128894 Optical pickup actuator
06/16/2005US20050128768 Led symbol signal
06/16/2005US20050128725 Device for coupling PCB sheet
06/16/2005US20050128724 Device for coupling PCB sheet
06/16/2005US20050128721 Printed circuit boards having pads for solder balls and methods for the implementation thereof