| Patents for H05K 1 - Printed circuits (98,583) |
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| 07/28/2005 | US20050161643 Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste |
| 07/28/2005 | US20050161437 Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process |
| 07/28/2005 | US20050161426 Image-recording apparatus and image-recording process |
| 07/28/2005 | US20050161255 Multi-layer wiring board |
| 07/28/2005 | US20050161254 Multilayered circuit board for high-speed, differential signals |
| 07/28/2005 | US20050161253 Tamper barrier for electronic device |
| 07/28/2005 | US20050161252 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 07/28/2005 | US20050161251 Hybrid integrated circuit device and method of manufacturing the same |
| 07/28/2005 | US20050161250 Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board |
| 07/28/2005 | US20050161149 Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process |
| 07/28/2005 | US20050161142 Low cost conductive brushes manufactured from conductive loaded resin-based materials |
| 07/28/2005 | US20050160702 System and method for installing a tamper barrier wrap in a PCB assembly, including a PCB assembly having improved heat sinking |
| 07/28/2005 | US20050160594 Apparatus and method for replacing defective PCB of PCB panel |
| 07/28/2005 | US20050160547 Low cost conductive brushes manufactured from conductive loaded resin-based materials |
| 07/28/2005 | DE19826648B4 Schaltungsträger mit einer optischen Schicht und optoelektronisches Bauelement Circuit board with an optical layer and optoelectronic device |
| 07/28/2005 | DE102004022755A1 Mehrschichtige Substratanordnung zur Reduzierung der Layout-Fläche The multi-layer substrate assembly to reduce layout area |
| 07/28/2005 | DE102004012810A1 Gedruckte Leiterplatte und Aufbau mit schrägen Durchkontakten Printed circuit board and structure with sloping vias |
| 07/28/2005 | DE102004001107A1 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film |
| 07/28/2005 | CA2551397A1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components |
| 07/27/2005 | EP1558065A2 Surface mounting of components |
| 07/27/2005 | EP1558064A1 High-pressure discharge lamp operation device and illumination appliance having the same |
| 07/27/2005 | EP1557736A2 Tamper barrier for electronic device |
| 07/27/2005 | EP1556773A2 Modular server processing card system and method |
| 07/27/2005 | EP1556449A1 Ink composition and method for use thereof in the manufacturing of electrochemical sensors |
| 07/27/2005 | EP1556226A2 Enzyme print humidification in a continuous process for manufacture of electrochemical sensors |
| 07/27/2005 | EP1506595A4 Rf system concept for vehicular radar having several beams |
| 07/27/2005 | EP0864248B1 Fillers for improved epoxy laminates |
| 07/27/2005 | EP0710062B1 Multilayer printed wiring board and its manufacture |
| 07/27/2005 | CN2713666Y Electric connector assembly |
| 07/27/2005 | CN1647598A Method of manufacturing an electronic device |
| 07/27/2005 | CN1647596A Circuit board and method for manufacturing the same |
| 07/27/2005 | CN1647595A Electrically insulating body, and electronic device |
| 07/27/2005 | CN1647543A Modular broadcast television products |
| 07/27/2005 | CN1647271A Semiconductor device and method of manufacturing same |
| 07/27/2005 | CN1647268A Carrier, method of manufacturing a carrier and an electronic device |
| 07/27/2005 | CN1647267A Circuit board, process for producing the same and power module |
| 07/27/2005 | CN1647262A Mold release layer transferring film and laminate film |
| 07/27/2005 | CN1646635A Thermosetting resin composition and prepreg and laminated sheet using the same |
| 07/27/2005 | CN1646633A Conductive composition, conductive film, and process for the formation of the film |
| 07/27/2005 | CN1646417A Method of manufacturing an electronic device |
| 07/27/2005 | CN1646326A Marking substrates |
| 07/27/2005 | CN1645991A 多层印刷电路板 The multilayer printed circuit board |
| 07/27/2005 | CN1645990A Circuit substrate manufacturing method |
| 07/27/2005 | CN1645988A Methods of forming electronic and optical components using laser ablation |
| 07/27/2005 | CN1645987A Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board |
| 07/27/2005 | CN1645986A Production for printing circuit basilar plate |
| 07/27/2005 | CN1645985A Electronic module, device therwith and verifying method for press connection thereon |
| 07/27/2005 | CN1645757A Wiring method for decreasing interference in TD-SCDMA mobile phone with VCC-2V8 power supply |
| 07/27/2005 | CN1645669A Double density quasi-coax transmission lines |
