Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
09/2005
09/01/2005US20050188531 Assembly method for actuator head suspension assembly
09/01/2005DE10329143B4 Elektronisches Modul und Verfahren zur Herstellung desselben An electronic module and method for manufacturing the same
09/01/2005DE102005002508A1 Circuit board comprises primary and secondary conducting layers, and an intermediate layer which is heat conducting and electrically insulating
09/01/2005DE102005001264A1 Ingredienzanalyseverfahren und Ingredienzanalysevorrichtung Ingredienzanalyseverfahren and Ingredienzanalysevorrichtung
09/01/2005DE102004053958B3 Device for detecting electromagnetic radiation, especially sunlight, for use in vehicle, has metal core conducting plate with region(s) inclined to its plane, at least one optoelectronic component arranged in inclined region
09/01/2005DE102004038847B3 Device for floating measurement of currents in conducting track has multilayer structure with sensor in opening in insulating ceramic layer with conducting track above or below at distance ensuring required breakdown resistance
09/01/2005DE102004006533A1 Elektrisch leitfähiger Kontaktstift zum Einpressen in eine Öffnung einer Leiterplatte sowie elektrische Baugruppe mit einem solchen Kontaktstift Electrically conductive contact pin for pressing into an opening of a circuit board and electrical assembly with such a contact pin
09/01/2005DE102004005361A1 Verfahren zur Herstellung von metallischen Leitbahnen und Kontaktflächen auf elektronischen Bauelementen A process for the production of metallic interconnects and contact surfaces on electronic components
08/2005
08/31/2005EP1569502A1 Printed circuit board structure for motor driving device
08/31/2005EP1569501A1 Multilayer expansion card for electronic apparatus and relative production method
08/31/2005EP1569244A2 Composition of conductive paste
08/31/2005EP1569165A2 Portable electronic device
08/31/2005EP1568802A1 Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith
08/31/2005EP1568748A1 Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet
08/31/2005EP1568668A1 Ceramic composition being fired at low temperature and having high strength and method for preparing the same, and laminated electronic parts using the same
08/31/2005EP1568258A1 Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method
08/31/2005EP1568099A1 A circuit that taps a differential signal
08/31/2005EP1568079A1 Metal core substrate packaging
08/31/2005EP1568070A2 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
08/31/2005EP1567979A1 Chipcard and method for production of a chipcard
08/31/2005EP1567589A1 Hardener composition for epoxy resins
08/31/2005EP1567302A2 Laser trimming of resistors
08/31/2005CN2722563Y Noise inhibiting structure of cold light sheet for backlight
08/31/2005CN2722562Y Signal transmitting circuit structure
08/31/2005CN1663331A Method for producing an electrical circuit
08/31/2005CN1663329A Production of via hole in flexible circuit printable board
08/31/2005CN1663328A Circuit board device and method for board-to-board connection
08/31/2005CN1663327A Ball grid array package
08/31/2005CN1663120A Electronic component comprising a multilayer substrate and corresponding method of production
08/31/2005CN1663078A Completely integrated Ethernet connector
08/31/2005CN1663043A Dual-sided heat removal system
08/31/2005CN1663037A COF film carrier tape and its manufacturing method
08/31/2005CN1662929A Method for the production of electrically-conducting connections on chipcards
08/31/2005CN1662699A Collecting agent for glass fiber yarn and method for producing glass fiber yarn
08/31/2005CN1662698A Collecting agent for glass fiber yarn and glass fiber yarn using the same
08/31/2005CN1662602A Molding of wholly aromatic liquid crystal polyester resin
08/31/2005CN1662130A Flexible printed circuit board
08/31/2005CN1662120A Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
08/31/2005CN1662119A Printed circuit board structure for motor driving device
08/31/2005CN1662118A Wiring substrate, forming method of same, and organic el panel
08/31/2005CN1662117A Wired circuit substate
08/31/2005CN1662116A Multilayer ceramic substrate and its production method
08/31/2005CN1662115A Structure of soldering pad for improving stray effect
08/31/2005CN1661911A Circuit device
08/31/2005CN1661854A Signal line circuit device
