Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
09/2005
09/20/2005US6946922 Crystal oscillation device and electronic device using the same
09/20/2005US6946779 Electromechanical transducer
09/20/2005US6946743 Flexibility enhanced integrated circuit carrier
09/20/2005US6946738 Semiconductor packaging substrate and method of producing the same
09/20/2005US6946733 Ball grid array package having testing capability after mounting
09/20/2005US6946731 Layout structure for providing stable power source to a main bridge chip substrate and a motherboard
09/20/2005US6946724 By forming constricted parts at the separation grooves, the adhesion of the conductive patterns with the insulating resin that fills the separation grooves can be improved
09/20/2005US6946523 Microelectronics; hermetic sealed packages
09/20/2005US6946415 Mixture of magnesium aluminate and glass powder
09/20/2005US6946405 Polyparaxylylene film, production method therefor and semiconductor device
09/20/2005US6946324 Process for fabricating a leadless plastic chip carrier
09/20/2005US6946224 Battery mounting and testing method
09/20/2005US6945929 Imaging device assembly for electronic stereoscopic endoscope system
09/20/2005US6945820 Electrical connect having integrated over current protector
09/20/2005US6945789 Display module
09/20/2005US6945707 Three-dimensional mounted assembly and optical transmission device
09/20/2005US6945465 Integrated circuit card having staggered sequences of connector terminals
09/20/2005US6945406 Tape carrier package film
09/20/2005US6944946 Porous power and ground planes for reduced PCB delamination and better reliability
09/20/2005US6944945 multilayered circuit boards having capacity for increased chip and other component attachment and further characterized by increased circuit density; formed by new sequential build procedures
09/20/2005US6944936 Method for manufacturing an integrated lead suspension
09/20/2005CA2245817C Arrangement made up of an electrical circuit board and an electrical pressure transducer
09/20/2005CA2160242C Three dimensional package for monolithic microwave/millimeterwave integrated circuits
09/15/2005WO2005086556A1 Electromagnetic noise absorbing thin film
09/15/2005WO2005086554A1 Via transmission lines for multilayer printed circuit boards
09/15/2005WO2005086553A1 Multilayer board manufacturing method
09/15/2005WO2005086552A1 Circuit board manufacturing method and circuit board
09/15/2005WO2005086550A1 Method for fabricating copper printed circuit board having circuits of different thicknesses
09/15/2005WO2005086548A1 Three-dimensional circuit board
09/15/2005WO2005086547A1 Flexible printed wiring board and manufacturing method thereof
09/15/2005WO2005086235A2 Base semi-conductor component for a semi-conductor component stack and method for the production thereof
09/15/2005WO2005086233A2 Component with encapsulation suitable for wlp and production method
09/15/2005WO2005086196A1 Flexible fuse
09/15/2005WO2005086185A1 Magnetic device
09/15/2005WO2005086184A1 Electromagnetic noise suppressing thin film
09/15/2005WO2005085891A1 Vertical die chip-on-board
09/15/2005WO2005085358A1 Method for producing thermoplastic resin composition containing ultrafine particles
09/15/2005WO2005085348A1 Metal-coated resin molded article and production method therefor
09/15/2005WO2005085347A1 Resin molded article with reduced dielectric loss tangent and production method therefor
09/15/2005WO2005085335A1 Prepreg, metal-clad laminate and printed circuit board using same
09/15/2005WO2005085334A1 Polymer composite formed article, printed wiring board using the formed article and method for producing them
09/15/2005WO2005085333A1 Organic insulating film with controlled molecule orientation, adhesive film using the organic insulating film, flexible metal-plated stacked board, multilayer flexible metal-plated stacked board, coverlay film, tape for tab and base tape for cof
09/15/2005WO2005084948A1 Heat-resistant resin laminated film, multilayer film with metal layer including same, and semiconductor device
09/15/2005WO2005084363A2 Low cost electrical terminals manufactured from conductive loaded resin-based materials
09/15/2005WO2005084341A2 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection
09/15/2005WO2005084259A2 Dual segment molded lead frame connector for optical transceiver modules
09/15/2005WO2005084183A2 Electronic interconnect devices
09/15/2005WO2005084120A2 Motor vehicle rear view mirror assembly comprising a flashing light-emitting device
09/15/2005WO2005013363A3 Circuit arrangement placed on a substrate and method for producing the same