| 07/27/2005 | CN1645668A Quasi-coax transmission lines |
| 07/27/2005 | CN1645600A 混合集成电路装置及其制造方法 Hybrid integrated circuit device and manufacturing method thereof |
| 07/27/2005 | CN1645590A Fabrication method of semiconductor integrated circuit device |
| 07/27/2005 | CN1645579A Method of manufacturing hybrid integrated circuit device |
| 07/27/2005 | CN1645560A A suspension for filling via holes in silicon and method for making the same |
| 07/27/2005 | CN1645172A Light transmission path substrate, light transmission path built-in substrate and their manufacture |
| 07/27/2005 | CN1212754C Circuit board and its manufacturing method |
| 07/27/2005 | CN1212657C Adhesive for electronic element device |
| 07/27/2005 | CN1212545C Photosensitive insulated glue composition and photosensitive film of the glue |
| 07/27/2005 | CN1212354C fire-retardant resin, composition, preliminary-dip piece, laminated board, metal cladded laminated board, printed circuit-board and multi-layer printed circuit board |
| 07/26/2005 | US6922347 Programmable power supply |
| 07/26/2005 | US6922344 Device for connecting the terminal pins of a package for an optical transmitting and/or receiving device to a printed circuit board and conductor arrangement for such a device |
| 07/26/2005 | US6922343 Memory card |
| 07/26/2005 | US6922342 Computer system employing redundant power distribution |
| 07/26/2005 | US6922340 Stack up assembly |
| 07/26/2005 | US6922339 Heat dissipating structure of printed circuit board and fabricating method thereof |
| 07/26/2005 | US6922062 Timing markers for the measurement and testing of the controlled impedance of a circuit board |
| 07/26/2005 | US6922049 Testing method for a printed circuit board formed with conductive traces for high-frequency differential signal transmission |
| 07/26/2005 | US6922020 Electroluminescent lamp module and processing method |
| 07/26/2005 | US6921977 Semiconductor package, method of production of same, and semiconductor device |
| 07/26/2005 | US6921922 Optical communication module |
| 07/26/2005 | US6921869 Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof |
| 07/26/2005 | US6921868 Trimming of embedded structures |
| 07/26/2005 | US6921867 Stress release feature for PWBs |
| 07/26/2005 | US6921780 Non-silicone conductive paste for the electrical industry, and its use |
| 07/26/2005 | US6921626 Processing inorganic nanoparticles and a carrier to form an electroconductive pattern area that adheres to the surface of a substrate |
| 07/26/2005 | US6921573 High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristics |
| 07/26/2005 | US6921183 Concave cup printed circuit board for light emitting diode and method for producing the same |
| 07/26/2005 | CA2288817C Lead free solder alloy |
| 07/21/2005 | WO2005067359A1 Ceramic multilayer substrate |
| 07/21/2005 | WO2005067357A1 Transmission line with a transforming impedance and solder lands |
| 07/21/2005 | WO2005067354A1 Printed wiring board, method for manufacturing same, and circuit device |
| 07/21/2005 | WO2005067102A1 Electrical connector |
| 07/21/2005 | WO2005067092A1 Triangular conforming transmission structure |
| 07/21/2005 | WO2005067042A1 Method for electrically connecting an electrical conductor to an electronic component, and device |
| 07/21/2005 | WO2005067037A1 Backside cooling apparatus for modular platforms |
| 07/21/2005 | WO2005066992A1 Connecting structure and connecting method of circuit |
| 07/21/2005 | WO2005066955A1 Base material for hdd suspension |
| 07/21/2005 | WO2005066616A2 Biosensor and method of making |
| 07/21/2005 | WO2005066392A2 Surface structuring by means of a film |
| 07/21/2005 | WO2005066252A2 Inorganic powder, resin composition filled with the powder and use thereof |
| 07/21/2005 | WO2005066246A1 Mold release film |
| 07/21/2005 | WO2005066242A1 Aromatic polyamic acid and polyimide |
| 07/21/2005 | WO2005065936A1 Hot pressing ceramic distortion control |
| 07/21/2005 | WO2005065868A1 Method for producing metal powder |
| 07/21/2005 | WO2005065274A2 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit |
| 07/21/2005 | WO2005065238A2 Micro pin grid array with pin motion isolation |
| 07/21/2005 | WO2005065097A2 Internally shielded energy conditioner |
| 07/21/2005 | WO2005038986A3 Electrical circuit apparatus and methods for assembling same |
| 07/21/2005 | WO2005027596A3 Printed circuit board for a radio module |
| 07/21/2005 | WO2005023523A3 Method and device for the production of a three-dimensional multi-material component by means of ink-jet-type printing |