Patents for H05K 1 - Printed circuits (98,583)
09/2005
09/28/2005CN1673269A Thermosetting resin composition and use thereof
09/28/2005CN1673187A Multi-layer ceramic substrate and manufacturing method thereof
09/28/2005CN1673143A Dielectric ceramic material and multilayer ceramic substrate
09/28/2005CN1672920A Flexible metal foil-polyimide laminate and making method
09/28/2005CN1221158C Method for producing double-side distributing board
09/28/2005CN1221029C High frequency semiconductor device
09/28/2005CN1220990C Method for producing nano composite magnet by spray method
09/28/2005CN1220976C Magnetic head universal rack assembly and its making method
09/27/2005US6950891 Signal routing between a memory control unit and a memory device
09/27/2005US6950644 Satellite broadcast receiving device having two local oscillation circuits and reduced spurious signal
09/27/2005US6950315 High frequency module mounting structure in which solder is prevented from peeling
09/27/2005US6950314 Arrangement for the electrical connection of an optoelectronic component to an electrical component
09/27/2005US6950312 Electronic units and method for packaging and assembly of said electronic units
09/27/2005US6950300 Ultra low inductance multi layer ceramic capacitor
09/27/2005US6950293 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
09/27/2005US6950067 Recording/playback apparatus with electric wave transmission
09/27/2005US6949992 System and method of providing highly isolated radio frequency interconnections
09/27/2005US6949991 Embedded shielded stripline (ESS) structure using air channels within the ESS structure
09/27/2005US6949836 Printed circuit board multi-layer structure with embedded device
09/27/2005US6949826 High density semiconductor package
09/27/2005US6949771 Light source
09/27/2005US6949709 Method for making a dashboard subassembly in paticular a motor vehicle dashboard console
09/27/2005US6949707 Periodic interleaved star with vias electromagnetic bandgap structure for microstrip and flip chip on board applications
09/27/2005US6949487 Dielectric ceramic composition
09/27/2005US6949470 Method for manufacturing circuit devices
09/27/2005US6949296 for use as dielectrics in supporting electronics/integrated circuits; vapor deposition
09/27/2005US6949215 Method for processing a three-dimensional structure by laser
09/27/2005US6949156 monlithic; comprises refractory; wet slurry deposition; for production of electronic circuit or hydraulic module
09/27/2005US6948944 Wiring board with built-in electronic component and method for producing the same
09/27/2005US6948941 Interconnect assemblies and methods
09/27/2005US6948661 Data structure encoded on a surface of an object
09/27/2005US6948377 Method and apparatus for detecting the strain levels imposed on a circuit board
09/27/2005US6948371 Acoustic wave touch detecting apparatus
09/27/2005US6948242 Process for producing a contact-making device
09/27/2005US6948240 Method for shaping an object
09/22/2005WO2005089034A2 An element for carrying electronic components
09/22/2005WO2005089033A1 Control appliance
09/22/2005WO2005089023A1 Variable watt density layered heater
09/22/2005WO2005088737A1 Metal base circuit substrate for an optical device and method manufacturing the aforementioned substrate
09/22/2005WO2005088736A1 Production method of circuit board for light emitting body, precursor of circuit board for light emitting body, circuit board for light emitting body, and light emitting body
09/22/2005WO2005088730A2 Method for forming a structure
09/22/2005WO2005088711A1 Driver module structure
09/22/2005WO2005088708A2 Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures
09/22/2005WO2005088683A2 Wireless substrate-like sensor
09/22/2005WO2005088682A1 Improved wireless substrate-like sensor
09/22/2005WO2005088681A1 Wireless substrate-like sensor
09/22/2005WO2005088652A1 Metal-containing fine particle, liquid dispersion of metal-containing fine particle, and conductive metal-containing material
09/22/2005WO2005087852A1 Reactive flame retardant and flame-retardant processed resin obtained with the same
09/22/2005WO2005087497A2 3d-ink jet structuring of highly topographic surfaces
09/22/2005WO2005087489A1 Carrier foil-attached electrolytic copper foil proviuded with insulation layer forming resin layer, copper-clad laminated sheet, printed circuit board, production method for multilayer copper-clad laminated sheet and production method for printed circuit board
09/22/2005WO2005087480A1 Novel polyimide film and use thereof
09/22/2005WO2005086978A2 Embedded power management control circuit
09/22/2005WO2005086887A2 Improved replaceable led module
09/22/2005WO2005067092B1 Triangular conforming transmission structure
09/22/2005WO2005066392A3 Surface structuring by means of a film
09/22/2005WO2003073805A3 Improved patching methods and apparatus for fabricating memory modules
09/22/2005US20050210420 Design review output apparatus, design review support apparatus, design review system, design review output method, and design review support method
09/22/2005US20050209383 Thermoplastic matrix of polyphenyene sulfide, thermally-conductive, electrically-insulating boron nitride, and reinforcing chopped glass; semiconductors, microprocessors, silicon chips.