08/31/2005CN1661745A Wiring substrate, input device using the same wiring substrate, and method of manufacturing the same input device
08/31/2005CN1661740A Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same
08/31/2005CN1661475A Photocuring resinoid compsn. and printed circuit board using same
08/31/2005CN1661431A Display device
08/31/2005CN1660953A Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet
08/31/2005CN1660598A Ink jet printable thick film ink compositions and processes
08/31/2005CN1660597A Ink jet printable thick film ink compositions and processes
08/31/2005CN1217566C Method for making multi-layer circuit assembly
08/31/2005CN1217130C Face-plate for operating machine
08/30/2005US6938227 System and method for modifying electronic design data
08/30/2005US6937824 Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device
08/30/2005US6937480 Printed wiring board
08/30/2005US6937478 Low profile circuit device for liquid crystal display and method for manufacturing the same
08/30/2005US6937477 Structure of gold fingers
08/30/2005US6937462 Electronic control device and manufacturing method for the same
08/30/2005US6937454 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface
08/30/2005US6937132 High-voltage variable resistor
08/30/2005US6937120 Conductor-within-a-via microwave launch
08/30/2005US6937037 Probe card assembly for contacting a device with raised contact elements
08/30/2005US6937004 Test mark and electronic device incorporating the same
08/30/2005US6936930 Thermal enhance MCM package
08/30/2005US6936922 Semiconductor package structure reducing warpage and manufacturing method thereof
08/30/2005US6936921 High-frequency package
08/30/2005US6936916 Microelectronic assemblies and electronic devices including connection structures with multiple elongated members
08/30/2005US6936914 Integrated circuit chip module
08/30/2005US6936854 Optoelectronic substrate
08/30/2005US6936808 Semiconductor device, optoelectronic board, and production methods therefor
08/30/2005US6936775 Selectively configurable circuit board
08/30/2005US6936774 Wiring substrate produced by transfer material method
08/30/2005US6936773 Board impedance management
08/30/2005US6936769 Electronic part mounting substrate, electronic part, and semiconductor device
08/30/2005US6936764 Three dimensional dynamically shielded high-Q BEOL metallization
08/30/2005US6936558 Low temperature sinterable dielectric ceramic composition, multilayer ceramic chip capacitor and ceramic electronic device
08/30/2005US6936532 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
08/30/2005US6936502 Package modification for channel-routed circuit boards
08/30/2005US6936498 Package structure with increased capacitance and method
08/30/2005US6936410 Marking substrates
08/30/2005US6936337 Metal/ceramic circuit board
08/30/2005US6936336 Transfer sheet and production method of the same and wiring board and production method of the same
08/30/2005US6935879 Connectors having circuit protection
08/30/2005US6935867 Connection unit between substrated and component and method for fabricating connection unit
08/30/2005US6935554 Metal/ceramic bonding article and method for producing same
08/30/2005US6935232 Solder paste printing apparatus and printing method
08/30/2005US6935018 Copper plated invar with acid preclean
08/25/2005WO2005079127A1 Electric sub-assembly comprising an electrically conductive contact pin for pressing into an opening of a printed circuit board
08/25/2005WO2005079125A1 Conductor plate
08/25/2005WO2005078795A1 Electronic circuit
08/25/2005WO2005078739A1 Aluminum alloy wiring material having high resistance to heat and target material
08/25/2005WO2005078497A1 Circuit board and method for embedding an optical component in a circuit board
08/25/2005WO2005078490A1 Optical wiring board and method for manufacturing optical wiring board
08/25/2005WO2005078012A2 Fire retardant compositions using siloxanes
08/25/2005WO2005078001A1 Process for producing epoxy resin, epoxy resin composition, and cured article
08/25/2005WO2005077853A2 Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
08/25/2005WO2005064646A3 An integrated circuit package substrate having a thin film capacitor structure
08/25/2005WO2005053367A3 Method and apparatus for the manufacture of electric circuits
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