09/15/2005WO2004114217A3 Inspection system for and method of inspecting deposits printed on workpieces
09/15/2005WO2004082879A3 Conveyorized blind microvia laser drilling system
09/15/2005WO2004082022A3 Method for producing an electronic component or module and a corresponding component or module
09/15/2005US20050202725 Apparatus for providing controlled impedance in an electrical contact
09/15/2005US20050202722 Preferential via exit structures with triad configuration for printed circuit boards
09/15/2005US20050202697 Methods and apparatus for reducing crosstalk in electrical connectors
09/15/2005US20050202694 Mounting structure, electro-optical device, electronic apparatus, and method of manufacturing electro-optical device
09/15/2005US20050202693 Flexible circuit board
09/15/2005US20050202296 Low cost fuel cell bipolar plates manufactured from conductive loaded resin-based materials
09/15/2005US20050202261 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
09/15/2005US20050202252 Use of alternative polymer materials for "soft" polymer pellicles
09/15/2005US20050202161 Low cost electrically conductive carpeting manufactured from conductive loaded resin-based materials
09/15/2005US20050202160 molding polymers containing electroconductive fibers, powders and/or mixtures into threads or piles and joining to backing layers
09/15/2005US20050201693 Portable device
09/15/2005US20050201670 Manufacturing method for manufacturing electro-optical device, connection method for connecting terminals, electro-optical device, and electronic equipment
09/15/2005US20050201434 Optical head apparatus
09/15/2005US20050201190 Prefabricated electrical connector based electrical distribution system
09/15/2005US20050201072 Reference slots for signal traces
09/15/2005US20050201071 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection
09/15/2005US20050201069 Electronic device
09/15/2005US20050201068 Replaceable LED module
09/15/2005US20050201065 Preferential ground and via exit structures for printed circuit boards
09/15/2005US20050201057 Housing for electronic home entertainment devices
09/15/2005US20050201034 Anisotropic conductive sheet
09/15/2005US20050201009 Recording/playback apparatus with electric wave transmission
09/15/2005US20050200684 Pattern formation method, pattern formation system, and electronic device
09/15/2005US20050200532 Dielectric substrate with selectively controlled effective permittivity and loss tangent
09/15/2005US20050200431 Lumped-element low-pass filter in multi-layered substrate
09/15/2005US20050200413 Flexible substrate and electronic equipment
09/15/2005US20050200329 Low cost charger connections manufactured from conductive loaded resin-based material
09/15/2005US20050200267 Substrate having fine line, electron source and image display apparatus
09/15/2005US20050200136 Low cost hardware manufactured from conductive loaded resin-based materials
09/15/2005US20050200045 Method of manufacturing a sealed electronic module
09/15/2005US20050200041 Low cost hardware manufactured from conductive loaded resin-based materials
09/15/2005US20050200010 Circuit board
09/15/2005US20050200002 Electronic circuit and control method therefor
09/15/2005US20050199929 Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
09/15/2005US20050199822 Mems based charged particle deflector design
09/15/2005US20050199821 Compact microcolumn for automated assembly
09/15/2005US20050199681 Printed circuit board with embedded capacitors therein, and process for manufacturing the same
09/15/2005US20050199680 Rotating disk storage device and integrated wire head suspension assembly
09/15/2005US20050199610 Variable watt density layered heater
09/15/2005US20050199506 Electrolyte deposits tin/alloy film on composite substrate
09/15/2005US20050199422 Maximizing capacitance per unit area while minimizing signal transmission delay in PCB
09/15/2005US20050199421 Printed circuit board and method of printing identification marks
09/15/2005US20050199420 Circuit board and method for manufacturing the same
09/15/2005US20050199419 PCB based band-pass filter for cutting out harmonic of high frequency
09/15/2005US20050199417 Conductive circuits or cables manufactured from conductive loaded resin-based materials
09/15/2005US20050199413 Conductive circuits or cables manufactured from conductive loaded resin-based materials
09/15/2005US20050199331 Method of fabricating multilayer ceramic substrate
09/15/2005US20050198819 Method of manufacturing a sealed electronic module
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