| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/29/2005 | WO2005090032A1 Process for producing ceramic sheet, ceramic substrate utilizing the same and use thereof |
| 09/29/2005 | WO2005089510A2 Method of forming one or more base structures on an ltcc cofired module |
| 09/29/2005 | WO2005089293A2 Methods and systems for providing lighting systems |
| 09/29/2005 | WO2005089204A2 Maximizing capacitance per unit area while minimizing signal transmission delay in pcb |
| 09/29/2005 | WO2005089076A2 Film type conductive sheet, method for manufacturing the same, and conductive tape using the same |
| 09/29/2005 | WO2005052688A3 Chemically amplified positive photosensitive thermosetting resin composition method of forming cured article and method of producing functional device |
| 09/29/2005 | WO2005046297A3 Measurement standard for testing optical recognition systems in smd assembly and method for producing said standard |
| 09/29/2005 | WO2005020249A3 Fabrication of thick film electrical components |
| 09/29/2005 | WO2004100253A3 Electronic component as well as system support and panel for the production thereof |
| 09/29/2005 | US20050216874 Computer-supported, automated method for the verification of analog circuits |
| 09/29/2005 | US20050215749 Low hydrolytic chlorine; curable, for a material in an electronics. |
| 09/29/2005 | US20050215707 elastomers selected from curable butadiene-divinylbenzene-styrene terpolymers, maleinized butadiene-styrene copolymers, unsaturated polyester and flame retardants, used as prepregs or composites having low dielectric constants |
| 09/29/2005 | US20050215418 Sinterability even when fired at a low temperature of about 900 degrees C. and reduced deterioration of dielectric characteristics |
| 09/29/2005 | US20050215411 Dielectric ceramic material and multilayer ceramic substrate |
| 09/29/2005 | US20050215117 Socket for installing electronic parts |
| 09/29/2005 | US20050215091 Connection system for communication channels and expansion card for electronic apparatus adopting said connection system |
| 09/29/2005 | US20050215086 Sheet-form connector and production method and application therefor |
| 09/29/2005 | US20050215081 Method and apparatus for testing PCBA subcomponents |
| 09/29/2005 | US20050214981 Circuit device and manufacturing method thereof |
| 09/29/2005 | US20050214693 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material |
| 09/29/2005 | US20050214621 Flat panel direct methanol fuel cell and method of making the same |
| 09/29/2005 | US20050214552 Flexible metal foil-polyimide laminate and making method |
| 09/29/2005 | US20050214551 Enhanced adhesion between the intermediate layer and the film by including in the intermediate layer Mo, Cr, Ni, and/or Si dispersed to a depth of 20 nm or less from the surface; and a copper or copper alloy conductive layer formed on the intermediate layer |
| 09/29/2005 | US20050214534 Extended curable compositions for use as binders |
| 09/29/2005 | US20050214526 Transparent, electrically conductive, coated polyester film, process for its production, and its use |
| 09/29/2005 | US20050214518 Circuit board, process for producing the same, and power module |
| 09/29/2005 | US20050214516 Multi-layer ceramic substrate and manufacturing method thereof |
| 09/29/2005 | US20050214508 Supported greensheet structure and method in MLC processing |
| 09/29/2005 | US20050214480 Nano-powder-based coating and ink compositions |
| 09/29/2005 | US20050213933 Electronic equipment combination provided with a recording/playback device |
| 09/29/2005 | US20050213806 System and method for manufacturing printed circuit boards employing non-uniformly modified images |
| 09/29/2005 | US20050213788 Acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure |
| 09/29/2005 | US20050213706 Medical imaging system with dosimetry for estimating circuit board life |
| 09/29/2005 | US20050213309 Printed-circuit board and electronic device |
| 09/29/2005 | US20050213308 Hybrid integrated circuit device |
| 09/29/2005 | US20050213307 Pivoting apparatus with a shielding function |
| 09/29/2005 | US20050213281 Extended thin film capacitor (tfc) |
| 09/29/2005 | US20050212624 Microwave circuit |
| 09/29/2005 | US20050212439 Integrating flex circuitry and rigid flexible circuitry, with high power/high brightness LEDs |
| 09/29/2005 | US20050212140 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 09/29/2005 | US20050212122 Multi-layer fet array and method of fabricating |
| 09/29/2005 | US20050212120 Electronic assembly with integrated IO and power contacts |
| 09/29/2005 | US20050212113 Spaced pads arranged along side surface of circuit substrate, with leads fixed thereto |
| 09/29/2005 | US20050212107 Circuit device and manufacturing method thereof |
| 09/29/2005 | US20050212084 Chip circuit comprising an inductor |
| 09/29/2005 | US20050211990 Flat display device |
| 09/29/2005 | US20050211919 System and method for patterning a flexible substrate in a lithography tool |
| 09/29/2005 | US20050211750 Method of creating solder bar connections on electronic packages |
| 09/29/2005 | US20050211561 plating solutions comprising a mixture of copper sulfate, sulfuric acid, chlorine ions and adjuvants comprising a leveling agent and a brighteners, capable of forming the upper face of via-hole and conductor circuit in the same layer in approximately the same plane at the time of manufacturing circuits |