09/22/2005US20050209090 Dielectric ceramic composition and multilayer ceramic part using the same
09/22/2005US20050208914 High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
09/22/2005US20050208824 Flat cable and connector as well as electronic device
09/22/2005US20050208794 Electrical connector with different pitch terminals
09/22/2005US20050208792 Bending tool for flexible printed circuit assemblies
09/22/2005US20050208789 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module
09/22/2005US20050208751 Solder bump structure and method for forming a solder bump
09/22/2005US20050208749 Methods for forming electrical connections and resulting devices
09/22/2005US20050208706 Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components
09/22/2005US20050208705 Semiconductor device package and method of production and semiconductor device of same
09/22/2005US20050208300 Multi-component fibers having enhanced reversible thermal properties and methods of manufacturing thereof
09/22/2005US20050208293 Printed circuits; semiconductors
09/22/2005US20050208251 Low cost electrically conductive tapes and films manufactured from conductive loaded resin-based materials
09/22/2005US20050208227 Flexible circuit of a dielectric substrate, and a conductive layer; a conformal coating on a surface of a conjugated polypyrrole polymer, pyrrolidones, and perfluorinated organic compounds
09/22/2005US20050207930 Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board
09/22/2005US20050207156 Flexible light array and fabrication procedure thereof
09/22/2005US20050207134 Cell board interconnection architecture
09/22/2005US20050207133 Embedded power management control circuit
09/22/2005US20050207132 Printed circuit board with electromagnetic interference (EMI) radiation suppressed
09/22/2005US20050207131 Delivery regions for power, ground and I/O signal paths in an IC package
09/22/2005US20050207124 Printed circuit board having larger space for electronic components and contributing to efficient cooling
09/22/2005US20050207114 Method and apparatus for venting an electronic control module
09/22/2005US20050207113 Cooling device capable of reducing thickness of electronic apparatus
09/22/2005US20050207094 Thick-film dielectric and conductive compositions
09/22/2005US20050207091 Intermediate substrate
09/22/2005US20050207054 Recording/playback apparatus with electric wave transmission
09/22/2005US20050206898 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
09/22/2005US20050206779 Imaging apparatus
09/22/2005US20050206603 Image display apparatus using thin-film transistors
09/22/2005US20050206496 High-voltage variable resistor
09/22/2005US20050206470 Lumped-element transmission line in multi-layered substrate
09/22/2005US20050206468 Structure for electromagnetically shielding a substrate
09/22/2005US20050206467 Microstrip line
09/22/2005US20050206400 Integrated circuit characterization printed circuit board
09/22/2005US20050206357 Cooled power switching device
09/22/2005US20050206047 Contoured circuit boards
09/22/2005US20050206011 Circuit module
09/22/2005US20050205997 Device with through-hole interconnection and method for manufacturing the same
09/22/2005US20050205996 Semiconductor apparatus
09/22/2005US20050205994 Signal transmitting device with vias and solder balls
09/22/2005US20050205990 Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
09/22/2005US20050205976 Circuit device and manufacturing method thereof