| 09/29/2005 | US20050211466 Measuring device |
| 09/29/2005 | US20050211465 Electronic parts packaging structure and method of manufacturing the same |
| 09/29/2005 | US20050211461 Flat cable conductor, method of making the same and flat cable using the same |
| 09/29/2005 | US20050210666 Substrate holding method and method of manufacturing electronic part |
| 09/29/2005 | DE202005010867U1 Soldered joint`s shape and height manipulating body, has laser holes that are annealed vertically into silicone elastomer band, where solder joints are coated by body to determine shape and height of joints which can be controlled |
| 09/29/2005 | DE19630794B4 Temperaturmeßvorrichtung Temperature measuring |
| 09/29/2005 | DE19602832B4 Kontaktelement zum Durchkontaktieren einer Leiterplatte Contact element for contacting a printed circuit board |
| 09/29/2005 | DE10351720B4 Prüfnormal zum Prüfen von in der SMD-Montage eingesetzten optischen Erkennungssystemen und Verfahren zum Herstellen desselben Test standard for testing thereof used in the surface mounting optical recognition systems and methods for preparing |
| 09/29/2005 | DE102004012231A1 Metal-ceramic substrate for electronics switches or modules comprises a ceramic layer containing aluminum oxide, zirconium oxide and yttrium oxide with a copper foil or layer formed on both sides |
| 09/29/2005 | DE102004010614A1 Basishalbleiterbauteil für einen Halbleiterbeuteilstapel und Verfahren zur Herstellung desselben Based semiconductor device for a Halbleiterbeuteilstapel and method of manufacturing the same |
| 09/29/2005 | DE102004009567A1 Wiring carrier for accommodating chip, is divided into function unit, such that bending rigidity of cross board and side band portion is increased |
| 09/29/2005 | DE102004005586B3 Halbleiterbauteil mit einem Halbleiterchipstapel auf einer Umverdrahtungsplatte und Herstellung desselben Of the same semiconductor device with a semiconductor chip stack on a rewiring and manufacturing |
| 09/29/2005 | DE10044183B4 Leiterplattenverbinder mit einer Rippe zum Halten der Anschlüsse PCB connector with a rib for holding the connections |
| 09/28/2005 | EP1581037A2 Method of manufacturing a sealed electronic module |
| 09/28/2005 | EP1581036A2 Method of manufacturing a sealed electronic module |
| 09/28/2005 | EP1581035A2 Multilayer ceramic substrate and its production method |
| 09/28/2005 | EP1581032A1 Electronic part and manufacturing method thereof |
| 09/28/2005 | EP1580595A2 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material |
| 09/28/2005 | EP1580235A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate |
| 09/28/2005 | EP1579746A1 Mounting capacitors under ball grid array |
| 09/28/2005 | EP1579745A2 Layered structure with electric leads for a body worn device |
| 09/28/2005 | EP1579503A2 Semiconductor device power interconnect striping |
| 09/28/2005 | EP1579477A2 Components, methods and assemblies for multi-chip packages |
| 09/28/2005 | EP1579465A2 High power variable slide rf tuner |
| 09/28/2005 | EP1579204A1 Manufacture of electrochemical sensors by moveable flat screen printing |
| 09/28/2005 | EP1578612A2 Ink composition for use in a continuous web process for the manufacture of electrochemical sensors |
| 09/28/2005 | EP1578543A2 A method for forming ceramic film capacitors |
| 09/28/2005 | EP1440493B1 Bending a tab flex circuit via cantilevered leads |
| 09/28/2005 | EP0890197B1 Bidirectional non-solid impedance controlled reference plane |
| 09/28/2005 | EP0886894B1 Contact carriers for populating substrates with spring contacts |
| 09/28/2005 | CN2730078Y Compound multi-layer flexible circuit board structure |
| 09/28/2005 | CN2730077Y Fixed mount for printed circuit board |
| 09/28/2005 | CN2729914Y Fuel cell with series/parallel mechanism |
| 09/28/2005 | CN2729717Y Investigating module set for electronic component |
| 09/28/2005 | CN1675967A An electronic product, a body and a method of manufacturing |
| 09/28/2005 | CN1675760A 多层印刷线路板 Multilayer printed circuit boards |
| 09/28/2005 | CN1675411A Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 09/28/2005 | CN1675288A Novel polyimide copolymer and metal laminate comprising the same |
| 09/28/2005 | CN1675137A Use of zeolites in preparing low temperature ceramics |
| 09/28/2005 | CN1674777A Substrate holding method and method of manufacturing electronic part |
| 09/28/2005 | CN1674770A Board through-hole working method |
| 09/28/2005 | CN1674768A Double-side butt pasting method for ball grid array device and printed-wiring board |
| 09/28/2005 | CN1674764A Printed circuit substrate integrated overload protector |
| 09/28/2005 | CN1674762A Wiring substrate and producing method thereof |
| 09/28/2005 | CN1674761A Thick-film dielectric and conductive compositions |
| 09/28/2005 | CN1674760A Circuit board and method for manufacturing the same |
| 09/28/2005 | CN1674759A Method for producing wiring board |
| 09/28/2005 | CN1674758A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 09/28/2005 | CN1674281A Hybrid integrated circuit device |
| 09/28/2005 | CN1674278A 电路装置 Circuit means |
| 09/28/2005 | CN1674269A Interlayer member used for producing multi-layer wiring board and method of producing the same |